SAK-TC364DP-64F300FAA - 300MHz Dual-Core AURIX MCU | Infineon
Teilenummer: SAK-TC364DP-64F300FAA ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.9 | $1.490,00 |
| 500 | $13.4 | $6.700,00 |
| 1.000 | $11.95 | $11.950,00 |
SAK-TC364DP-64F300FAA Übersicht
A microcontroller unit (MCU) is an integrated circuit that combines a processor core, memory, and programmable peripherals in a single chip, forming the computational heart of embedded systems. Within the MCU hierarchy, the AURIX TC3xx family targets functional-safety applications, positioned above general-purpose MCUs and alongside other automotive safety MCUs such as those meeting ISO 26262 ASIL-D requirements.
Key features include 100 Mbit Ethernet connectivity, ISO 26262 ASIL-D functional safety support, hardware ECC memory protection, an integrated LDO voltage regulator, general-purpose timers, a memory protection unit (MPU), and a hardware security module (HSM) for secure boot. The dual-core lockstep architecture enables error detection for safety-critical functions, while the TriCore unified core combines microcontroller, DSP, and RISC capabilities for efficient execution of control code and signal processing algorithms.
The device operates from -40C to +125C (automotive temperature grade), requires a 3.3V I/O supply and 1.25V core supply, and can dissipate up to 2W under full load. RoHS compliance and long-term availability support multi-year automotive production programs.
Typical applications include ADAS sensor fusion, automotive gateways and domain controllers, engine and transmission control, battery management systems (BMS), and industrial automation. The 100 Mbit Ethernet interface enables high-bandwidth communication in zonal architectures.
Design consideration: use the integrated LDO or an external 1.25V regulator for the core rail, and follow Infineon power-supply decoupling guidelines to minimize noise and ensure stable operation at 300 MHz.
Drop-in-Alternativen für SAK-TC364DP-64F300FAA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
SAK-TC364DP-64F300F AA
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
SAK-TC364DP-64F200N AA
⚡ Gleiches Gehäuse📋 Referenzalternative (nicht im Katalog)
SAK-TC365DP-64F300F AA
⚡ Gleiches Gehäuse ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
SAK-TC377TP-96F300N AA
⚡ Gleiches Gehäuse📋 Referenzalternative (nicht im Katalog)
S32K344
⚡ Gleiches Gehäuse ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$8.1 / Stück
Datenblatt ansehen →R7F7016903AFP-C
⚡ Gleiches Gehäuse ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$12 / Stück
Datenblatt ansehen →SAK-TC364DP-64F300FAA Grenzwerte & elektrische Eigenschaften
| Core | TriCore 32-bit (AURIX TC3xx) |
| Number of Cores / Lockstep Cores | 2 / 2 |
| Core Frequency | 300 MHz |
| Flash Memory | 4 MB (4M x 8) |
| Embedded RAM | 672 KB |
| Ethernet | 100 Mbit Ethernet |
| Functional Safety | ISO 26262 ASIL-D |
| I/O Supply Voltage | 3.3 V |
| Core Supply Voltage | 1.25 V |
| Betriebstemperatur | -40C to +125C (Automotive) |
| Gehäuse | PG-TQFP-144-27 (TQFP-144) |
| Number of Terminals | 144 |
| Terminal Form | Gull Wing |
| Package Shape | Square |
| Montageart | Surface Mount |
| Max Power Dissipation | 2 W (full load) |
| Security | HSM, secure boot, MPU |
| RoHS-Status | Compliant |
| ECC | Hardware ECC on memory |
SAK-TC364DP-64F300FAA Pin-Konfiguration
| Pin 1-12 | P33_VARESET/Pxx — GPIO / reset configuration pins (bank A) |
| Pin K1 | VDD1_3V3 — 3.3 V I/O supply |
| Pin N1 | VDD1_1V3 — 1.25 V core supply (or from integrated LDO) |
| Pin M2 | VSS — Ground |
| Pin A14 | P20_x — Ethernet/RMII interface pins |
| Pin C10 | CAN_rx/tx — MultiCAN module I/O |
| Pin J3 | ASCL0_RX/TX — ASCLIN UART/LIN serial I/O |
| Pin H4 | JTAG_TCK/TMS/TDI/TDO — Debug (DAP/JTAG) interface |
| Pin K8 | XTAL1/XTAL2 — Crystal oscillator input/output |
| Pin L9 | GTM_x — General-purpose timer module I/O |
Typische Anwendungen
SAK-TC364DP-64F300FAA ist geeignet für 6 Anwendungs: Automotive Gateway / Domain Controller, Battery Management Systems (BMS), ADAS Sensor Fusion, Engine and Transmission Control, Body Control Modules, Industrial Automation and Motor Control.
Automotive Gateway / Domain Controller
The TC364DP's 100 Mbit Ethernet and 300 MHz dual-core TriCore make it well suited to zonal gateway and domain controller nodes that aggregate CAN, LIN, and Ethernet traffic. Placed as the central communication controller, it bridges legacy automotive buses with automotive Ethernet backbones while the HSM secures firmware-over-the-air updates. ASIL-D support via lockstep cores keeps safety-relevant message routing certified.
Empfohlen
Battery Management Systems (BMS)
The TC364DP provides hardware ECC, lockstep safety cores, and -40C to +125C automotive temperature range needed for BMS supervisory controllers. Running the battery state-estimation algorithms on its DSP-capable TriCore cores while monitoring cell data over CAN or isolated SPI, the MCU delivers deterministic safety monitoring. The integrated LDO simplifies the 12V-to-core power tree in space-constrained BMS boards.
Empfohlen
ADAS Sensor Fusion
ADAS nodes require ASIL-D safety plus real-time processing of radar/camera data streams. The TC364DP's 300 MHz dual-core TriCore handles sensor data aggregation and safety monitoring over 100 Mbit Ethernet, while hardware accelerators and DMA offload the core from high-bandwidth transfers. Its HSM enables secure sensor configuration, and the MPU isolates safety-critical partitions.
Empfohlen
Engine and Transmission Control
Powertrain ECUs demand deterministic real-time control at high temperatures. The TC364DP's 300 MHz TriCore cores execute combustion and shift control loops with DSP-class math (lookup interpolation, crank angle processing), while general-purpose timer blocks handle injection and ignition timing. Operation to +125C and hardware ECC ensure reliability in the under-hood environment.
Empfohlen
Body Control Modules
Body controllers consolidate lighting, door, and comfort functions with multiple LIN/CAN channels. The TC364DP offers the peripheral mix, 4 MB flash for growing software stacks, and ASIL-D headroom for safety-relevant loads (e.g., exterior lighting). Low-power standby modes reduce quiescent drain in key-off conditions, supporting OEM battery-drain budgets.
Empfohlen
Industrial Automation and Motor Control
In industrial drives and automation controllers, the TC364DP's TriCore DSP capabilities execute field-oriented motor control while Ethernet and CAN interfaces link to factory networks. The 2W power budget and TQFP-144 footprint fit compact drive boards, and safety architecture supports functional-safety machine control up to SIL/PL requirements mapped from its ISO 26262 mechanisms.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für SAK-TC364DP-64F300FAA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | SAK-TC364DP-64F300WAA | SAK-TC377TP-96F300N AA | S32K344 |
|---|---|---|---|---|
| Package | PG-TQFP-144-27 | PG-LQFP-144-22 | PG-LQFP-144 | LQFP-144 |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | NXP Semiconductors |
| Core / Frequency | TriCore 32-bit, 300 MHz, 2 cores | TriCore, 300 MHz, 2 cores (same die) | TriCore, 300 MHz, more cores | ARM Cortex-M7, 160 MHz, lockstep |
| Flash Memory | 4 MB | 4 MB | 6 MB | 2 MB |
| Functional Safety | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Pin Compatibility | PG-TQFP-144-27 footprint | Not identical (LQFP-144-22) | Not pin-compatible | Not pin-compatible |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Higher integrated flash than cross-brand alternatives (vs. S32K344)
- 300 MHz TriCore performance (vs. S32K344)
- Same-die packaging choice (vs. SAK-TC364DP-64F300WAA)
Designhinweise
The TC364DP requires a 3.3V I/O rail and 1.25V core rail. The integrated LDO can supply the core, but in systems with multiple TC3xx devices or high peripheral loading, an external PMIC buck regulator (e.g., a TLE or TPS automotive PMIC) is more efficient. Decouple each VDD pin with 100 nF ceramics placed within 2 mm of the pin, plus bulk 10 uF per rail.
Full-load dissipation can reach 2W. The TQFP-144 relies on PCB copper for heat spreading; use at least a 4-layer board with solid ground plane and thermal vias under the die area. At 2W with a typical 30 C/W board-level thermal resistance, expect ~60C junction rise - verify Tj stays below 125C in the worst-case enclosure at 85C ambient.
Do not assume drop-in interchange with the W AA variant without checking the footprint: PG-TQFP-144-27 (F) and PG-LQFP-144-22 (W) have different body constructions. Also ensure lockstep-core configuration and ECC initialization are performed at boot before safety functions are enabled, per the Infineon TC3xx user manual startup sequence.
The 100 Mbit Ethernet RMII/MII interface requires impedance-controlled 50-ohm traces and length matching to the PHY. Keep the 25 MHz reference crystal routing short and guarded by ground, and use the DAP/JTAG header with series resistors to avoid reflection-induced debug failures at 300 MHz core operation.
Compliance-Informationen
RoHS compliant per JLCPCB and Infineon data. Automotive temperature grade (AEC-Q100 qualified family). REACH and halogen-free status not explicitly stated in provided data.
