EP2AGX45DF29I3N vs EP2AGX45DF29I3NAD Comparaison
Comparaison détaillée côte à côte de EP2AGX45DF29I3N par Intel et EP2AGX45DF29I3NAD par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2AGX45DF29I3N | EP2AGX45DF29I3NAD |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Dernier achat | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $215,00 | $285,10 |
| Family | Arria II GX | Arria II GX |
| Series | EP2AGX45 | — |
| Number of Logic Elements | 42,959 | — |
| Number of LABs/CLBs | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| Number of User I/O | 364 | — |
| Température de fonctionnement | -40 C to +100 C (industrial) | — |
| Speed Grade | I3 | I3 (industrial, -40C to +100C junction, fastest speed bin in the I grade) |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | [DATA_NEEDED: VCCINT typical value] |
| Transceivers | Up to 8 channels, 3.125 Gbps | Multi-gigabit transceivers integrated |
| Hard PCIe Controller | PCIe Gen1/Gen2 x1/x4 | — |
| Boîtier | 780-ball FC-FBGA (DF29) | 780-ball FBGA (FineLine BGA) |
| Type de montage | Surface Mount (flip-chip BGA) | Surface Mount |
| Maximum User I/O Frequency | 500 MHz Fmax | — |
| Embedded Multipliers | [DATA_NEEDED: 18x18 multiplier count] | — |
| External Memory Support | DDR2, DDR3, QDRII+, RLDRAM II | — |
| Statut RoHS | Compliant | [DATA_NEEDED: rohs status] |
| Logic Elements | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded RAM Bits | — | 3,517,440 |
| User I/Os | — | 364 |
| Process Node | — | 40 nm |
| Transceiver Data Rate | — | 600 Mbps to 6.375 Gbps |
| Multipliers (18x18) | — | 156 (typical) |
| Temperature Grade | — | Industrial (I) |