MMBF170LT1 vs 2N7002LT1G Comparación
Comparación detallada lado a lado de MMBF170LT1 por onsemi y 2N7002LT1G por onsemi. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MMBF170LT1 | 2N7002LT1G |
|---|---|---|
| Marca | onsemi | onsemi |
| Categoría | MOSFETs | MOSFETs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,09 | $0,02 |
| Manufacturer | onsemi (ON Semiconductor) | onsemi (ON Semiconductor) |
| Part Number | MMBF170LT1 | — |
| Tipo de transistor | N-Channel MOSFET, Enhancement Mode | — |
| Drain-Source Voltage (VDSS) | 60 V | — |
| Drain-Gate Voltage (VDGS) | 60 Vdc | — |
| Gate-Source Voltage - Continuous (VGS) | ±20 Vdc (per datasheet) | — |
| Gate-Source Voltage - Non-repetitive (VGSM) | ±40 Vpk (tp <= 50 ms) | — |
| Continuous Drain Current (ID) | 500 mA (Ta) | — |
| Pulsed Drain Current (IDM) | [DATA_NEEDED: IDM pulsed value] | — |
| Total Device Dissipation (PD) | 225 mW (Ta, FR-5 board) | — |
| Rango de temperatura de funcionamiento | -55 °C to +150 °C (TJ max per datasheet) | [DATA_NEEDED: operating temperature range] |
| Encapsulado / Carcasa | SOT-23-3 (TO-236) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Recuento de pines | 3 | — |
| Estado RoHS | Compliant (per onsemi product page) | — |
| AEC-Q101 Qualified | Yes (per datasheet) | — |
| Technology | DMOS | MOSFET |
| Polarity | N-Channel | N-Channel |
| Channel Mode | — | Enhancement Mode |
| Drain-Source Voltage VDSS | — | 60 V |
| Continuous Drain Current ID | — | 115 mA (Tc) |
| Power Dissipation PD | — | 225 mW (Ta) |
| Maximum RDS(on) | — | 7.5 ohm @ VGS = 5 V |
| Configuration | — | Single FET |
| Encapsulado | — | SOT-23-3 (TO-236) |
| Número de pines | — | 3 |
| Categoría | — | Small Signal MOSFET |
| Lead Finish | — | [DATA_NEEDED: lead finish/plating] |
| Packaging | — | [DATA_NEEDED: packaging type] |