H5AN8G8NCJR-VKC vs H5AN8G8NCJR-PBC Comparación
Comparación detallada lado a lado de H5AN8G8NCJR-VKC por SK hynix y H5AN8G8NCJR-PBC por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5AN8G8NCJR-VKC | H5AN8G8NCJR-PBC |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $28,13 | $2,40 |
| Tipo de memoria | DDR4 SDRAM (volatile) | DDR4 SDRAM |
| Tamaño de memoria | 8 Gbit | 8 Gb (1 GB) |
| Memory Organization | 1G x 8 | — |
| Velocidad de datos | 2666 Mbps/pin | [DATA_NEEDED: data rate for -PBC speed grade (Mbps/MT/s)] |
| Clock Frequency | 1.6 GHz | — |
| Supply Voltage (VDD) | 1.14 V to 1.26 V (1.2 V class) | 1.2 V |
| Operating Current (typ) | 30 mA | — |
| Standby Current (typ) | 3 mA | — |
| Temperatura de funcionamiento | 0C to +85C | [DATA_NEEDED: operating temperature range] |
| Encapsulado | FBGA-78 (78-ball fine-pitch BGA) | 78-ball FBGA |
| Tipo de montaje | Surface Mount | Surface Mount |
| Interfaz | Parallel (DDR4) | — |
| Auto Self-Refresh | Yes | — |
| Data Mask Function | Yes | — |
| Dynamic On-Chip Termination (ODT) | Yes | — |
| Asynchronous Reset | Yes | — |
| ZQ Calibration | Yes | — |
| Write Leveling | Yes | — |
| CRC Function | Yes | — |
| Auto Precharge | Yes | — |
| Estado RoHS | Compliant | Lead-Free & Halogen-Free |
| Latencia CAS | [DATA_NEEDED: CAS Latency] | — |
| Refresh Rate | [DATA_NEEDED: refresh period] | — |
| Organización de memoria | — | 1G x 8 (x8) |
| Interface Voltage (VDDQ) | — | 1.2 V (SSTL12) |
| Architecture | — | CMOS, fully synchronous, dual-edge clocked |
| Bank Structure | — | 8 internal banks, bank-group architecture |
| Burst Length | — | BL8 |
| Características | — | ODT, DM, DQS strobes, programmable CAS latency, self-refresh |
| Die Revision Family | — | CJR (H5AN8G8NCJR-xxC) |
| Refresh | — | Auto-refresh and self-refresh |
| Typical Applications | — | PC/server main memory, embedded solder-down memory |