10AS066H3F34E2SG - Arria 10 SX SoC FPGA 660K LE | Altera
MPN: 10AS066H3F34E2SG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4500 | $4,500.00 |
| 10 | $4300 | $43,000.00 |
| 100 | $4050 | $405,000.00 |
| 500 | $3800 | $1,900,000.00 |
| 1,000 | $3600 | $3,600,000.00 |
Drop-in alternatives for 10AS066H3F34E2SG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS066H3F34E2LG
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$2875 / Unit
View Datasheet →10AS066H3F34I2SG
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View Datasheet →10AS066H2F34E2SG
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View Datasheet →10AS066H2F34E2LG
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$3250 / Unit
View Datasheet →10AS066H1F34E1HG
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View Datasheet →10AS066H3F34E2SG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device Variant | 10AS066 |
| Logic Elements | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Process Technology | 20 nm |
| Core Voltage | 0.9 V |
| Maximum Operating Frequency (IP dependent) | 1.5 GHz |
| Package | 1152-ball FC-FBGA (F34) |
| Package Size | 35 x 35 mm |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Operating Temperature Grade | Extended (E) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Shipping Medium | Tray |
| Architecture Type | SoC FPGA (HPS + FPGA fabric) |
10AS066H3F34E2SG 35 x 35 mm Pin Configuration Guide
Complete pinout information for 10AS066H3F34E2SG (35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS066H3F34E2SG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS066H3F34E2SG is suitable for 7 applications: Wireless Baseband Processing, Radar and Beamforming Front-Ends, Industrial Machine Vision, Medical Imaging Pre-Processing, Test and Measurement Equipment, High-Speed Serial Interface Bridging, Software Defined Radio (SDR) Platforms.
Wireless Baseband Processing
The 10AS066H3F34E2SG is well suited to wireless baseband signal processing because it combines 660,000 logic elements with hard ARM Cortex-A9 cores on the same die. The fabric runs PHY layer functions, channelization filters and FFT cores with deterministic latency, while the HPS handles the MAC, network stack and protocol timers. Hardened DDR controllers and high-speed transceivers remove the need for external bridge chips, shrinking the radio baseband BOM. The 1.5 GHz fabric IP blocks accelerate datapath processing, and the 0.9 V core supply keeps dynamic power reasonable for always-on small-cell or picocell deployments.
Recommended
Radar and Beamforming Front-Ends
In phased-array radar and 5G beamforming front-ends, the 10AS066H3F34E2SG provides the mix of parallel compute, fast memory access and low-latency control required to drive hundreds of antenna elements. The 660K logic elements host beamforming weight calculations, calibration logic and digital up/down conversion, while the HPS runs calibration, monitoring and higher-level control loops. The 1152-pin F34 FC-FBGA exposes the large number of LVDS and transceiver lanes needed for ADC/DAC interfacing. The 0.9 V core and 20 nm process keep per-element power low enough to scale to large arrays.
Recommended
Industrial Machine Vision
Industrial machine vision pipelines need both pixel-rate preprocessing in fabric and a Linux-class processor for inference, networking and HMI. The 10AS066H3F34E2SG places the dual ARM Cortex-A9 HPS and 660K LE fabric on one die, allowing high-throughput image preprocessing, Bayer conversion, exposure and gain control in hardware, while the HPS runs OpenCV, TensorFlow Lite inference or vendor vision stacks. MIPI and LVDS I/O from the F34 FC-BGA connect to image sensors, and the SoC reduces part count versus a discrete CPU-plus-FPGA design.
Recommended
Medical Imaging Pre-Processing
Ultrasound, endoscopy and CT pre-processing benefit from the 10AS066H3F34E2SG's mix of high logic density, low-latency fabric and an integrated ARM host. The fabric handles beamforming, FIR filtering and envelope detection at sample rates up to tens of MHz per channel, while the HPS runs the user interface, networking and post-processing stacks. Hardened memory controllers feed large frame buffers without contention, and the SoC form factor reduces board space inside constrained medical enclosures. The Extended temperature grade supports controlled medical environments reliably.
Recommended
Test and Measurement Equipment
Test and measurement instruments need fast deterministic fabric for protocol-aware capture and a Linux-class host for UI and analysis. The 10AS066H3F34E2SG meets this with 660K LE of Arria 10 SX fabric paired with the dual Cortex-A9 HPS, allowing one chip to drive high-speed ADC/DAC capture paths, trigger logic and on-board analysis. The 1152-ball FC-BGA exposes the LVDS and transceiver lanes needed for instrument front-ends, and the 0.9 V core helps manage chassis thermal load. Quartus Prime tool flow supports standard instrument IP cores.
Recommended
High-Speed Serial Interface Bridging
Protocol bridging between PCIe, Ethernet, JESD204B and custom serial links is a strong use case for the 10AS066H3F34E2SG. Its hardened transceivers and Protocol IP from the Arria 10 family handle the physical and data-link layers, while the 660K LE fabric implements protocol adaptation, buffering and packet processing. The HPS runs network stacks, management agents and user configuration. The 1152-pin F34 package brings out all necessary high-speed lanes, and SoC integration eliminates external host controllers on the bridge board.
Recommended
Software Defined Radio (SDR) Platforms
The 10AS066H3F34E2SG is widely used in SDR platforms because the 660K LE fabric can implement digital down-conversion, channelization and modulation/demodulation, while the dual ARM Cortex-A9 HPS runs GNU Radio or vendor SDR frameworks. This single-die SoC approach reduces latency between fabric DSP and host-side processing compared with two-chip designs. The 1.5 GHz fabric IP blocks handle demanding real-time DSP, and the 0.9 V core voltage keeps board power budget reasonable for portable SDR platforms.
Recommended
Recommended Products Summary
Engineering reference data for 10AS066H3F34E2SG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS066H3F34E2LG | 10AS066H3F34I2SG | 10AS066H2F34E2SG | 10AS066H2F34E2LG | 10AS066H1F34E1HG |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1152-FBGA, FC (35x35) | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same | 1152-FBGA, FC (35x35) - same |
| Family | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX | Arria 10 SX |
| Logic Elements | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 | 660,000 |
| Hard Processor System | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Speed Grade | H3 (Extended temp) | H3 | H3 | H2 | H2 | H1 |
| Operating Temperature Grade | Extended (E) | Extended (E) | Industrial (I) | Extended (E) | Extended (E) | Extended (E) |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
Key Differentiators
- Integrated dual-core ARM Cortex-A9 hard processor system (vs Non-SoC Arria 10 (10AX) family)
- H3 speed grade in Extended temperature (vs 10AS066H1F34E1HG (H1 speed grade))
- Same die/package across the 10AS066 SX family (vs 10AS048 Arria 10 SX variants)
Design Notes
The 1152-ball flip-chip BGA (35x35 mm) of the 10AS066H3F34E2SG demands high-density PCB stackup with microvia build-up layers. Use a stackup with at least 8 layers, dedicated ground and 0.9 V power planes placed adjacent to the core supply, and matched-length routing for DDR3/DDR4 interfaces to the HPS. Source: Altera Arria 10 SX device design guidelines.
Estimated: with a 20 nm Arria 10 SX die in a 35x35 mm FC-BGA, a worst-case utilization at room temperature can draw several watts; design the PCB with a continuous thermal copper pour under the package and consider forced airflow. Theta-JA depends heavily on PCB stackup; refer to the manufacturer thermal model for accurate junction-temperature estimates before locking the mechanical design.
Keep high-speed transceiver and DDR traces matched within the tolerance specified in the Arria 10 SX pin-out file. Place decoupling capacitors as close as practical to each power pin group and use the recommended decoupling network from the Arria 10 SX device schematic checklist. Source: Altera Arria 10 SX schematic review checklist.
Do not assume pin compatibility with non-SX Arria 10 devices (10AX series) - the SX adds dedicated HPS pins that are reserved on the AX. Also confirm the speed grade suffix in the MPN (H1, H2, H3) matches your timing requirements; substituting a lower speed grade can fail timing closure even if the package is identical.
Compliance Information
RoHS compliance and lead-free status taken from Altera/Intel product page for 10AS066 (F34). REACH, halogen-free, and conflict-minerals status were not stated in the Verified Web Data provided and are marked unknown.
