EPM570FGF256I5N vs EPM570F256C3N Comparación
Comparación detallada lado a lado de EPM570FGF256I5N por Intel y EPM570F256C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM570FGF256I5N | EPM570F256C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $19,80 | $13,75 |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements (LEs) | 570 | 570 |
| Macrocells | 440 | — |
| Propagation Delay (tPD) | 5.0 ns | — |
| User I/O Pins (max) | 212 | — |
| Encapsulado | 256-ball FBGA (FGF256) | 256-ball FBGA (FineLine BGA) |
| Process Technology | 0.18 micron | 0.18 um, 6-layer-metal flash CMOS |
| Configuration Memory | Internal Flash (non-volatile, instant-on) | — |
| Programming Interface | JTAG / ISP | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Tensión de alimentación | 3.3 V core / multi-volt I/O (1.5/1.8/2.5/3.3 V) | — |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 5 (fast) | — |
| Temperatura de funcionamiento | -40C to +100C | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Nivel MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL level not stated in provided data] |
| Estado RoHS | Compliant | Compliant (per DigiKey listing) |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Maximum Operating Frequency | — | 304 MHz |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |