MC9S08QD4VSC vs S9S08QD4J2MSCR 对比
详细并排对比 MC9S08QD4VSC 出自 NXP Semiconductors 和 S9S08QD4J2MSCR 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
规格对比
| 参数 | MC9S08QD4VSC | S9S08QD4J2MSCR |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 停产 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $0.00 | $1.55 |
| Core Processor | S08 (HCS08) | — |
| Core Size | 8-bit | — |
| 最大时钟频率 | 16 MHz (bus up to 8 MHz per FindIC; 20 MHz CPU capable per datasheet) | — |
| Flash Memory | 4 KB (4K x 8) | — |
| RAM | 256 B | — |
| ADC Resolution | 10-bit | — |
| ADC Channels | 4 | — |
| GPIO Count | 6 | — |
| Instruction Set | CISC (HC08 with added BGND instruction) | — |
| Debug Interface | Background Debug Mode (BDM), single breakpoint on-chip | — |
| 封装 | 8-SOIC | 8-SOIC (0.154 inch, 3.90 mm width) |
| 安装类型 | Surface Mount | Surface Mount |
| 工作温度 | [DATA_NEEDED: operating temperature range] | -40 C to +125 C |
| 电源电压 | [DATA_NEEDED: supply voltage range] | 2.7 V to 5.5 V |
| Series | MC9S08QD4 | — |
| 生命周期状态 | End of Life (per NXP product page) | — |
| Core | — | HCS08 |
| Instruction Set Architecture | — | CISC (68 HC08 with added BGND) |
| Core Width | — | 8-bit |
| Maximum CPU Frequency | — | 16 MHz |
| Program Memory Type | — | Flash |
| Program Memory Size | — | 4 KB (4K x 8) |
| Packaging | — | Tape & Reel (TR) |
| I/O Pins | — | 4 |
| ADC | — | 10-bit, 4-channel with internal bandgap/temperature sensor, hardware triggerable via RTI |
| Timers | — | TIM1 - 2-channel (input capture / output compare / buffered edge- or center-aligned PWM) |
| Debug | — | Background Debug Mode (BDM); single breakpoint + two additional on-chip breakpoints |
| RoHS 状态 | — | Compliant |