MPC860DEZQ50D4 vs MPC860DTVR50D4 Comparación
Comparación detallada lado a lado de MPC860DEZQ50D4 por NXP Semiconductors y MPC860DTVR50D4 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MPC860DEZQ50D4 | MPC860DTVR50D4 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $24,95 | $59,80 |
| Processor Type | MPC8xx PowerQUICC, 32-bit | MPC8xx PowerQUICC |
| Core Architecture | Power Architecture (embedded) | 32-bit PowerPC |
| Core Frequency | 50 MHz | — |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC | — |
| Ethernet MAC | 10/100 Mbps integrated | — |
| HDLC/SDLC Channels | Yes (multi-channel) | — |
| PCMCIA Interface | Yes | — |
| Supply Voltage (I/O) | 3.3 V | — |
| Encapsulado | 357-Ball PBGA (25x25 mm) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Temperatura de funcionamiento | 0 C to +95 C | 0C to +95C |
| Estado RoHS | Contains Lead (legacy BGA) | RoHS Compliant |
| Lead-Free Status | Contains Lead | — |
| Packaging | Tray | Tray |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC | — |
| Number of Cores | — | 1 |
| Speed | — | 50 MHz |
| Tensión de alimentación | — | 3.3 V |
| Encapsulado / Carcasa | — | 357-PBGA (25 x 25 mm) |
| Lead Free Status | — | Lead Free |
| Process Technology | — | 0.32 um CMOS |
| Communications Processor Module (CPM) | — | Integrated (RISC-based) |
| DMA Channels | — | 4 |
| External Memory Bus | — | 32-bit (single/dual bus) |