EP4SGX360HF35I3 vs EP4SGX360HF35I4 Comparación
Comparación detallada lado a lado de EP4SGX360HF35I3 por Intel y EP4SGX360HF35I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4SGX360HF35I3 | EP4SGX360HF35I4 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $650,00 | $3.200,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX Field Programmable Gate Array | Stratix IV GX |
| Logic Elements (LEs) | 353,600 | — |
| Total LABs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| User I/Os | 564 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Temperatura de funcionamiento | -40 °C to +100 °C (Industrial) | — |
| Package Type | 1152-Ball FCBGA (FineLine BGA) | — |
| Speed Grade | F35 | -4 |
| Process Technology | 40 nm | — |
| I/O Standards Supported | LVDS, LVTTL, LVPECL, HSTL, SSTL | — |
| Embedded Transceivers | Yes (multi-gigabit) | — |
| DSP Blocks | Yes (hard DSP blocks) | — |
| Estado RoHS | Compliant | Compliant |
| Configuration Modes | Serial, Parallel, JTAG, Active Serial | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Logic Elements | — | 353,600 |
| Logic Array Blocks (LABs) | — | 14,144 |
| Adaptive Logic Modules (ALMs) | — | 141,440 |
| User I/O Pins | — | 564 |
| Embedded Memory | — | 17,424 Kbits (23,130 Kbits total M9K + MLAB) |
| Embedded Multipliers (18 × 18) | — | 1,040 (per Mouser listing of Stratix IV GX family) |
| Transceivers | — | Up to 24 multi-gigabit transceivers (per Stratix IV GX family) |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| Encapsulado | — | 1152-ball FCBGA (HF35, 35 × 35 mm) |
| Operating Temperature (junction) | — | -40°C to 100°C (I4 industrial grade) |
| Process Node | — | 40 nm TSMC |
| Configuration | — | AES-256 bitstream encryption, EPCS serial flash, JTAG, parallel flash |