EP4SGX360HF35I3 vs EP4SGX360HF35I4 Comparaison
Comparaison détaillée côte à côte de EP4SGX360HF35I3 par Intel et EP4SGX360HF35I4 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP4SGX360HF35I3 | EP4SGX360HF35I4 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $650,00 | $3 200,00 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Stratix IV GX | — |
| Family | Stratix IV GX Field Programmable Gate Array | Stratix IV GX |
| Logic Elements (LEs) | 353,600 | — |
| Total LABs | 14,144 | — |
| Embedded Memory (bits) | 23,105,536 | — |
| User I/Os | 564 | — |
| Core Voltage | 0.9 V | 0.9 V |
| Température de fonctionnement | -40 °C to +100 °C (Industrial) | — |
| Package Type | 1152-Ball FCBGA (FineLine BGA) | — |
| Speed Grade | F35 | -4 |
| Process Technology | 40 nm | — |
| I/O Standards Supported | LVDS, LVTTL, LVPECL, HSTL, SSTL | — |
| Embedded Transceivers | Yes (multi-gigabit) | — |
| DSP Blocks | Yes (hard DSP blocks) | — |
| Statut RoHS | Compliant | Compliant |
| Configuration Modes | Serial, Parallel, JTAG, Active Serial | — |
| Type de montage | Surface Mount (BGA) | — |
| Logic Elements | — | 353,600 |
| Logic Array Blocks (LABs) | — | 14,144 |
| Adaptive Logic Modules (ALMs) | — | 141,440 |
| User I/O Pins | — | 564 |
| Embedded Memory | — | 17,424 Kbits (23,130 Kbits total M9K + MLAB) |
| Embedded Multipliers (18 × 18) | — | 1,040 (per Mouser listing of Stratix IV GX family) |
| Transceivers | — | Up to 24 multi-gigabit transceivers (per Stratix IV GX family) |
| Transceiver Data Rate (max) | — | 8.5 Gbps |
| Boîtier | — | 1152-ball FCBGA (HF35, 35 × 35 mm) |
| Operating Temperature (junction) | — | -40°C to 100°C (I4 industrial grade) |
| Process Node | — | 40 nm TSMC |
| Configuration | — | AES-256 bitstream encryption, EPCS serial flash, JTAG, parallel flash |