EP2AGX260FF35C6 vs EP2AGX260FF35C5N Comparación
Comparación detallada lado a lado de EP2AGX260FF35C6 por Intel y EP2AGX260FF35C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2AGX260FF35C6 - Arria II GX 244K LE FPGA, 612 I/O, FC-FBGA-1152 | Intel (Altera)
EP2AGX260FF35C6 NrndComparación de especificaciones
| Parámetro | EP2AGX260FF35C6 | EP2AGX260FF35C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.795,00 | $1.545,00 |
| Family | Arria II GX | Arria II GX |
| Series | Arria II GX | — |
| Logic Elements | 244,188 | 244,188 |
| Logic Array Blocks (LABs) | 10,260 | 10,260 |
| Embedded Memory Bits | 12,038,144 | — |
| User I/O Pins | 612 | — |
| Number of Pins / Balls | 1152 balls | — |
| Package Type | 1152-BBGA, FCBGA (Flip-Chip FBGA) | — |
| Package Code | BGA1152, 34x34, 40 | — |
| Process Technology | 40 nm | — |
| Core Supply Voltage | 0.9 V | — |
| Speed Grade | C6 | C5 |
| Transceivers | Up to multi-gigabit transceivers supporting PCIe Gen2, Serial RapidIO, Gbps Ethernet | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: 18x18 multiplier count] | — |
| Rango de temperatura de funcionamiento | Commercial (0C to 85C) | — |
| Tipo de montaje | Surface mount (BGA, reflow) | Surface Mount |
| Estado RoHS | Compliant | Lead Free (Compliant per data sheet) |
| Estado del ciclo de vida | Not Recommended for New Designs (NRND) - legacy Intel FPGA family | — |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Embedded Memory (bits) | — | 12,038,144 |
| 18x18 Hardware Multipliers | — | 736 |
| User I/O Count | — | 612 |
| Transceiver Channels | — | 48 |
| Maximum Transceiver Data Rate | — | 3.75 Gbps |
| PLLs | — | 8 (4 fractional, 4 general-purpose) |
| Process Node | — | 40 nm |
| Temperatura de funcionamiento | — | -40C to +85C (Industrial) |
| Encapsulado | — | 1152-FBGA (Flip-Chip BGA), 35x35 mm |
| Tensión de alimentación | — | 0.9 V core (typical) |