K9DVGB8U5M vs K9DVGY8J5M Comparación

Comparación detallada lado a lado de K9DVGB8U5M por Samsung Electronics y K9DVGY8J5M por Samsung Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Samsung Electronics
K9DVGB8U5M K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M ✓ Activo
Samsung Electronics
K9DVGY8J5M K9DVGY8J5M - Samsung V-NAND TLC Flash Memory Chip | Samsung

K9DVGY8J5M - Samsung V-NAND TLC Flash Memory Chip | Samsung

K9DVGY8J5M ✓ Activo

Comparación de especificaciones

Parámetro K9DVGB8U5M K9DVGY8J5M
Marca Samsung Electronics Samsung Electronics
Categoría Memory ICs Memory ICs
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $3,05 $1,00
Tipo de memoria NAND Flash —
Organización de memoria [DATA_NEEDED: capacity organization] —
Interfaz Asynchronous x8-bit I/O —
Tensión de alimentación [DATA_NEEDED: VCC range] —
Encapsulado [DATA_NEEDED: package type and dimensions] —
Tipo de montaje Surface Mount Surface Mount
Page Size [DATA_NEEDED: main page size] —
Block Size [DATA_NEEDED: erase block size] —
Read Time (tR) [DATA_NEEDED: page read cycle time] [DATA_NEEDED: tR typical/us]
Program Time (tPROG) [DATA_NEEDED: page program time] —
Erase Time (tBERS) [DATA_NEEDED: block erase time] —
Endurance [DATA_NEEDED: program/erase cycles] —
Data Retention [DATA_NEEDED: retention specification] —
Temperatura de funcionamiento [DATA_NEEDED: temperature range] [DATA_NEEDED: operating temperature range]
Access Interface Signals CLE, ALE, WE, RE, CE, R/B, WP —
Bad Block Management Host-managed (controller ECC and bad-block table required) —
Estado RoHS [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
Manufacturer — Samsung Electronics
Product Type — Raw NAND Flash Memory
NAND Technology — Samsung V-NAND (3D TLC)
Flash ID — EC519A3F8CCB
Density — [DATA_NEEDED: die density (Gb)]
Organization (Page/Block) — [DATA_NEEDED: page and block organization]
Tipo de interfaz — [DATA_NEEDED: interface (toggle DDR / async)]
Supply Voltage (VCC) — [DATA_NEEDED: VCC voltage]
Supply Voltage (VCCQ) — [DATA_NEEDED: VCCQ voltage]
Program Page Time (tPROG) — [DATA_NEEDED: tPROG typical/us]
Block Erase Time (tBERS) — [DATA_NEEDED: tBERS typical/us]
Program/Erase Endurance — [DATA_NEEDED: P/E cycle endurance]
Package Type — [DATA_NEEDED: package type and dimensions]

Hojas de datos y recursos

Examinar todos los productos Crear BOM Solicitar cotización