EP4CGX110DF31I7 vs EP4CGX110DF27I7N Vergleich
Detaillierter Direktvergleich von EP4CGX110DF31I7 von Intel und EP4CGX110DF27I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP4CGX110DF31I7 | EP4CGX110DF27I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $276,34 | $198,00 |
| Series | Cyclone IV GX | Cyclone IV GX |
| Device Logic Elements | 109,424 | — |
| Total Memory Bits | 5,621,760 | — |
| Number of Logic Array Blocks (LABs) | Not specified in provided data [DATA_NEEDED: LAB count] | — |
| Number of I/O | 475 user I/O | — |
| Multipliers (18x18) | 432 | — |
| PLLs | 4 | 4 |
| Transceivers | 8 (up to 3.125 Gbps) | 8 channels, up to 3.125 Gbps |
| M9K Memory Blocks | 270 | — |
| Gehäuse | 896-BGA (FBGA-896), 31 mm | 672-ball FBGA, 1.0 mm pitch |
| Ball Pitch | 0.8 mm | — |
| Speed Grade | -7 | — |
| Temperature Grade | Industrial (-40C to +100C Tj) | — |
| Core Voltage | 1.2 V typical | 1.2 V |
| Configuration Method | SRAM (EPCS or JTAG) | — |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (per JEDEC J-STD-020) [DATA_NEEDED: floor life days] | — |
| RoHS-Status | Compliant | Compliant |
| Device Family | — | EP4CGX110 |
| Logic Elements (LEs) | — | 109,424 |
| Logic Array Blocks (LABs) | — | 6,422 |
| Embedded Memory (bits) | — | 5,621,760 |
| Memory Blocks (M9K) | — | 610 |
| Embedded 18x18 Multipliers | — | 280 |
| User I/Os | — | 393 |
| PCIe Hard IP Blocks | — | 4 (Gen1 x1/x2/x4) |
| Betriebstemperatur | — | -40C to +100C (Industrial) |
| Process Node | — | 60 nm |
| Configuration Scheme | — | AS, PS, JTAG, FPP |