A3PE3000-1FG484 - 3M Gate ProASIC3E FPGA | Microchip
N.º de pieza: A3PE3000-1FG484 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $74.5 | $74,50 |
| 10 | $67 | $670,00 |
| 100 | $61.2 | $6.120,00 |
| 500 | $55.3 | $27.650,00 |
| 1.000 | $49.8 | $49.800,00 |
A3PE3000-1FG484 Descripción general
A Field Programmable Gate Array (FPGA) is an integrated circuit whose logic fabric can be programmed after manufacturing to implement arbitrary digital functions. The A3PE3000-1FG484 belongs to the ProASIC3E family, which is a flash-based FPGA family that combines reprogrammability with instant-on, live-at-power-up behavior. In the taxonomy of programmable logic, this part sits at FPGA level, above CPLD and below structured ASIC, while remaining a single-chip semiconductor solution for digital system integration.
Key features include 272MHz system performance, 3M system gates, 35K logic elements, 516,096 bits of true dual-port SRAM, and 341 available user I/O pins on the FG484 package. The flash configuration technology eliminates the need for external boot memory, allowing the device to power up immediately and reducing the total cost of ownership. The device is offered in a low-power 1.5V core and is supported by Microchip Libero SoC design tools.
The A3PE3000-1FG484 uses a 130nm, 7-layer-metal (6 copper) flash-based CMOS process. The flash cells are reprogrammable, enabling field upgrades and secure bitstream storage without external configuration PROMs. The ProASIC3E family includes global low-skew VersaNet networks for clocks and resets, and supports numerous single-ended and differential I/O standards as defined in the DS0098 datasheet.
Typical applications include industrial automation and control, communications infrastructure, medical imaging, automotive electronics, defense and aerospace systems, and IoT edge computing. The instant-on capability is particularly useful in safety-critical systems that must begin processing immediately after power application, while the 3M-gate density is suited to motor control, image processing, protocol bridging, and custom coprocessing tasks.
When designing with this FPGA, plan a clean 1.5V core supply with adequate decoupling on all VCC and VCCPLL balls. The 484-ball FBGA package with 1mm pitch requires a controlled BGA fanout strategy. Because the device is flash-based, power sequencing is simpler than SRAM-based FPGAs, but the recommended ramp and sequencing guidelines in the manufacturer datasheet should still be followed.
This page synthesizes distributor pricing, drop-in alternative parts, and practical PCB design guidance that are not all published in a single datasheet, enabling faster selection and design-in decisions for the A3PE3000-1FG484.
Alternativas directas para A3PE3000-1FG484 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3PE3000-1FG484 (mismo factor de forma y huella) — difiere en Package, Process Technology, Family, Core Supply Voltage, System Gates.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3PE3000-1FGG484I
✅ Sustitución directa✓ En stock
$1336.6 / unidad
Ver hoja de datos →A3PE3000-FG484
✅ Sustitución directa✓ En stock
$139.75 / unidad
Ver hoja de datos →A3PE3000-FG484I
✅ Sustitución directa✓ En stock
$98.6 / unidad
Ver hoja de datos →A3PE3000-1FGG484I
✅ Sustitución directa✓ En stock
$1336.6 / unidad
Ver hoja de datos →A3PE3000-2FG484I
✅ Sustitución directa✓ En stock
$59.6 / unidad
Ver hoja de datos →A3PE3000-2FGG484
✅ Sustitución directa✓ En stock
$28.9 / unidad
Ver hoja de datos →A3PE3000-1FG484 Valores máximos y características eléctricas
| Family | ProASIC3E |
| System Gates | 3M (3.00E6) |
| Logic Elements | 35KLEs |
| User I/Os | 341 |
| RAM Bits | 516096 bits |
| True Dual-Port SRAM | Up to 504 kbits (family) |
| Core Supply Voltage | 1.5V |
| System Performance | 272MHz |
| Process Technology | 130nm, 7-layer metal (6 copper), flash-based CMOS |
| Flash-Based | Yes, Live-At-Power-Up |
| Encapsulado | 484-ball FBGA (FG484), 1mm pitch |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | 0 to 70C |
| Configuration | Single-chip, no external boot PROM required |
| Level 0 Support | Yes |
Guía de configuración de pines de A3PE3000-1FG484 484-ball fbga (fg484), 1mm pitch
Configuración de pines para A3PE3000-1FG484 (encapsulado 484-ball fbga (fg484), 1mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3PE3000-1FG484.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3PE3000-1FG484 es adecuado para 6 aplicacións: Industrial Automation and Motor Control, Communications Infrastructure, Medical Imaging and Diagnostic Equipment, Automotive Electronics and Infotainment, Defense and Aerospace Computing, IoT Edge Computing and Smart Sensors.
Industrial Automation and Motor Control
The A3PE3000-1FG484 provides 3M gates and 341 user I/Os for implementing multi-axis motor control, PLC I/O bridging, and high-speed fieldbus interfaces. Its 1.5V core and flash-based live-at-power-up behavior let the controller begin executing logic immediately on power-up, reducing system boot time in safety-rated automation equipment. With 516,096 bits of true dual-port SRAM, designers can build local data buffers for Ethernet/IP, PROFINET, or Modbus TCP without external memory. The commercial 0C-70C range covers machine-room and cabinet installations. For wider ambient requirements, choose the -I suffix version. The instant-on characteristic is valuable in applications where a host processor must not be held in reset while configuration data streams from a flash device.
Recomendado
Communications Infrastructure
In networking and telecom line cards, the A3PE3000-1FG484 handles protocol bridging, packet parsing, and time-stamping with 272MHz system performance and 341 I/Os. The 3M gates are sufficient for small switch-fabric elements or deterministic traffic shaping logic. True dual-port SRAM blocks allow simultaneous read/write access for queue management and buffer control, which is important in high-throughput data paths. Flash-based configuration means the FPGA is ready immediately after power-up, enabling hitless protection switching and faster recovery in carrier-grade equipment. Designers must follow the datasheet I/O standards table to match 1.8V, 2.5V, or 3.3V transceivers; the BGA-484 package with 1mm pitch enables compact board layouts. Use the -2 speed grade for timing-critical 10GbE or CPRI interfaces.
Recomendado
Medical Imaging and Diagnostic Equipment
Medical ultrasound, CT, and MRI systems require deterministic, low-latency digital processing for image formation, filtering, and sensor interfacing. The A3PE3000-1FG484 delivers 3M gates and 516,096 bits of SRAM to implement beamforming coefficients, digital down-conversion, and image preprocessing. Its flash architecture eliminates the need for external configuration PROM on every board, reducing BOM size and improving system reliability in devices that must power on in seconds without software loading. The commercial temperature range suits controlled clinical environments. For high-reliability imaging consoles, add the M1 variant for ARM Cortex-M3 processing alongside the FPGA fabric. The 341 user I/Os allow direct connection to high-speed ADCs, LVDS sensors, and display controllers. Please verify EMC/ESD compliance per the system-level medical standard during layout.
Recomendado
Automotive Electronics and Infotainment
The A3PE3000-1FG484 supports automotive gateway, telematics, and infotainment bridge applications with 3M gates and a 1.5V core. Although the standard part is 0C-70C, the FG484 package family includes -I industrial variants commonly used in automotive body controllers and head units with proper thermal management. Flash-based live-at-power-up avoids the long configuration delays of SRAM FPGAs during ignition events. With 341 I/Os, it can interface to CAN transceivers, Ethernet PHYs, and LVDS display links. Use the M1 ProASIC3E family if ARM processor firmware is needed alongside FPGA logic. For production, order the FGG lead-free finish to meet RoHS/REACH requirements. Designers should follow AEC-Q100 practices and additional qualification requirements if the system demands it, as this product is not explicitly marketed as AEC-Q100 in the verified data.
Recomendado
Defense and Aerospace Computing
In defense/aerospace systems, the A3PE3000-1FG484 provides secure, flash-based FPGA fabric that is resistant to configuration bitstream readback attacks because the programming data is stored on-chip. The 3M gates and 341 user I/Os support custom encryption, telemetry, sensor processing, and interface conversion. Live-at-power-up is critical for mission computers that cannot wait for configuration from an external memory. The commercial temperature range limits use to sealed or temperature-controlled avionics bays; use -I variants for wider ambient operation. Additional radiation-tolerant or hi-rel qualification is not offered standard, so select a rad-tolerant ProASIC3E derivative if needed. This page provides drop-in alternatives with the same 484-ball BGA footprint to ease second-sourcing in long-life programs.
Recomendado
IoT Edge Computing and Smart Sensors
The A3PE3000-1FG484 can serve as the digital brain in high-end IoT edge nodes that require deterministic real-time response, multiple sensor interfaces, and secure boot. Its 1.5V core and flash configuration simplify power supplies because no SPI NOR configuration flash is needed. With 35K logic elements and 516,096 bits of SRAM, it can process sensor fusion, run lightweight neural-network inference, or implement custom protocol stacks in parallel with an external host SoC. Instant-on operation is valuable in battery-powered or energy-harvesting systems where the processor sleeps and the FPGA must react to wake events immediately. The 341 user I/Os can connect to cameras, MEMS microphones, environmental sensors, and wireless transceivers. For lower power, explore ProASIC3L variants such as M1A3PE3000L.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3PE3000-1FG484 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3PE3000-1FGG484 | A3PE3000-FG484I | A3PE3000-2FG484I |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | FBGA-484 (FG484) | FBGA-484 (FG484/FGG484) | FBGA-484 (FG484) | FBGA-484 (FG484) |
| System Gates | 3M | 3M | 3M | 3M |
| Logic Elements | 35KLEs | 35KLEs | 35KLEs | 35KLEs |
| User I/O | 341 | 341 | 341 | 341 |
| RAM Bits | 516096 bits | 516096 bits | 516096 bits | 516096 bits |
| Core Voltage | 1.5V | 1.5V | 1.5V | 1.5V |
| Speed Grade | -1 (272MHz system performance) | -1 (272MHz system performance) | Standard (base speed grade) | -2 (faster speed grade) |
| Operating Temperature | 0 to 70C | 0 to 70C | Industrial (typically -40C to 100C) | Industrial (typically -40C to 100C) |
Diferenciadores clave
- Live-at-power-up flash configuration (frente a SRAM-based FPGAs (e.g., Xilinx Spartan-6 or Intel MAX 10))
- -1 speed grade with 272MHz system performance in the FG484 package (frente a A3PE3000-FG484I (base speed grade))
- Commercial temperature range lowers cost (frente a A3PE3000-2FG484I (industrial -2 speed grade))
Notas de diseño
The A3PE3000-1FG484 core operates from a 1.5V supply. Place at least one 100nF ceramic capacitor on every VCC and VCCPLL ball and add a 10uF bulk capacitor per power bank. Because the device is flash-based, no external configuration voltage is required; however, follow the power-up sequencing requirements in the DS0098 datasheet to minimize inrush current and avoid undefined I/O states.
The FG484 package is a 484-ball FBGA with 1mm pitch. Use via-in-pad or dog-bone fanout depending on board density. Keep all high-speed differential pairs routed with controlled impedance and matched length, and place ground vias near signal vias to reduce return-path inductance. The package pinout should be obtained from the official Microchip DS0098 pin table, not from third-party sources.
Do not assume all 616 family I/Os are available on the FG484 package; this part exposes 341 user I/Os. Verify bank voltage assignments according to the I/O standards used. Since the device is flash-based and can be reprogrammed in-system, take care not to drive the programming pins from high-voltage supplies during normal operation. Also confirm the operating temperature range versus your enclosure environment.
Información de cumplimiento
RoHS/REACH status not explicitly provided in the verified web data. FGG suffix variants are commonly associated with lead-free finish, but this should be confirmed with the manufacturer datasheet or Microchip sales before production.
