K9DVGB8U5M vs K9DVGY8J5M Comparação

Comparação detalhada lado a lado de K9DVGB8U5M por Samsung Electronics e K9DVGY8J5M por Samsung Electronics. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

Samsung Electronics
K9DVGB8U5M K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M ✓ Ativo
Samsung Electronics
K9DVGY8J5M K9DVGY8J5M - Samsung V-NAND TLC Flash Memory Chip | Samsung

K9DVGY8J5M - Samsung V-NAND TLC Flash Memory Chip | Samsung

K9DVGY8J5M ✓ Ativo

Comparação de especificações

Parâmetro K9DVGB8U5M K9DVGY8J5M
Marca Samsung Electronics Samsung Electronics
Categoria Memory ICs Memory ICs
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $3,05 $1,00
Tipo de memória NAND Flash —
Organização da memória [DATA_NEEDED: capacity organization] —
Interface Asynchronous x8-bit I/O —
Tensão de alimentação [DATA_NEEDED: VCC range] —
Encapsulamento [DATA_NEEDED: package type and dimensions] —
Tipo de montagem Surface Mount Surface Mount
Page Size [DATA_NEEDED: main page size] —
Block Size [DATA_NEEDED: erase block size] —
Read Time (tR) [DATA_NEEDED: page read cycle time] [DATA_NEEDED: tR typical/us]
Program Time (tPROG) [DATA_NEEDED: page program time] —
Erase Time (tBERS) [DATA_NEEDED: block erase time] —
Endurance [DATA_NEEDED: program/erase cycles] —
Data Retention [DATA_NEEDED: retention specification] —
Temperatura de operação [DATA_NEEDED: temperature range] [DATA_NEEDED: operating temperature range]
Access Interface Signals CLE, ALE, WE, RE, CE, R/B, WP —
Bad Block Management Host-managed (controller ECC and bad-block table required) —
Status RoHS [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
Manufacturer — Samsung Electronics
Product Type — Raw NAND Flash Memory
NAND Technology — Samsung V-NAND (3D TLC)
Flash ID — EC519A3F8CCB
Density — [DATA_NEEDED: die density (Gb)]
Organization (Page/Block) — [DATA_NEEDED: page and block organization]
Tipo de interface — [DATA_NEEDED: interface (toggle DDR / async)]
Supply Voltage (VCC) — [DATA_NEEDED: VCC voltage]
Supply Voltage (VCCQ) — [DATA_NEEDED: VCCQ voltage]
Program Page Time (tPROG) — [DATA_NEEDED: tPROG typical/us]
Block Erase Time (tBERS) — [DATA_NEEDED: tBERS typical/us]
Program/Erase Endurance — [DATA_NEEDED: P/E cycle endurance]
Package Type — [DATA_NEEDED: package type and dimensions]

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