MRF18030BLSR3 vs MRF18060BLSR3 Comparación

Comparación detallada lado a lado de MRF18030BLSR3 por NXP Semiconductors y MRF18060BLSR3 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
MRF18030BLSR3 MRF18030BLSR3 - 30W 1930-1990 MHz RF Power MOSFET LDMOS | NXP

MRF18030BLSR3 - 30W 1930-1990 MHz RF Power MOSFET LDMOS | NXP

MRF18030BLSR3 ✓ Activo
NXP Semiconductors
MRF18060BLSR3 MRF18060BLSR3 - 60W RF Power MOSFET 1930-1990 MHz | NXP

MRF18060BLSR3 - 60W RF Power MOSFET 1930-1990 MHz | NXP

MRF18060BLSR3 ⚠ Última compra

Comparación de especificaciones

Parámetro MRF18030BLSR3 MRF18060BLSR3
Marca NXP Semiconductors NXP Semiconductors
Categoría MOSFETs MOSFETs
Estado del ciclo de vida Activo Última compra
Estado del stock In Stock In Stock
Precio unitario (USD) $52,10 $27,85
Manufacturer Analog Devices / NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale/Motorola)
Part Number MRF18030BLSR3 —
Tipo de transistor N-Channel Enhancement-Mode Lateral MOSFET (LDMOS) Lateral N-Channel Enhancement-Mode MOSFET
Technology LDMOS, laterally diffused metal-oxide-semiconductor —
Configuration Single, common-source RF power transistor Single N-channel
Operating Frequency Range 1.8 GHz to 2 GHz (specified 1930-1990 MHz) —
Target Application Band GSM / GSM-EDGE / DCS-1900 / PCS-1900 —
Drain-Source Voltage (VDSS) 26 V typical operating 26 V
Output Power (Pout) 30 W (CW or pulsed, in-band) 60 W CW
Power Gain 14 dB typical at 2 GHz —
Drain Efficiency [DATA_NEEDED: typical drain efficiency %] [DATA_NEEDED: drain efficiency percentage]
Maximum Power Dissipation (Abs) 83.3 W —
Operating Mode Enhancement Mode —
Drain Current (Id) at test condition 250 mA (quiescent / small-signal reference) —
Encapsulado NI-400S (CASE 465E-04, Style 1), ceramic surface mount —
Tipo de montaje Surface Mount Surface Mount
Lead-Free / RoHS Per NXP product page (verify with current data) —
Storage Temperature [DATA_NEEDED: storage temperature range] —
Temperatura de unión de funcionamiento [DATA_NEEDED: max junction temperature C] —
Frequency Range — 1930 MHz to 1990 MHz (specified band), 1800-2000 MHz (operational)
Test Voltage (VDD) — 26 V
Power Gain (Gps) — 13 dB (typical)
Maximum Power Dissipation (Absolute) — 180 W
Maximum Drain Current — [DATA_NEEDED: maximum DC drain current]
Rango de temperatura de funcionamiento — [DATA_NEEDED: operating temperature range]
Storage Temperature Range — [DATA_NEEDED: storage temperature range]
Encapsulado / Carcasa — NI-780S (CASE 465-06, Style 1), ceramic surface-mount
Peak Reflow Temperature — 260 C
Nivel MSL — [DATA_NEEDED: MSL rating]
Estado RoHS — [DATA_NEEDED: RoHS compliance]

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