K9DVGB8U5M vs K9DVGY8J5M Comparaison

Comparaison détaillée côte à côte de K9DVGB8U5M par Samsung Electronics et K9DVGY8J5M par Samsung Electronics. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

Samsung Electronics
K9DVGB8U5M K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M - Samsung NAND Flash Memory Chip | Samsung

K9DVGB8U5M ✓ Actif
Samsung Electronics
K9DVGY8J5M K9DVGY8J5M - Samsung V-NAND TLC Flash Memory Chip | Samsung

K9DVGY8J5M - Samsung V-NAND TLC Flash Memory Chip | Samsung

K9DVGY8J5M ✓ Actif

Comparaison des spécifications

Paramètre K9DVGB8U5M K9DVGY8J5M
Marque Samsung Electronics Samsung Electronics
Catégorie Memory ICs Memory ICs
Statut du cycle de vie Actif Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $3,05 $1,00
Type de mémoire NAND Flash —
Organisation de la mémoire [DATA_NEEDED: capacity organization] —
Interface Asynchronous x8-bit I/O —
Tension d'alimentation [DATA_NEEDED: VCC range] —
Boîtier [DATA_NEEDED: package type and dimensions] —
Type de montage Surface Mount Surface Mount
Page Size [DATA_NEEDED: main page size] —
Block Size [DATA_NEEDED: erase block size] —
Read Time (tR) [DATA_NEEDED: page read cycle time] [DATA_NEEDED: tR typical/us]
Program Time (tPROG) [DATA_NEEDED: page program time] —
Erase Time (tBERS) [DATA_NEEDED: block erase time] —
Endurance [DATA_NEEDED: program/erase cycles] —
Data Retention [DATA_NEEDED: retention specification] —
Température de fonctionnement [DATA_NEEDED: temperature range] [DATA_NEEDED: operating temperature range]
Access Interface Signals CLE, ALE, WE, RE, CE, R/B, WP —
Bad Block Management Host-managed (controller ECC and bad-block table required) —
Statut RoHS [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS status]
Manufacturer — Samsung Electronics
Product Type — Raw NAND Flash Memory
NAND Technology — Samsung V-NAND (3D TLC)
Flash ID — EC519A3F8CCB
Density — [DATA_NEEDED: die density (Gb)]
Organization (Page/Block) — [DATA_NEEDED: page and block organization]
Type d'interface — [DATA_NEEDED: interface (toggle DDR / async)]
Supply Voltage (VCC) — [DATA_NEEDED: VCC voltage]
Supply Voltage (VCCQ) — [DATA_NEEDED: VCCQ voltage]
Program Page Time (tPROG) — [DATA_NEEDED: tPROG typical/us]
Block Erase Time (tBERS) — [DATA_NEEDED: tBERS typical/us]
Program/Erase Endurance — [DATA_NEEDED: P/E cycle endurance]
Package Type — [DATA_NEEDED: package type and dimensions]

Fiches techniques et ressources

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