MC9S08QD4VSC vs S9S08QD4J2MSCR Comparación
Comparación detallada lado a lado de MC9S08QD4VSC por NXP Semiconductors y S9S08QD4J2MSCR por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MC9S08QD4VSC | S9S08QD4J2MSCR |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,00 | $1,55 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-bit | — |
| Frecuencia de reloj máxima | 16 MHz (bus up to 8 MHz per FindIC; 20 MHz CPU capable per datasheet) | — |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | 4 | — |
| GPIO Count | 6 | — |
| Instruction Set | CISC (HC08 with added BGND instruction) | — |
| Debug Interface | Background Debug Mode (BDM), single breakpoint on-chip | — |
| Encapsulado | 8-SOIC | 8-SOIC (0.154 inch, 3.90 mm width) |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | 2.7 V to 5.5 V |
| Series | MC9S08QD4 | — |
| Estado del ciclo de vida | End of Life (per NXP product page) | — |
| Core | — | HCS08 |
| Instruction Set Architecture | — | CISC (68 HC08 with added BGND) |
| Core Width | — | 8-bit |
| Maximum CPU Frequency | — | 16 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 4 KB (4K x 8) |
| Packaging | — | Tape & Reel (TR) |
| I/O Pins | — | 4 |
| ADC | — | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | — | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |
| Estado RoHS | — | Compliant |