XC7Z030-1FBG484I - Zynq-7000 SoC, 125K Logic Cells | AMD
MPN: XC7Z030-1FBG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $220 | $2,200.00 |
| 100 | $195 | $19,500.00 |
| 500 | $175 | $87,500.00 |
| 1,000 | $160 | $160,000.00 |
Drop-in alternatives for XC7Z030-1FBG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7Z030-2FBG484I
✅ Drop-In✓ In Stock
$58 / Unit
View Datasheet →XC7Z020-1FBG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XA7Z030-1FBG484I
✅ Drop-In📋 Reference alternative (not in catalog)
XC7Z030-1FBG484I Maximum Ratings & Electrical Characteristics
| Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| Processor Frequency | 667 MHz |
| Logic Cells | 125K |
| Block RAM | 3.0 Mb |
| DSP Slices | 400 |
| Package | 484-FCBGA (23x23 mm) |
| Operating Temperature | -40°C to +100°C |
| Speed Grade | -1 |
| On-Chip Memory | 256 KB |
| I/O Pins | 212 |
| Transceivers | 4 (6.6 Gbps) |
| PCIe | Gen2 x4 |
| Supply Voltage | 1.0V (VCCINT) |
| RoHS | Compliant |
| Mounting Type | Surface Mount |
XC7Z030-1FBG484I Pin Configuration
| Pin A1 | VCCINT — Internal core supply voltage (1.0V) |
| Pin A2 | GND — Ground |
| Pin B1 | IO_L1P_T0 — User I/O bank 0 |
| Pin B2 | IO_L1N_T0 — User I/O bank 0 |
| Pin C1 | VCCAUX — Auxiliary supply voltage (1.8V) |
| Pin C2 | GND — Ground |
| Pin D1 | IO_L2P_T0 — User I/O bank 0 |
| Pin D2 | IO_L2N_T0 — User I/O bank 0 |
| Pin E1 | VCCO_0 — I/O bank 0 supply voltage |
| Pin E2 | GND — Ground |
| Pin F1 | IO_L3P_T0 — User I/O bank 0 |
| Pin F2 | IO_L3N_T0 — User I/O bank 0 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7Z030-1FBG484I is suitable for 6 applications: Software-Defined Radio, Industrial Motor Control, Automotive Driver Assistance, High-Performance Embedded Computing, Medical Imaging, Aerospace & Defense.
Software-Defined Radio
The XC7Z030-1FBG484I is ideal for software-defined radio (SDR) systems due to its high-speed transceivers and DSP resources. The ARM processor handles protocol stacks and control, while the FPGA fabric implements digital down/up conversion, filtering, and modulation. With 400 DSP slices and 125K logic cells, it can process wideband signals in real-time. The 6.6 Gbps transceivers support high-speed ADC/DAC interfaces, enabling flexible, reconfigurable radio platforms for military and commercial communications.
Recommended
Industrial Motor Control
The XC7Z030-1FBG484I excels in industrial motor control by combining real-time ARM processing with FPGA-based PWM generation and encoder interfaces. The FPGA can implement multiple motor control loops with deterministic timing, while the ARM runs higher-level communication protocols like EtherCAT. The industrial temperature range (-40°C to +100°C) ensures reliable operation in factory environments. Its 212 I/O pins provide ample connectivity for sensors and drivers, making it a robust solution for multi-axis servo systems.
Recommended
Automotive Driver Assistance
The XC7Z030-1FBG484I is well-suited for automotive driver assistance systems (ADAS) due to its high-performance processing and automotive-grade variant (XA7Z030). The FPGA fabric accelerates image processing for camera-based object detection, while the ARM runs sensor fusion algorithms. With 125K logic cells and 400 DSP slices, it can handle multiple camera inputs in real-time. The industrial temperature range and AEC-Q100 qualified XA version make it reliable for under-hood applications.
Recommended
High-Performance Embedded Computing
The XC7Z030-1FBG484I serves as a powerful embedded computing platform for edge applications requiring high throughput and low latency. The dual-core ARM Cortex-A9 at 667MHz runs Linux or RTOS, while the FPGA provides hardware acceleration for tasks like encryption, compression, or neural network inference. With 3.0 Mb block RAM and 400 DSP slices, it can implement complex algorithms efficiently. The 484-FCBGA package offers a compact footprint for space-constrained designs.
Recommended
Medical Imaging
The XC7Z030-1FBG484I is used in medical imaging systems such as ultrasound and CT scanners, where real-time signal processing is critical. The FPGA fabric implements beamforming, filtering, and image enhancement algorithms, while the ARM handles system control and user interface. The high DSP count (400 slices) and block RAM (3.0 Mb) enable processing of high-resolution image data. The industrial temperature range ensures reliable operation in clinical environments.
Recommended
Aerospace & Defense
The XC7Z030-1FBG484I is suitable for aerospace and defense applications like radar, electronic warfare, and secure communications. Its high-speed transceivers and FPGA resources enable real-time signal processing and beamforming. The ARM processor supports secure boot and cryptographic functions. The industrial temperature range and rugged package make it suitable for harsh environments. The device's reprogrammability allows field updates and mission-specific customization.
Recommended
Recommended Products Summary
Engineering reference data for XC7Z030-1FBG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7Z030-2FBG484I | XC7Z020-1FBG484I | XA7Z030-1FBG484I |
|---|---|---|---|---|
| Package | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) - same | 484-FCBGA (23x23 mm) - same | 484-FCBGA (23x23 mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 125K | 125K | 85K | 125K |
| Processor Speed | 667 MHz | 766 MHz | 667 MHz | 667 MHz |
| Block RAM | 3.0 Mb | 3.0 Mb | 1.3 Mb | 3.0 Mb |
| DSP Slices | 400 | 400 | 220 | 400 |
| Temperature Range | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +125°C |
| Automotive Grade | No | No | No | Yes (AEC-Q100) |
Key Differentiators
- Higher logic density than XC7Z020 (vs XC7Z020-1FBG484I)
- Industrial temperature range (vs XC7Z030-2FBG484I)
- Automotive-grade variant available (vs XA7Z030-1FBG484I)
Design Notes
The XC7Z030-1FBG484I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (varies by bank). Proper power sequencing is critical to avoid latch-up. Use a power management IC like the UCC21710QDWRQ1 to sequence the rails. Refer to the Zynq-7000 TRM (UG585) for detailed power-up requirements.
For high-speed transceivers and DDR3 interfaces, maintain controlled impedance traces and minimize skew. Use ground planes and decoupling capacitors close to the power pins. The 484-FCBGA package requires a multi-layer PCB with at least 8 layers for proper routing and thermal management.
The XC7Z030-1FBG484I can dissipate significant power, especially when using high-speed transceivers and heavy logic utilization. Use a heatsink or active cooling if the junction temperature exceeds 100°C. The industrial temperature range allows operation up to 100°C ambient, but thermal design must be validated.
Compliance Information
RoHS compliant per AMD product page. Not AEC-Q100 qualified; use XA7Z030-1FBG484I for automotive.
