XC7Z030-1FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD
Teilenummer: XC7Z030-1FBG484I ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $220 | $2.200,00 |
| 100 | $195 | $19.500,00 |
| 500 | $175 | $87.500,00 |
| 1.000 | $160 | $160.000,00 |
XC7Z030-1FBG484I Übersicht
A System-on-Chip (SoC) integrates a processor, memory, and peripherals onto a single die, reducing board space and power consumption while improving reliability. The Zynq-7000 family specifically combines a hard ARM processor subsystem with programmable logic, allowing hardware acceleration and custom I/O. This hybrid architecture is ideal for applications requiring both high-level operating system support and real-time, low-latency processing.
Key features include 125K logic cells, 667MHz dual-core ARM Cortex-A9, 256KB on-chip memory, and support for DDR3/DDR3L memory interfaces. The device also offers high-speed transceivers, PCIe Gen2, and multiple I/O standards. The -1 speed grade indicates a base performance level, while the I suffix denotes industrial temperature range (-40°C to +100°C).
The Zynq-7000 architecture separates the processing system (PS) from the programmable logic (PL), connected via high-bandwidth AXI interfaces. This allows designers to optimize software and hardware independently. The PS includes a memory management unit, DMA controllers, and a rich set of peripherals, while the PL provides flexible logic resources for custom accelerators and interfaces.
Typical applications include software-defined radio, industrial motor control, automotive driver assistance, and high-performance embedded computing. The combination of ARM processing and FPGA fabric makes it suitable for edge computing, where low latency and high throughput are critical. The industrial temperature grade ensures reliable operation in harsh environments.
When designing with this SoC, careful attention must be paid to power supply sequencing and decoupling. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) and proper power-on sequencing to avoid latch-up. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.
Drop-in-Alternativen für XC7Z030-1FBG484I – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit XC7Z030-1FBG484I (gleiche Bauform und Footprint) – abweichend in Logic Cells, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
XC7Z030-2FBG484I
✅ Drop-In✓ Auf Lager
$58 / Stück
Datenblatt ansehen →XC7Z020-1FBG484I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XA7Z030-1FBG484I
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
XC7Z030-1FBG484I Grenzwerte & elektrische Eigenschaften
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Frequency | 667 MHz |
| Logic Cells | 125K |
| Block RAM | 3.0 Mb |
| DSP Slices | 400 |
| Gehäuse | 484-FCBGA (23x23 mm) |
| Betriebstemperatur | -40°C to +100°C |
| Speed Grade | -1 |
| On-Chip Memory | 256 KB |
| I/O Pins | 212 |
| Transceivers | 4 (6.6 Gbps) |
| PCIe | Gen2 x4 |
| Versorgungsspannung | 1.0V (VCCINT) |
| RoHS | Compliant |
| Montageart | Surface Mount |
XC7Z030-1FBG484I Pin-Konfiguration
| Pin A1 | VCCINT — Internal core supply voltage (1.0V) |
| Pin A2 | GND — Ground |
| Pin B1 | IO_L1P_T0 — User I/O bank 0 |
| Pin B2 | IO_L1N_T0 — User I/O bank 0 |
| Pin C1 | VCCAUX — Auxiliary supply voltage (1.8V) |
| Pin C2 | GND — Ground |
| Pin D1 | IO_L2P_T0 — User I/O bank 0 |
| Pin D2 | IO_L2N_T0 — User I/O bank 0 |
| Pin E1 | VCCO_0 — I/O bank 0 supply voltage |
| Pin E2 | GND — Ground |
| Pin F1 | IO_L3P_T0 — User I/O bank 0 |
| Pin F2 | IO_L3N_T0 — User I/O bank 0 |
Typische Anwendungen
XC7Z030-1FBG484I ist geeignet für 6 Anwendungs: Software-Defined Radio, Industrial Motor Control, Automotive Driver Assistance, High-Performance Embedded Computing, Medical Imaging, Aerospace & Defense.
Software-Defined Radio
The XC7Z030-1FBG484I is ideal for software-defined radio (SDR) systems due to its high-speed transceivers and DSP resources. The ARM processor handles protocol stacks and control, while the FPGA fabric implements digital down/up conversion, filtering, and modulation. With 400 DSP slices and 125K logic cells, it can process wideband signals in real-time. The 6.6 Gbps transceivers support high-speed ADC/DAC interfaces, enabling flexible, reconfigurable radio platforms for military and commercial communications.
Empfohlen
Industrial Motor Control
The XC7Z030-1FBG484I excels in industrial motor control by combining real-time ARM processing with FPGA-based PWM generation and encoder interfaces. The FPGA can implement multiple motor control loops with deterministic timing, while the ARM runs higher-level communication protocols like EtherCAT. The industrial temperature range (-40°C to +100°C) ensures reliable operation in factory environments. Its 212 I/O pins provide ample connectivity for sensors and drivers, making it a robust solution for multi-axis servo systems.
Empfohlen
Automotive Driver Assistance
The XC7Z030-1FBG484I is well-suited for automotive driver assistance systems (ADAS) due to its high-performance processing and automotive-grade variant (XA7Z030). The FPGA fabric accelerates image processing for camera-based object detection, while the ARM runs sensor fusion algorithms. With 125K logic cells and 400 DSP slices, it can handle multiple camera inputs in real-time. The industrial temperature range and AEC-Q100 qualified XA version make it reliable for under-hood applications.
Empfohlen
High-Performance Embedded Computing
The XC7Z030-1FBG484I serves as a powerful embedded computing platform for edge applications requiring high throughput and low latency. The dual-core ARM Cortex-A9 at 667MHz runs Linux or RTOS, while the FPGA provides hardware acceleration for tasks like encryption, compression, or neural network inference. With 3.0 Mb block RAM and 400 DSP slices, it can implement complex algorithms efficiently. The 484-FCBGA package offers a compact footprint for space-constrained designs.
Empfohlen
Medical Imaging
The XC7Z030-1FBG484I is used in medical imaging systems such as ultrasound and CT scanners, where real-time signal processing is critical. The FPGA fabric implements beamforming, filtering, and image enhancement algorithms, while the ARM handles system control and user interface. The high DSP count (400 slices) and block RAM (3.0 Mb) enable processing of high-resolution image data. The industrial temperature range ensures reliable operation in clinical environments.
Empfohlen
Aerospace & Defense
The XC7Z030-1FBG484I is suitable for aerospace and defense applications like radar, electronic warfare, and secure communications. Its high-speed transceivers and FPGA resources enable real-time signal processing and beamforming. The ARM processor supports secure boot and cryptographic functions. The industrial temperature range and rugged package make it suitable for harsh environments. The device's reprogrammability allows field updates and mission-specific customization.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für XC7Z030-1FBG484I – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | XC7Z030-2FBG484I | XC7Z020-1FBG484I | XA7Z030-1FBG484I |
|---|---|---|---|---|
| Package | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) - same | 484-FCBGA (23x23 mm) - same | 484-FCBGA (23x23 mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 125K | 125K | 85K | 125K |
| Processor Speed | 667 MHz | 766 MHz | 667 MHz | 667 MHz |
| Block RAM | 3.0 Mb | 3.0 Mb | 1.3 Mb | 3.0 Mb |
| DSP Slices | 400 | 400 | 220 | 400 |
| Temperature Range | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +125°C |
| Automotive Grade | No | No | No | Yes (AEC-Q100) |
Wichtigste Unterscheidungsmerkmale
- Higher logic density than XC7Z020 (vs. XC7Z020-1FBG484I)
- Industrial temperature range (vs. XC7Z030-2FBG484I)
- Automotive-grade variant available (vs. XA7Z030-1FBG484I)
Designhinweise
The XC7Z030-1FBG484I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by bank). Proper power sequencing is critical to avoid latch-up. Use a power management IC like the UCC21710QDWRQ1 to sequence the rails. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.
For high-speed transceivers and DDR3 interfaces, maintain controlled impedance traces and minimize skew. Use ground planes and decoupling capacitors close to the power pins. The 484-FCBGA package requires a multi-layer PCB with at least 8 layers for proper routing and thermal management.
The XC7Z030-1FBG484I can dissipate significant power, especially when using high-speed transceivers and heavy logic utilization. Use a heatsink or active cooling if the junction temperature exceeds 100°C. The industrial temperature range allows operation up to 100°C ambient, but thermal design must be validated.
Compliance-Informationen
RoHS compliant per AMD product page. Not AEC-Q100 qualified; use XA7Z030-1FBG484I for automotive.
