MC9S08QD4VSC vs S9S08QD4J2MSCR Comparaison
Comparaison détaillée côte à côte de MC9S08QD4VSC par NXP Semiconductors et S9S08QD4J2MSCR par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | MC9S08QD4VSC | S9S08QD4J2MSCR |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $0,00 | $1,55 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-bit | — |
| Fréquence d'horloge maximale | 16 MHz (bus up to 8 MHz per FindIC; 20 MHz CPU capable per datasheet) | — |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | 4 | — |
| GPIO Count | 6 | — |
| Instruction Set | CISC (HC08 with added BGND instruction) | — |
| Debug Interface | Background Debug Mode (BDM), single breakpoint on-chip | — |
| Boîtier | 8-SOIC | 8-SOIC (0.154 inch, 3.90 mm width) |
| Type de montage | Surface Mount | Surface Mount |
| Température de fonctionnement | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| Tension d'alimentation | [DATA_NEEDED: supply voltage range] | 2.7 V to 5.5 V |
| Series | MC9S08QD4 | — |
| Statut du cycle de vie | End of Life (per NXP product page) | — |
| Core | — | HCS08 |
| Instruction Set Architecture | — | CISC (68 HC08 with added BGND) |
| Core Width | — | 8-bit |
| Maximum CPU Frequency | — | 16 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 4 KB (4K x 8) |
| Packaging | — | Tape & Reel (TR) |
| I/O Pins | — | 4 |
| ADC | — | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | — | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |
| Statut RoHS | — | Compliant |