A3PE3000-FG896 - ProASIC3E Flash FPGA 620 I/O | Microchip
N.º de pieza: A3PE3000-FG896 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $189.5 | $189,50 |
| 10 | $176.2 | $1.762,00 |
| 100 | $158.4 | $15.840,00 |
| 500 | $142.1 | $71.050,00 |
| 1.000 | $129.8 | $129.800,00 |
A3PE3000-FG896 Descripción general
A flash-based FPGA is a field-programmable gate array that stores its configuration in on-chip non-volatile flash memory cells rather than in an external configuration ROM, as SRAM FPGAs require. Within the power-management hierarchy of programmable logic, flash FPGAs sit between one-time-programmable antifuse devices and reprogrammable SRAM devices, offering single-chip, instant-on behavior with reprogrammability. The ProASIC3E family extends the ProASIC3 architecture with embedded SRAM and PCIe-ready I/O for system-level integration.
Key features of the A3PE3000-FG896 include non-volatile flash configuration enabling a true single-chip solution with no external boot device, 620 user I/Os supporting a broad range of voltage-referenced and single-ended standards, and embedded memory totaling 516096 bits for FIFOs and dual-port buffering. The VersaTile architecture allows each tile to function as a three-input LUT, a D flip-flop, or a latch with enable, maximizing fabric efficiency.
Technically, the device uses Microchip's third-generation flash switch technology on a 130 nm process. The fabric achieves a typical system clock rate of 231 MHz, and VersaNet global networks distribute low-skew, high-fanout clocks and resets across the die. The 896-ball FBGA provides abundant I/O and power/ground balls for signal-integrity headroom in high-pin-count designs.
Typical applications include industrial automation controllers, communications and networking line cards, medical instrumentation, aerospace/defense subsystems requiring instant-on logic, and test equipment, all of which benefit from the 3M-gate capacity and 620 I/O count.
Designers should note the commercial 0 C to +70 C operating range of this FG896 speed-grade: industrial applications must select the FG896I variant instead. Voltage-referenced I/O standards require one VREF pin per minibank per the ProASIC3E datasheet.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet, as of 2026-09-02.
Alternativas directas para A3PE3000-FG896 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3PE3000-FG896 (mismo factor de forma y huella) — difiere en Family, Package, Configuration Memory, Process Technology, System Gates.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3PE3000-FGG896
✅ Sustitución directa✓ En stock
$340 / unidad
Ver hoja de datos →A3PE3000-FG896I
✅ Sustitución directa✓ En stock
$195 / unidad
Ver hoja de datos →A3PE3000-FGG896I
✅ Sustitución directa✓ En stock
$135.2 / unidad
Ver hoja de datos →A3PE3000L-FG896M
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →A3PE3000L-FGG896M
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →A3PE3000L-FGG896I
✅ Sustitución directa✓ En stock
$139.9 / unidad
Ver hoja de datos →A3PE3000L-FG896I
✅ Sustitución directa✓ En stock
Consulte el precio
Ver hoja de datos →A3PE3000-FG896 Valores máximos y características eléctricas
| Family | ProASIC3E |
| System Gates | 3000000 |
| Number of I/O | 620 |
| Embedded Memory | 516096 bit |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm |
| Core Supply Voltage | 1.5 V |
| Configuration Memory | Flash (non-volatile, reprogrammable) |
| Encapsulado | 896-BGA (FBGA) |
| Estilo de montaje | SMD/SMT |
| Temperatura de funcionamiento | 0 C to +70 C |
| Packaging | Tray |
| Speed Grade | Standard (-) |
| Architecture | VersaTile 3-input LUT / D flip-flop / latch |
| Global Networks | VersaNet low-skew high-fanout networks |
| Estado RoHS | Non-green package (FG prefix; FGG variants are RoHS green) |
Guía de configuración de pines de A3PE3000-FG896 896-bga (fbga)
Configuración de pines para A3PE3000-FG896 (encapsulado 896-bga (fbga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3PE3000-FG896.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3PE3000-FG896 es adecuado para 6 aplicacións: Industrial Automation and Control, Communications and Networking Line Cards, Medical Instrumentation, Test and Measurement Equipment, Aerospace and Defense Subsystems, Embedded System Prototyping and ASIC Emulation.
Industrial Automation and Control
The A3PE3000-FG896 fits industrial automation controllers where its 3M system gates absorb protocol bridging, motion-profile logic, and safety interlocks, while 620 user I/Os interface PLC backplanes, encoders, and field sensors. Its flash configuration gives instant-on logic at power-up, so the controller does not wait for an external boot ROM, an advantage over SRAM FPGAs in factory-floor nodes subject to frequent power cycling. Embedded memory of 516096 bits implements FIFOs between heterogeneous bus domains. For factory environments with wide ambient swings, select the A3PE3000-FG896I industrial variant instead; the commercial-grade FG896 is best for environmentally controlled cabinets. Instant-on behavior also simplifies determinism analysis for cycle-time-critical I/O scanning loops.
Recomendado
Communications and Networking Line Cards
Networking line cards benefit from the A3PE3000-FG896's combination of 231 MHz system performance and 620 I/Os for parallel PHY interfaces, backplane buses, and framing logic. The VersaNet low-skew global networks distribute line-rate clocks across the die with minimal skew, per the ProASIC3E fabric user guide, which matters for source-synchronous parallel data capture. The 516096-bit embedded SRAM buffers packet streams between MAC and switch-core domains. Because configuration is flash-based, cards are live within milliseconds of slot insertion, supporting hot-swap and fast-failover requirements. For thermally dense chassis, the same footprint accepts the low-power A3PE3000L-FG896M drop-in, cutting static dissipation without a PCB respin.
Recomendado
Medical Instrumentation
Diagnostic and laboratory medical instruments use the A3PE3000-FG896 to glue together analog front ends, data converters, and host interfaces. Its instant-on flash fabric means acquisition subsystems are ready as soon as power is applied, shortening instrument boot time for point-of-care devices. The 620 user I/Os drive high-channel-count front ends, while the 3M-gate capacity implements channel-sequencing state machines, digital filtering, and communication stacks simultaneously. Commercial 0 C to +70 C rating suits clinical environments; portable or outdoor telemetry designs should use the industrial A3PE3000-FG896I variant on the same PCB. Embedded FIFO memory between ADC banks and processing blocks avoids external SRAM, reducing BOM count and board area in compact enclosures.
Recomendado
Test and Measurement Equipment
Bench and automated test instruments leverage the A3PE3000-FG896 for pattern generation, timing capture, and bus emulation, exploiting 620 I/Os to drive many channels in parallel from a single device. The 231 MHz fabric timing supports source-synchronous capture of mid-speed parallel buses, while VersaTiles configured as D flip-flops with enable build per-channel timing verniers. Flash configuration removes the configuration-ROM bring-up delay at each instrument power cycle, and the non-volatile fabric retains its image through brownouts common on lab benches. The 516096-bit embedded memory implements deep capture FIFOs. Design teams targeting extended-temperature testers should drop in the pin-compatible A3PE3000-FG896I without changing the PCB footprint.
Recomendado
Aerospace and Defense Subsystems
Flash FPGAs are attractive in avionics and defense electronics because the non-volatile configuration is inherently instant-on and single-chip, and the A3PE3000-FG896 provides 3M gates of mission logic with 620 I/Os for sensor and actuator interfaces. ProASIC3E architecture is deployed in space and defense programs where SRAM configuration-readout concerns push designers toward flash fabric, per Microchip positioning of the family. Ground-based radar, test benches, and manned-platform subsystems within 0 C to +70 C can use this commercial grade; temperature-extended builds should select the A3PE3000L-FG896M drop-in, which keeps the identical 896-ball FBGA footprint while adding extended temperature and reduced static power for convection-cooled enclosures.
Recomendado
Embedded System Prototyping and ASIC Emulation
R&D teams use the A3PE3000-FG896 as a reprogrammable prototyping vehicle: 3M gates accommodate substantial RTL blocks, and 620 I/Os expose wide buses to logic analyzers and FPGA-to-FPGA bridges. Unlike antifuse one-time-programmable devices, the flash fabric is fully reprogrammable in-system, so iterative RTL debugging does not consume new silicon, lowering total cost of ownership per Microchip family positioning. The 516096-bit embedded memory models on-chip RAM or FIFO structures during emulation. Because the same footprint hosts the industrial FG896I and low-power A3PE3000L variants, a validated prototype PCB migrates directly to production builds, including extended-temperature derivatives, without layout revision, protecting schedule when qualification variants are needed.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3PE3000-FG896 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3PE3000-FG896I | A3PE3000-FGG896 | A3PE3000L-FG896M |
|---|---|---|---|---|
| Brand | Microchip Technology (Actel) | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 896-BGA (FBGA) | 896-BGA (FBGA) - same | 896-BGA (FBGA) - same | 896-BGA (FBGA) - same |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 620 | 620 | 620 | 620 |
| Max System Frequency | 231 MHz | 231 MHz | 231 MHz | 231 MHz |
| Operating Temperature | 0 C to +70 C (commercial) | Industrial (-40 C range) | 0 C to +70 C (commercial) | Extended (M suffix) |
| RoHS / Green Package | No (FG standard package) | No (FG standard package) | Yes (G = green) | No (FG standard package) |
| Core Power Characteristic | Standard ProASIC3E (1.5 V core) | Standard ProASIC3E (1.5 V core) | Standard ProASIC3E (1.5 V core) | Low-power A3PE3000L family |
| Configuration | Flash, non-volatile, reprogrammable | Flash, non-volatile | Flash, non-volatile | Flash, non-volatile |
Diferenciadores clave
- Single-chip instant-on flash configuration (frente a SRAM FPGAs (e.g., Spartan-3 class))
- Footprint-identical extended-temperature variants (frente a A3PE3000-FG896I)
- Low-power family option on same footprint (frente a A3PE3000L-FG896M)
Notas de diseño
Estimated: budget the 1.5 V core rail first using Libero SmartPower estimates for your utilization, since flash FPGAs dissipate static power proportional to configured fabric. Bank I/O supplies (VCCI) must match the selected I/O standards per bank; when using voltage-referenced standards, the ProASIC3E datasheet requires one VREF pin assignment per minibank. Decouple each VCCI bank with local ceramics close to the ball via fanout to limit di/dt droop during simultaneous switching on wide parallel buses.
The 896-ball FBGA requires a via-in-pad or dog-bone fanout strategy; verify ball pitch against your fabricator's capability before layout release. Follow the ProASIC3E datasheet package footnote: FG256 and FG484 are footprint-compatible packages, but the FG896 is a distinct footprint - do not assume family-wide footprint interchangeability. Keep configuration and JTAG balls routed away from high-slew I/O to protect flash configuration integrity during reprogramming.
The FG896 (no I suffix) is a commercial-grade part rated 0 C to +70 C; sourcing it for industrial builds is a frequent error - order A3PE3000-FG896I instead, which is the same footprint. The FG prefix is the non-green package; for RoHS/lead-free production lines specify the FGG896. Also confirm speed-grade suffix on purchase orders, since pricing and timing closure results differ across family speed grades.
Información de cumplimiento
Per ProASIC3E datasheet ordering information, the G in the part number indicates RoHS-compliant green packages; this FG896 (no G) is the standard package. The A3PE3000-FGG896 is the RoHS-compliant equivalent.
