EP4CGX110DF31I7 vs EP4CGX110DF27I7N Comparación
Comparación detallada lado a lado de EP4CGX110DF31I7 por Intel y EP4CGX110DF27I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX110DF31I7 | EP4CGX110DF27I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $276,34 | $198,00 |
| Series | Cyclone IV GX | Cyclone IV GX |
| Device Logic Elements | 109,424 | — |
| Total Memory Bits | 5,621,760 | — |
| Number of Logic Array Blocks (LABs) | Not specified in provided data [DATA_NEEDED: LAB count] | — |
| Number of I/O | 475 user I/O | — |
| Multipliers (18x18) | 432 | — |
| PLLs | 4 | 4 |
| Transceivers | 8 (up to 3.125 Gbps) | 8 channels, up to 3.125 Gbps |
| M9K Memory Blocks | 270 | — |
| Encapsulado | 896-BGA (FBGA-896), 31 mm | 672-ball FBGA, 1.0 mm pitch |
| Ball Pitch | 0.8 mm | — |
| Speed Grade | -7 | — |
| Temperature Grade | Industrial (-40C to +100C Tj) | — |
| Core Voltage | 1.2 V typical | 1.2 V |
| Configuration Method | SRAM (EPCS or JTAG) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] | — |
| Estado RoHS | Compliant | Compliant |
| Device Family | — | EP4CGX110 |
| Logic Elements (LEs) | — | 109,424 |
| Logic Array Blocks (LABs) | — | 6,422 |
| Embedded Memory (bits) | — | 5,621,760 |
| Memory Blocks (M9K) | — | 610 |
| Embedded 18x18 Multipliers | — | 280 |
| User I/Os | — | 393 |
| PCIe Hard IP Blocks | — | 4 (Gen1 x1/x2/x4) |
| Temperatura de funcionamiento | — | -40C to +100C (Industrial) |
| Process Node | — | 60 nm |
| Configuration Scheme | — | AS, PS, JTAG, FPP |