XC7Z030-1FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD
N.º da peça: XC7Z030-1FBG484I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $220 | $2.200,00 |
| 100 | $195 | $19.500,00 |
| 500 | $175 | $87.500,00 |
| 1.000 | $160 | $160.000,00 |
XC7Z030-1FBG484I Visão geral
A System-on-Chip (SoC) integrates a processor, memory, and peripherals onto a single die, reducing board space and power consumption while improving reliability. The Zynq-7000 family specifically combines a hard ARM processor subsystem with programmable logic, allowing hardware acceleration and custom I/O. This hybrid architecture is ideal for applications requiring both high-level operating system support and real-time, low-latency processing.
Key features include 125K logic cells, 667MHz dual-core ARM Cortex-A9, 256KB on-chip memory, and support for DDR3/DDR3L memory interfaces. The device also offers high-speed transceivers, PCIe Gen2, and multiple I/O standards. The -1 speed grade indicates a base performance level, while the I suffix denotes industrial temperature range (-40°C to +100°C).
The Zynq-7000 architecture separates the processing system (PS) from the programmable logic (PL), connected via high-bandwidth AXI interfaces. This allows designers to optimize software and hardware independently. The PS includes a memory management unit, DMA controllers, and a rich set of peripherals, while the PL provides flexible logic resources for custom accelerators and interfaces.
Typical applications include software-defined radio, industrial motor control, automotive driver assistance, and high-performance embedded computing. The combination of ARM processing and FPGA fabric makes it suitable for edge computing, where low latency and high throughput are critical. The industrial temperature grade ensures reliable operation in harsh environments.
When designing with this SoC, careful attention must be paid to power supply sequencing and decoupling. The device requires multiple voltage rails (VCCINT, VCCAUX, VCCO) and proper power-on sequencing to avoid latch-up. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.
Alternativas drop-in para XC7Z030-1FBG484I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com XC7Z030-1FBG484I (mesmo formato e footprint) — diferindo em Logic Cells, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
XC7Z030-2FBG484I
✅ Drop-In✓ Em estoque
$58 / unidade
Ver ficha técnica →XC7Z020-1FBG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XA7Z030-1FBG484I
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
XC7Z030-1FBG484I Classificações máximas e características elétricas
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Frequency | 667 MHz |
| Logic Cells | 125K |
| Block RAM | 3.0 Mb |
| DSP Slices | 400 |
| Encapsulamento | 484-FCBGA (23x23 mm) |
| Temperatura de operação | -40°C to +100°C |
| Speed Grade | -1 |
| On-Chip Memory | 256 KB |
| I/O Pins | 212 |
| Transceivers | 4 (6.6 Gbps) |
| PCIe | Gen2 x4 |
| Tensão de alimentação | 1.0V (VCCINT) |
| RoHS | Compliant |
| Tipo de montagem | Surface Mount |
Configuração de pinos do XC7Z030-1FBG484I
| Pino A1 | VCCINT — Internal core supply voltage (1.0V) |
| Pino A2 | GND — Ground |
| Pino B1 | IO_L1P_T0 — User I/O bank 0 |
| Pino B2 | IO_L1N_T0 — User I/O bank 0 |
| Pino C1 | VCCAUX — Auxiliary supply voltage (1.8V) |
| Pino C2 | GND — Ground |
| Pino D1 | IO_L2P_T0 — User I/O bank 0 |
| Pino D2 | IO_L2N_T0 — User I/O bank 0 |
| Pino E1 | VCCO_0 — I/O bank 0 supply voltage |
| Pino E2 | GND — Ground |
| Pino F1 | IO_L3P_T0 — User I/O bank 0 |
| Pino F2 | IO_L3N_T0 — User I/O bank 0 |
Aplicações típicas
XC7Z030-1FBG484I é adequado para 6 aplicaçãos: Software-Defined Radio, Industrial Motor Control, Automotive Driver Assistance, High-Performance Embedded Computing, Medical Imaging, Aerospace & Defense.
Software-Defined Radio
The XC7Z030-1FBG484I is ideal for software-defined radio (SDR) systems due to its high-speed transceivers and DSP resources. The ARM processor handles protocol stacks and control, while the FPGA fabric implements digital down/up conversion, filtering, and modulation. With 400 DSP slices and 125K logic cells, it can process wideband signals in real-time. The 6.6 Gbps transceivers support high-speed ADC/DAC interfaces, enabling flexible, reconfigurable radio platforms for military and commercial communications.
Recomendado
Industrial Motor Control
The XC7Z030-1FBG484I excels in industrial motor control by combining real-time ARM processing with FPGA-based PWM generation and encoder interfaces. The FPGA can implement multiple motor control loops with deterministic timing, while the ARM runs higher-level communication protocols like EtherCAT. The industrial temperature range (-40°C to +100°C) ensures reliable operation in factory environments. Its 212 I/O pins provide ample connectivity for sensors and drivers, making it a robust solution for multi-axis servo systems.
Recomendado
Automotive Driver Assistance
The XC7Z030-1FBG484I is well-suited for automotive driver assistance systems (ADAS) due to its high-performance processing and automotive-grade variant (XA7Z030). The FPGA fabric accelerates image processing for camera-based object detection, while the ARM runs sensor fusion algorithms. With 125K logic cells and 400 DSP slices, it can handle multiple camera inputs in real-time. The industrial temperature range and AEC-Q100 qualified XA version make it reliable for under-hood applications.
Recomendado
High-Performance Embedded Computing
The XC7Z030-1FBG484I serves as a powerful embedded computing platform for edge applications requiring high throughput and low latency. The dual-core ARM Cortex-A9 at 667MHz runs Linux or RTOS, while the FPGA provides hardware acceleration for tasks like encryption, compression, or neural network inference. With 3.0 Mb block RAM and 400 DSP slices, it can implement complex algorithms efficiently. The 484-FCBGA package offers a compact footprint for space-constrained designs.
Recomendado
Medical Imaging
The XC7Z030-1FBG484I is used in medical imaging systems such as ultrasound and CT scanners, where real-time signal processing is critical. The FPGA fabric implements beamforming, filtering, and image enhancement algorithms, while the ARM handles system control and user interface. The high DSP count (400 slices) and block RAM (3.0 Mb) enable processing of high-resolution image data. The industrial temperature range ensures reliable operation in clinical environments.
Recomendado
Aerospace & Defense
The XC7Z030-1FBG484I is suitable for aerospace and defense applications like radar, electronic warfare, and secure communications. Its high-speed transceivers and FPGA resources enable real-time signal processing and beamforming. The ARM processor supports secure boot and cryptographic functions. The industrial temperature range and rugged package make it suitable for harsh environments. The device's reprogrammability allows field updates and mission-specific customization.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para XC7Z030-1FBG484I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | XC7Z030-2FBG484I | XC7Z020-1FBG484I | XA7Z030-1FBG484I |
|---|---|---|---|---|
| Package | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) - same | 484-FCBGA (23x23 mm) - same | 484-FCBGA (23x23 mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 125K | 125K | 85K | 125K |
| Processor Speed | 667 MHz | 766 MHz | 667 MHz | 667 MHz |
| Block RAM | 3.0 Mb | 3.0 Mb | 1.3 Mb | 3.0 Mb |
| DSP Slices | 400 | 400 | 220 | 400 |
| Temperature Range | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +125°C |
| Automotive Grade | No | No | No | Yes (AEC-Q100) |
Principais diferenciais
- Higher logic density than XC7Z020 (vs XC7Z020-1FBG484I)
- Industrial temperature range (vs XC7Z030-2FBG484I)
- Automotive-grade variant available (vs XA7Z030-1FBG484I)
Notas de projeto
The XC7Z030-1FBG484I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by bank). Proper power sequencing is critical to avoid latch-up. Use a power management IC like the UCC21710QDWRQ1 to sequence the rails. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.
For high-speed transceivers and DDR3 interfaces, maintain controlled impedance traces and minimize skew. Use ground planes and decoupling capacitors close to the power pins. The 484-FCBGA package requires a multi-layer PCB with at least 8 layers for proper routing and thermal management.
The XC7Z030-1FBG484I can dissipate significant power, especially when using high-speed transceivers and heavy logic utilization. Use a heatsink or active cooling if the junction temperature exceeds 100°C. The industrial temperature range allows operation up to 100°C ambient, but thermal design must be validated.
Informações de conformidade
RoHS compliant per AMD product page. Not AEC-Q100 qualified; use XA7Z030-1FBG484I for automotive.
