SAK-TC364DP-64F300FAA - 300MHz Dual-Core AURIX MCU | Infineon
Référence : SAK-TC364DP-64F300FAA ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $18.5 | $18,50 |
| 10 | $16.8 | $168,00 |
| 100 | $14.9 | $1 490,00 |
| 500 | $13.4 | $6 700,00 |
| 1 000 | $11.95 | $11 950,00 |
SAK-TC364DP-64F300FAA Présentation
A microcontroller unit (MCU) is an integrated circuit that combines a processor core, memory, and programmable peripherals in a single chip, forming the computational heart of embedded systems. Within the MCU hierarchy, the AURIX TC3xx family targets functional-safety applications, positioned above general-purpose MCUs and alongside other automotive safety MCUs such as those meeting ISO 26262 ASIL-D requirements.
Key features include 100 Mbit Ethernet connectivity, ISO 26262 ASIL-D functional safety support, hardware ECC memory protection, an integrated LDO voltage regulator, general-purpose timers, a memory protection unit (MPU), and a hardware security module (HSM) for secure boot. The dual-core lockstep architecture enables error detection for safety-critical functions, while the TriCore unified core combines microcontroller, DSP, and RISC capabilities for efficient execution of control code and signal processing algorithms.
The device operates from -40C to +125C (automotive temperature grade), requires a 3.3V I/O supply and 1.25V core supply, and can dissipate up to 2W under full load. RoHS compliance and long-term availability support multi-year automotive production programs.
Typical applications include ADAS sensor fusion, automotive gateways and domain controllers, engine and transmission control, battery management systems (BMS), and industrial automation. The 100 Mbit Ethernet interface enables high-bandwidth communication in zonal architectures.
Design consideration: use the integrated LDO or an external 1.25V regulator for the core rail, and follow Infineon power-supply decoupling guidelines to minimize noise and ensure stable operation at 300 MHz.
Alternatives de remplacement direct pour SAK-TC364DP-64F300FAA — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
SAK-TC364DP-64F300F AA
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SAK-TC377TP-96F300N AA
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S32K344
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Voir la fiche technique →R7F7016903AFP-C
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Voir la fiche technique →SAK-TC364DP-64F300FAA Valeurs maximales et caractéristiques électriques
| Core | TriCore 32-bit (AURIX TC3xx) |
| Number of Cores / Lockstep Cores | 2 / 2 |
| Core Frequency | 300 MHz |
| Flash Memory | 4 MB (4M x 8) |
| Embedded RAM | 672 KB |
| Ethernet | 100 Mbit Ethernet |
| Functional Safety | ISO 26262 ASIL-D |
| I/O Supply Voltage | 3.3 V |
| Core Supply Voltage | 1.25 V |
| Température de fonctionnement | -40C to +125C (Automotive) |
| Boîtier | PG-TQFP-144-27 (TQFP-144) |
| Number of Terminals | 144 |
| Terminal Form | Gull Wing |
| Package Shape | Square |
| Type de montage | Surface Mount |
| Max Power Dissipation | 2 W (full load) |
| Security | HSM, secure boot, MPU |
| Statut RoHS | Compliant |
| ECC | Hardware ECC on memory |
Configuration des broches de SAK-TC364DP-64F300FAA
| Broche 1-12 | P33_VARESET/Pxx — GPIO / reset configuration pins (bank A) |
| Broche K1 | VDD1_3V3 — 3.3 V I/O supply |
| Broche N1 | VDD1_1V3 — 1.25 V core supply (or from integrated LDO) |
| Broche M2 | VSS — Ground |
| Broche A14 | P20_x — Ethernet/RMII interface pins |
| Broche C10 | CAN_rx/tx — MultiCAN module I/O |
| Broche J3 | ASCL0_RX/TX — ASCLIN UART/LIN serial I/O |
| Broche H4 | JTAG_TCK/TMS/TDI/TDO — Debug (DAP/JTAG) interface |
| Broche K8 | XTAL1/XTAL2 — Crystal oscillator input/output |
| Broche L9 | GTM_x — General-purpose timer module I/O |
Applications typiques
SAK-TC364DP-64F300FAA convient pour 6 applications: Automotive Gateway / Domain Controller, Battery Management Systems (BMS), ADAS Sensor Fusion, Engine and Transmission Control, Body Control Modules, Industrial Automation and Motor Control.
Automotive Gateway / Domain Controller
The TC364DP's 100 Mbit Ethernet and 300 MHz dual-core TriCore make it well suited to zonal gateway and domain controller nodes that aggregate CAN, LIN, and Ethernet traffic. Placed as the central communication controller, it bridges legacy automotive buses with automotive Ethernet backbones while the HSM secures firmware-over-the-air updates. ASIL-D support via lockstep cores keeps safety-relevant message routing certified.
Recommandé
Battery Management Systems (BMS)
The TC364DP provides hardware ECC, lockstep safety cores, and -40C to +125C automotive temperature range needed for BMS supervisory controllers. Running the battery state-estimation algorithms on its DSP-capable TriCore cores while monitoring cell data over CAN or isolated SPI, the MCU delivers deterministic safety monitoring. The integrated LDO simplifies the 12V-to-core power tree in space-constrained BMS boards.
Recommandé
ADAS Sensor Fusion
ADAS nodes require ASIL-D safety plus real-time processing of radar/camera data streams. The TC364DP's 300 MHz dual-core TriCore handles sensor data aggregation and safety monitoring over 100 Mbit Ethernet, while hardware accelerators and DMA offload the core from high-bandwidth transfers. Its HSM enables secure sensor configuration, and the MPU isolates safety-critical partitions.
Recommandé
Engine and Transmission Control
Powertrain ECUs demand deterministic real-time control at high temperatures. The TC364DP's 300 MHz TriCore cores execute combustion and shift control loops with DSP-class math (lookup interpolation, crank angle processing), while general-purpose timer blocks handle injection and ignition timing. Operation to +125C and hardware ECC ensure reliability in the under-hood environment.
Recommandé
Body Control Modules
Body controllers consolidate lighting, door, and comfort functions with multiple LIN/CAN channels. The TC364DP offers the peripheral mix, 4 MB flash for growing software stacks, and ASIL-D headroom for safety-relevant loads (e.g., exterior lighting). Low-power standby modes reduce quiescent drain in key-off conditions, supporting OEM battery-drain budgets.
Recommandé
Industrial Automation and Motor Control
In industrial drives and automation controllers, the TC364DP's TriCore DSP capabilities execute field-oriented motor control while Ethernet and CAN interfaces link to factory networks. The 2W power budget and TQFP-144 footprint fit compact drive boards, and safety architecture supports functional-safety machine control up to SIL/PL requirements mapped from its ISO 26262 mechanisms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour SAK-TC364DP-64F300FAA — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | SAK-TC364DP-64F300WAA | SAK-TC377TP-96F300N AA | S32K344 |
|---|---|---|---|---|
| Package | PG-TQFP-144-27 | PG-LQFP-144-22 | PG-LQFP-144 | LQFP-144 |
| Brand | Infineon Technologies | Infineon Technologies | Infineon Technologies | NXP Semiconductors |
| Core / Frequency | TriCore 32-bit, 300 MHz, 2 cores | TriCore, 300 MHz, 2 cores (same die) | TriCore, 300 MHz, more cores | ARM Cortex-M7, 160 MHz, lockstep |
| Flash Memory | 4 MB | 4 MB | 6 MB | 2 MB |
| Functional Safety | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D | ISO 26262 ASIL-D |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Pin Compatibility | PG-TQFP-144-27 footprint | Not identical (LQFP-144-22) | Not pin-compatible | Not pin-compatible |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Higher integrated flash than cross-brand alternatives (vs S32K344)
- 300 MHz TriCore performance (vs S32K344)
- Same-die packaging choice (vs SAK-TC364DP-64F300WAA)
Notes de conception
The TC364DP requires a 3.3V I/O rail and 1.25V core rail. The integrated LDO can supply the core, but in systems with multiple TC3xx devices or high peripheral loading, an external PMIC buck regulator (e.g., a TLE or TPS automotive PMIC) is more efficient. Decouple each VDD pin with 100 nF ceramics placed within 2 mm of the pin, plus bulk 10 uF per rail.
Full-load dissipation can reach 2W. The TQFP-144 relies on PCB copper for heat spreading; use at least a 4-layer board with solid ground plane and thermal vias under the die area. At 2W with a typical 30 C/W board-level thermal resistance, expect ~60C junction rise - verify Tj stays below 125C in the worst-case enclosure at 85C ambient.
Do not assume drop-in interchange with the W AA variant without checking the footprint: PG-TQFP-144-27 (F) and PG-LQFP-144-22 (W) have different body constructions. Also ensure lockstep-core configuration and ECC initialization are performed at boot before safety functions are enabled, per the Infineon TC3xx user manual startup sequence.
The 100 Mbit Ethernet RMII/MII interface requires impedance-controlled 50-ohm traces and length matching to the PHY. Keep the 25 MHz reference crystal routing short and guarded by ground, and use the DAP/JTAG header with series resistors to avoid reflection-induced debug failures at 300 MHz core operation.
Informations de conformité
RoHS compliant per JLCPCB and Infineon data. Automotive temperature grade (AEC-Q100 qualified family). REACH and halogen-free status not explicitly stated in provided data.
