XC7Z030-2FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD
MPN: XC7Z030-2FBG484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $82.5 | $82.50 |
| 10 | $78 | $780.00 |
| 100 | $72 | $7,200.00 |
| 500 | $65 | $32,500.00 |
| 1,000 | $58 | $58,000.00 |
Drop-in alternatives for XC7Z030-2FBG484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
XC7Z030-1FBG484I
β Drop-Inβ In Stock
$160 / Unit
View Datasheet βXC7Z035-2FBG484I
β Drop-Inπ Reference alternative (not in catalog)
XC7Z030-1FBG484C
β Drop-Inπ Reference alternative (not in catalog)
XC7Z020-2CLG484I
β Drop-Inβ In Stock
$38 / Unit
View Datasheet βXC7Z045-2FBG484I
β Drop-Inπ Reference alternative (not in catalog)
XC7Z030-2FBG484I Maximum Ratings & Electrical Characteristics
| Family | Zynq-7000 |
| Core Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Number of Cores | 2 |
| Primary Clock Speed | 800 MHz |
| Logic Cells | 125000 |
| Package | 484-FCBGA (23x23) |
| Operating Temperature | -40Β°C to +100Β°C |
| I/O Voltage | 1.2V to 3.3V |
| Process Technology | 28nm |
| On-Chip Memory | 256 KB |
| Mounting Type | Surface Mount |
| Number of I/O | [DATA_NEEDED: Number of I/O] |
| RoHS Status | Compliant |
| REACH Status | Compliant |
| Lifecycle Status | Active |
XC7Z030-2FBG484I Pin Configuration
| Pin A1 | IO_L1P_T0 β User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 β User I/O bank 0, differential pair N |
| Pin B1 | VCCINT β Internal core voltage 1.0V |
| Pin B2 | GND β Ground |
| Pin C1 | IO_L2P_T0 β User I/O bank 0, differential pair P |
| Pin C2 | IO_L2N_T0 β User I/O bank 0, differential pair N |
| Pin D1 | VCCAUX β Auxiliary voltage 1.8V |
| Pin D2 | GND β Ground |
| Pin E1 | IO_L3P_T0 β User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 β User I/O bank 0, differential pair N |
| Pin F1 | VCCIO_0 β I/O bank 0 voltage supply |
| Pin F2 | GND β Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7Z030-2FBG484I is suitable for 6 applications: Software-Defined Radio, Industrial Motor Control, Medical Imaging, Automotive Driver Assistance, Video and Network Processing, Aerospace and Defense.
Software-Defined Radio
The XC7Z030-2FBG484I is ideal for software-defined radio (SDR) systems. Its 125K logic cells can implement high-speed digital down/up converters, filters, and FFT engines, while the dual-core ARM Cortex-A9 at 800 MHz handles protocol stacks and control. The device's high-speed transceivers support wideband signal capture and generation. This SoC enables a compact, low-power SDR platform that can be reconfigured in the field, making it suitable for military communications, amateur radio, and spectrum monitoring applications.
Recommended
Industrial Motor Control
The XC7Z030-2FBG484I excels in industrial motor control applications. The programmable logic can implement high-speed PWM generation, encoder interfaces, and current-loop control with nanosecond-level precision, while the ARM cores run communication protocols like EtherCAT and PROFINET. The device's 28nm process and industrial temperature range (-40Β°C to +100Β°C) ensure reliable operation in harsh factory environments. This SoC enables a single-chip solution for multi-axis servo drives and robotics, reducing system cost and complexity.
Recommended
Medical Imaging
The XC7Z030-2FBG484I is well-suited for medical imaging systems such as ultrasound and CT scanners. The FPGA fabric can accelerate image processing algorithms like beamforming, filtering, and 3D reconstruction, while the ARM cores manage system control and data streaming. The device's high memory bandwidth and DSP capabilities enable real-time processing of high-resolution images. Its industrial temperature range and long-term availability make it a reliable choice for medical equipment manufacturers.
Recommended
Automotive Driver Assistance
The XC7Z030-2FBG484I is used in automotive driver assistance systems (ADAS) for sensor fusion and real-time processing. The programmable logic can implement camera interfaces, image preprocessing, and object detection accelerators, while the ARM cores run high-level algorithms and vehicle communication. The device's 28nm process provides a balance of performance and power efficiency, suitable for in-vehicle use. Although not AEC-Q100 qualified, it is often used in aftermarket and development platforms.
Recommended
Video and Network Processing
The XC7Z030-2FBG484I is ideal for video and network processing applications. Its high-speed transceivers support 10G Ethernet and DisplayPort, while the FPGA fabric can implement video codecs, packet processing, and traffic shaping. The ARM cores handle control plane functions and management interfaces. This SoC enables a single-chip solution for video surveillance servers, network appliances, and broadcast equipment, offering high throughput and low latency.
Recommended
Aerospace and Defense
The XC7Z030-2FBG484I is used in aerospace and defense applications such as radar, electronic warfare, and secure communications. The programmable logic can implement beamforming, pulse compression, and encryption engines, while the ARM cores run mission management software. The device's industrial temperature range and high reliability make it suitable for harsh environments. Its reconfigurability allows for in-field updates and adaptation to evolving threats.
Recommended
Recommended Products Summary
Engineering reference data for XC7Z030-2FBG484I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7Z030-1FBG484I | XC7Z035-2FBG484I | XC7Z030-1FBG484C |
|---|---|---|---|---|
| Package | 484-FCBGA (23x23) | 484-FCBGA (23x23) | 484-FCBGA (23x23) | 484-FCBGA (23x23) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 125000 | 125000 | 275000 | 125000 |
| Max Clock Speed | 800 MHz | 667 MHz | 800 MHz | 667 MHz |
| Operating Temperature | -40Β°C to +100Β°C | -40Β°C to +100Β°C | -40Β°C to +100Β°C | 0Β°C to +85Β°C |
| On-Chip Memory | 256 KB | 256 KB | 256 KB | 256 KB |
| Process Technology | 28nm | 28nm | 28nm | 28nm |
| Price (1pc) | $82.50 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Higher clock speed than -1 grade (vs XC7Z030-1FBG484I)
- Industrial temperature grade (vs XC7Z030-1FBG484C)
- Balanced logic density (vs XC7Z035-2FBG484I)
Design Notes
The XC7Z030-2FBG484I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCIO (1.2V-3.3V). Use dedicated power management ICs or DC-DC converters for each rail. Ensure proper decoupling with 100nF capacitors close to each power pin and bulk capacitors on the board. Follow the power sequencing requirements in the Zynq-7000 TRM (UG585) to avoid damage.
The XC7Z030-2FBG484I can dissipate significant power, especially when using high-speed transceivers and large logic designs. The 484-FCBGA package has a thermal resistance that requires a heatsink or active cooling for high-performance applications. Use thermal vias under the package and a copper pour on the PCB to improve heat dissipation. Monitor junction temperature to stay within the -40Β°C to +100Β°C range.
The 484-FCBGA package requires a multi-layer PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance and minimize trace lengths. Follow the layout guidelines in the Zynq-7000 PCB Design Guide (UG933) for signal integrity. Place the device away from noisy components and use proper grounding techniques.
Compliance Information
RoHS and REACH compliant per distributor data. Not AEC-Q100 qualified for automotive use.