EP2AGX45DF29I3N vs EP2AGX45DF29I3NAD Comparación
Comparación detallada lado a lado de EP2AGX45DF29I3N por Intel y EP2AGX45DF29I3NAD por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2AGX45DF29I3N | EP2AGX45DF29I3NAD |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $215,00 | $285,10 |
| Family | Arria II GX | Arria II GX |
| Series | EP2AGX45 | — |
| Number of Logic Elements | 42,959 | — |
| Number of LABs/CLBs | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| Number of User I/O | 364 | — |
| Temperatura de funcionamiento | -40 C to +100 C (industrial) | — |
| Speed Grade | I3 | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: VCCINT typical value] |
| Transceivers | Up to 8 channels, 3.125 Gbps | Multi-gigabit transceivers integrated |
| Hard PCIe Controller | PCIe Gen1/Gen2 x1/x4 | — |
| Encapsulado | 780-ball FC-FBGA (DF29) | 780-ball FBGA (FineLine BGA) |
| Tipo de montaje | Surface Mount (flip-chip BGA) | Surface Mount |
| Maximum User I/O Frequency | 500 MHz Fmax | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| External Memory Support | DDR2, DDR3, QDRII+, RLDRAM II | — |
| Estado RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded RAM Bits | — | 3,517,440 |
| User I/Os | — | 364 |
| Process Node | — | 40 nm |
| Transceiver Data Rate | — | 600 Mbps to 6.375 Gbps |
| Multipliers (18x18) | — | 156 (typical) |
| Temperature Grade | — | Industrial (I) |