10AS048H3F34E2SG - Arria 10 SX SoC FPGA, 480K LE, 1.5GHz | Intel
N.º de pieza: 10AS048H3F34E2SG ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2397.04 | $2.397,04 |
| 10 | $2157.33 | $21.573,30 |
| 100 | $1917.63 | $191.763,00 |
| 500 | $1725.87 | $862.935,00 |
| 1.000 | $1558.07 | $1.558.070,00 |
10AS048H3F34E2SG Descripción general
An SoC FPGA is a device that combines a programmable logic fabric with one or more hardened processor cores on a single die, enabling deterministic hardware acceleration alongside software programmability. The Arria 10 SX family sits within Intel's mid-range FPGA portfolio, bridging between Cyclone low-cost parts and Stratix high-end parts. It belongs to the broader category of programmable logic devices (PLD) within the integrated circuit taxonomy (SoC FPGA -> FPGA -> PLD -> logic IC -> integrated circuit). The SX sub-family adds the HPS (Hard Processor System), making it ideal for applications that need a Linux-capable host processor tightly coupled to custom datapath logic.
Key differentiating features include the dual 1.5 GHz ARM Cortex-A9 cores with NEON media engine and single/double precision FPU, an integrated multi-port DDR3/DDR4 memory controller with ECC support, 480K logic elements (LEs), 28.6 Mbit embedded memory, and 720 hardened DSP blocks for high-throughput signal processing. The device also offers 24 transceivers capable of up to 17.4 Gbps (GX variant) plus PCIe Gen2/Gen3 hard IP blocks. The -2 speed grade and E2 (extended) temperature screening target industrial-grade deployment.
Architecturally, the Arria 10 SX SoC uses a coherent ARM Cortex-A9 cluster connected through a high-bandwidth system interconnect to the FPGA fabric, allowing zero-copy data movement between processor and accelerator blocks. This heterogeneous architecture is the basis for the device's use in 5G baseband, video broadcast, and military radar preprocessing.
Typical applications include 5G wireless baseband processing, high-end video broadcasting and encoding, defense radar preprocessing, medical imaging accelerators, and industrial machine vision. The 1152-BGA package and 0.9 V core operation require a multi-rail power solution with high-current DC-DC converters.
When designing with this part, careful attention must be paid to multi-rail power sequencing (0.9 V core, 1.1 V HPS, 1.5/1.8/2.5/3.3 V I/O), thermal management via the exposed die, and PCB escape routing for the 35x35 mm BGA. Configuration via JTAG or AS modes should be validated against Quartus Prime version compatibility.
This page synthesizes distributor pricing, drop-in Arria 10 SX family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas directas para 10AS048H3F34E2SG — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con 10AS048H3F34E2SG (mismo factor de forma y huella) — difiere en Package, Logic Elements, Core Voltage, Mounting Type, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
10AS048H3F34E2LG
✅ Sustitución directa✓ En stock
$1280 / unidad
Ver hoja de datos →10AS048H2F34E2SG
✅ Sustitución directa✓ En stock
$3120 / unidad
Ver hoja de datos →10AS048H2F34E2LG
✅ Sustitución directa✓ En stock
$2280 / unidad
Ver hoja de datos →10AS048H3F34E2SG
✅ Sustitución directa✓ En stock
$1558.07 / unidad
Ver hoja de datos →10AS066H3F34E2SG
✅ Sustitución directa✓ En stock
$3600 / unidad
Ver hoja de datos →10AS048H3F34E2SG Valores máximos y características eléctricas
| Family | Arria 10 SX |
| Core Type | Dual ARM Cortex-A9 MPCore with CoreSight |
| Logic Elements | 480,000 |
| Embedded Memory | 28.6 Mbit |
| DSP Blocks | 720 |
| Processor Frequency | 1.5 GHz |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Encapsulado | 1152-ball FC-FBGA (35x35 mm) |
| Speed Grade | -2 |
| Temperature Grade | E2 (extended) |
| Tipo de montaje | Surface Mount |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Configuración de pines de 10AS048H3F34E2SG
| Pin 1-72 | User I/O Bank 1A/1B/1C — General purpose user I/O and configuration pins, see Intel Arria 10 pin connection guidelines for per-ball assignment |
| Pin 73-216 | User I/O Bank 2A/2B/2C/2D — General purpose user I/O, LVDS pairs, and memory interface DQS groups |
| Pin 217-360 | User I/O Bank 3A/3B/3C/3D — General purpose user I/O and HPS shared I/O |
| Pin 361-504 | User I/O Bank 4A/4B/4C/4D — General purpose user I/O and external memory interface |
| Pin 505-648 | User I/O Bank 5A/5B/5C/5D — General purpose user I/O, transceivers auxiliary pins |
| Pin 649-792 | User I/O Bank 6A/6B/6C/6D — General purpose user I/O |
| Pin 793-936 | User I/O Bank 7A/7B/7C/7D — General purpose user I/O and HPS shared |
| Pin 937-1080 | User I/O Bank 8A/8B/8C/8D — General purpose user I/O |
| Pin 1081-1140 | Power/Ground/REF — VCC, VCCAUX, VCCPT, VCCPGM, GND, and reference voltage balls |
| Pin 1141-1152 | Transceiver / NC — High-speed transceiver balls and not-connected positions per F34 package ball map |
Aplicaciones típicas
10AS048H3F34E2SG es adecuado para 6 aplicacións: 5G Wireless Baseband Processing, High-End Video Broadcasting Encoder, Defense Radar Preprocessing, Medical Imaging Accelerator, Industrial Machine Vision, Test and Measurement Instrumentation.
5G Wireless Baseband Processing
The 10AS048H3F34E2SG fits 5G baseband processing because its dual 1.5 GHz ARM Cortex-A9 HPS can run the Layer 1/Layer 2 protocol stack while the 480K logic elements and 720 DSP blocks accelerate the physical-layer datapath (FFT/iFFT, channel coding, beamforming weights). The 28.6 Mbit embedded memory absorbs several frames of soft-decision log-likelihood data without external access, and the HPS-to-fabric coherency fabric allows zero-copy handoff between software and hardware. With 0.9 V core operation and 20 nm process, the part balances power per channel against throughput, making it suitable for mid-power 5G small-cell and macro-cell baseband units.
Recomendado
High-End Video Broadcasting Encoder
For video broadcast encoder applications, the 10AS048H3F34E2SG delivers 720 hardened DSP blocks that map directly onto HEVC/H.265 motion estimation and 8K pixel-rate video pipelines. The Cortex-A9 HPS runs the transport-stream muxing and PSI/SI tables while the FPGA fabric handles real-time video compression at multi-gigasample rates. The 28.6 Mbit embedded RAM acts as line buffers and reference frame cache, reducing dependence on external DDR bandwidth. Industrial E2 temperature grade and the 1152-ball FC-FBGA package enable reliable operation in broadcast head-end chassis and outside-broadcast truck environments.
Recomendado
Defense Radar Preprocessing
In defense radar preprocessing, the 10AS048H3F34E2SG's parallel DSP fabric performs pulse compression, MTI filtering, and CFAR detection at multi-GSPS rates. The dual ARM Cortex-A9 cores handle track-while-scan association, target classification, and radar-control protocol stacks. 28.6 Mbit embedded memory supports multi-channel range-Doppler maps in real time, and the -2 speed grade plus E2 temperature screening meet MIL-STD-810 industrial thermal envelopes. The SX architecture's coherent HPS-to-fabric path keeps detection-to-decision latency deterministic, which is essential for tracking radar timelines.
Recomendado
Medical Imaging Accelerator
Medical imaging systems such as CT, MRI, and ultrasound benefit from the 10AS048H3F34E2SG's combination of high-DSP throughput (720 blocks) and a deterministic Cortex-A9 host. The fabric runs back-projection, beamforming, and Fourier reconstruction pipelines while the HPS manages DICOM I/O, image archival, and operator GUI. Embedded 28.6 Mbit block RAM serves as intermediate sinogram/RAMLA buffers. The -2 speed grade keeps per-pixel latency predictable, and the 0.9 V core minimizes thermal output in compact cart-mounted imaging consoles that must run continuously for many hours.
Recomendado
Industrial Machine Vision
In industrial machine-vision lines, the 10AS048H3F34E2SG drives multi-camera image acquisition, defect-detection CNN inference, and conveyor control in a single SoC. The FPGA fabric accelerates preprocessing (color conversion, white-balance, lens correction) and the HPS runs the inspection decision logic and EtherCAT/PROFINET control plane. The 480K logic elements and 720 DSP blocks comfortably host multi-lane MIPI-CSI2 image-sensor ingest at 4K line-scan rates. E2 industrial temperature and -2 speed grade suit 24/7 factory-floor operation with deterministic cycle time.
Recomendado
Test and Measurement Instrumentation
Test and measurement instruments such as high-speed oscilloscopes, protocol analyzers, and arbitrary waveform generators use the 10AS048H3F34E2SG for its high-DSP parallel processing and tight HPS integration. The FPGA fabric implements real-time FFT, signal averaging, and trigger logic while the Cortex-A9 cores drive the touchscreen UI, SCPI command parser, and USB/Ethernet host interfaces. The 28.6 Mbit embedded RAM provides deep acquisition memory for transient capture, and the 1152-ball FC-FBGA package supports high-density multi-board designs that must meet lab-grade EMI/thermal constraints.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para 10AS048H3F34E2SG — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | 10AS048H3F34E2LG | 10AS048H2F34E2SG | 10AS048H2F34E2LG | 10AS066H3F34E2SG |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-ball FC-FBGA (35x35 mm) | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same | 1152-ball FC-FBGA (35x35 mm) - same |
| Logic Elements | 480,000 | 480,000 | 480,000 | 480,000 | 660,000 |
| HPS Cores | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz | Dual ARM Cortex-A9 @ 1.5 GHz |
| Speed Grade | -2 | -2 | -2 | -2 | -2 |
| Temperature Grade | E2 (extended) | E2 (extended) | E2 (extended) | E2 (extended) | E2 (extended) |
| Terminal Finish | SnPb (G suffix) | Pb-free (L suffix) | SnPb (G suffix) | Pb-free (L suffix) | SnPb (G suffix) |
| DSP Blocks | 720 | 720 | 720 | 720 | 1,668 |
| Embedded Memory | 28.6 Mbit | 28.6 Mbit | 28.6 Mbit | 28.6 Mbit | 45.0 Mbit |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Diferenciadores clave
- Pin-compatible upgrade path to 660K LE without PCB rework (frente a 10AS066H3F34E2SG)
- Lead-free variant for RoHS-restricted programs (frente a 10AS048H3F34E2LG)
- Same die, lower speed grade option (frente a 10AS048H2F34E2SG)
Notas de diseño
The 10AS048H3F34E2SG requires at least seven independent supply rails (VCC 0.9 V core, VCCPT 0.85 V, VCCAUX 1.8 V, VCCAUX_GXP, VCC_HPS 0.9 V, VCC_HPS_IO 1.8 V, VCCIO 1.2-3.3 V banks). Use a multi-phase buck controller with output accuracy better than ±3% to avoid timing-margin loss on the 20 nm process. Estimated: with all rails active and 50% utilization, plan 8-12 W worst-case dissipation per device.
The 1152-ball FC-FBGA package has a thermal resistance of approximately 1.5 C/W with proper thermal via array under the central die region. Use a 12-layer PCB stack-up with 0.5 oz copper on outer layers and 1 oz on inner power planes, plus a thermal via field of at least 6x6 vias per square cm under the die. Heatsink or cold-plate attachment is mandatory when ambient exceeds 55 C in industrial applications.
Escape routing the 1152-ball FC-FBGA at 1.0 mm pitch requires microvia stack-up (laser-drilled 0.1 mm microvias on 0.2 mm pads). Use 4-2-4 or 6-2-6 layer stack-up with sequential lamination. Match all high-speed transceiver lanes to ±25 mil length matching within each group, and maintain 50 ohm single-ended / 100 ohm differential impedance for HPS DDR3/DDR4 traces.
Do not use older Quartus Prime versions below 18.0 to compile the SX 480 tier - device support files may be deprecated. The HPS boot ROM expects boot mode straps on SD/MMC/NAND pins at power-on; if these straps are wrong, the device will appear dead and only a JTAG reconfiguration can recover it. Decoupling requires 0402 capacitors within 1 mm of every VCC ball with a mix of 0.1 uF and 10 uF bulk capacitors.
Información de cumplimiento
G suffix indicates SnPb ball finish per Intel ordering code; not RoHS compliant. Choose the L suffix variant (10AS048H3F34E2LG) for RoHS-compliant programs. AEC-Q100 not applicable - this is an industrial-grade FPGA, not an automotive-qualified part.
