EP2AGX260FF35C6 vs EP2AGX260FF35C5N 对比

详细并排对比 EP2AGX260FF35C6 出自 Intel 和 EP2AGX260FF35C5N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP2AGX260FF35C6 EP2AGX260FF35C5N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 不推荐新设计 有效
库存状态 有库存 有库存
单价(USD) $1,795.00 $1,545.00
Family Arria II GX Arria II GX
Series Arria II GX —
Logic Elements 244,188 244,188
Logic Array Blocks (LABs) 10,260 10,260
Embedded Memory Bits 12,038,144 —
User I/O Pins 612 —
Number of Pins / Balls 1152 balls —
Package Type 1152-BBGA, FCBGA (Flip-Chip FBGA) —
Package Code BGA1152, 34x34, 40 —
Process Technology 40 nm —
Core Supply Voltage 0.9 V —
Speed Grade C6 C5
Transceivers Up to multi-gigabit transceivers supporting PCIe Gen2, Serial RapidIO, Gbps Ethernet —
DSP Blocks (18x18 multipliers) [DATA_NEEDED: 18x18 multiplier count] —
工作温度范围 Commercial (0C to 85C) —
安装类型 Surface mount (BGA, reflow) Surface Mount
RoHS 状态 Compliant Lead Free (Compliant per data sheet)
生命周期状态 Not Recommended for New Designs (NRND) - legacy Intel FPGA family —
Device Type — FPGA - Field Programmable Gate Array
Embedded Memory (bits) — 12,038,144
18x18 Hardware Multipliers — 736
User I/O Count — 612
Transceiver Channels — 48
Maximum Transceiver Data Rate — 3.75 Gbps
PLLs — 8 (4 fractional, 4 general-purpose)
Process Node — 40 nm
工作温度 — -40C to +85C (Industrial)
封装 — 1152-FBGA (Flip-Chip BGA), 35x35 mm
电源电压 — 0.9 V core (typical)

数据手册与资源

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