MRFG35010NT1 vs MRF6S21100HR3 Comparación
Comparación detallada lado a lado de MRFG35010NT1 por NXP Semiconductors y MRF6S21100HR3 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | MRFG35010NT1 | MRF6S21100HR3 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | MOSFETs | MOSFETs |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $25,95 | $38,95 |
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) | — |
| Part Number | MRFG35010NT1 | — |
| Tipo de transistor | GaAs pHEMT RF Power FET | LDMOS (N-Channel Enhancement-Mode Lateral MOSFET) |
| Drain-Source Voltage Rating (Vds) | 15 V | — |
| Continuous Drain Current Rating | 2.9 A | — |
| Operating Frequency | 3.55 GHz | — |
| Frequency Range | 1.8 GHz to 3.6 GHz | — |
| Test Voltage | 12 V | — |
| Test Current (quiescent) | 180 mA | — |
| Associated Power Gain | 10 dB at 3.55 GHz | — |
| Output Power | 9 W at 3.55 GHz | — |
| Configuration | Unmatched, common source | Single |
| Class of Operation | Class AB linear | — |
| Encapsulado / Carcasa | PLD-1.5 flanged ceramic | — |
| Supplier Device Package | PLD-1.5 | — |
| Tipo de montaje | Chassis-mount / flange-bolt | Surface Mount / bolt-down flange |
| Lead Free Status | Lead free (per datasheet) | [DATA_NEEDED: RoHS/lead-free explicit statement] |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: explicit RoHS compliance statement] |
| Frequency Band | — | 2.11 GHz to 2.17 GHz |
| Output Power (Average) | — | 23 W (W-CDMA, CW equivalent ~100 W PEP) |
| Power Gain (Typ) | — | 15.9 dB at 2.14 GHz |
| Drain-Source Voltage Rating (VDS max) | — | 68 V |
| Test Supply Voltage (VDD) | — | 28 V |
| Quiescent Drain Current (IDQ) | — | 950 mA |
| Test Drain Current | — | 950 mA |
| Encapsulado | — | NI-780H-2L (ceramic flange) |
| Maximum Power Dissipation (Abs) | — | 388 W |
| Operating Mode | — | Class AB (PCN/PCS/cellular, WLL, TD-SCDMA) |
| Terminal Position | — | Dual |