EP4CGX110DF31I7 vs EP4CGX110DF27I7N Comparison

Detailed side-by-side comparison of EP4CGX110DF31I7 by Intel and EP4CGX110DF27I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX110DF31I7 EP4CGX110DF27I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $276.34 $198.00
Series Cyclone IV GX Cyclone IV GX
Device Logic Elements 109,424 β€”
Total Memory Bits 5,621,760 β€”
Number of Logic Array Blocks (LABs) Not specified in provided data [DATA_NEEDED: LAB count] β€”
Number of I/O 475 user I/O β€”
Multipliers (18x18) 432 β€”
PLLs 4 4
Transceivers 8 (up to 3.125 Gbps) 8 channels, up to 3.125 Gbps
M9K Memory Blocks 270 β€”
Package 896-BGA (FBGA-896), 31 mm 672-ball FBGA, 1.0 mm pitch
Ball Pitch 0.8 mm β€”
Speed Grade -7 β€”
Temperature Grade Industrial (-40C to +100C Tj) β€”
Core Voltage 1.2 V typical 1.2 V
Configuration Method SRAM (EPCS or JTAG) β€”
Mounting Type Surface Mount Surface Mount
MSL Level 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] β€”
RoHS Status Compliant Compliant
Device Family β€” EP4CGX110
Logic Elements (LEs) β€” 109,424
Logic Array Blocks (LABs) β€” 6,422
Embedded Memory (bits) β€” 5,621,760
Memory Blocks (M9K) β€” 610
Embedded 18x18 Multipliers β€” 280
User I/Os β€” 393
PCIe Hard IP Blocks β€” 4 (Gen1 x1/x2/x4)
Operating Temperature β€” -40C to +100C (Industrial)
Process Node β€” 60 nm
Configuration Scheme β€” AS, PS, JTAG, FPP

Datasheets & Resources

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