Microchip Technology

A3PE3000-1FG484 - 3M Gate ProASIC3E FPGA | Microchip

부품 번호: A3PE3000-1FG484 ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.5V Vdss 484-ball FBGA (FG484), 1mm pitch Package Yes, Live-At-Power-Up Memory
시작가 $49.8 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-01
볼륨 가격
수량 단가 합계
1 $74.5 $74.50
10 $67 $670.00
100 $61.2 $6,120.00
500 $55.3 $27,650.00
1,000 $49.8 $49,800.00
ℹ️ 모든 가격은 USD 기준입니다

A3PE3000-1FG484 개요

The Microchip Technology A3PE3000-1FG484 is a ProASIC3E flash-based Field Programmable Gate Array (FPGA) with 3 million system gates, 35,000 logic elements, 516,096 bits of true dual-port SRAM, and 341 user I/O signals, supplied in a 484-ball FBGA (FG484) package with 1mm pitch. It uses a 1.5V core supply and is built on a 130nm, 7-layer-metal flash CMOS process.

A Field Programmable Gate Array (FPGA) is an integrated circuit whose logic fabric can be programmed after manufacturing to implement arbitrary digital functions. The A3PE3000-1FG484 belongs to the ProASIC3E family, which is a flash-based FPGA family that combines reprogrammability with instant-on, live-at-power-up behavior. In the taxonomy of programmable logic, this part sits at FPGA level, above CPLD and below structured ASIC, while remaining a single-chip semiconductor solution for digital system integration.

Key features include 272MHz system performance, 3M system gates, 35K logic elements, 516,096 bits of true dual-port SRAM, and 341 available user I/O pins on the FG484 package. The flash configuration technology eliminates the need for external boot memory, allowing the device to power up immediately and reducing the total cost of ownership. The device is offered in a low-power 1.5V core and is supported by Microchip Libero SoC design tools.

The A3PE3000-1FG484 uses a 130nm, 7-layer-metal (6 copper) flash-based CMOS process. The flash cells are reprogrammable, enabling field upgrades and secure bitstream storage without external configuration PROMs. The ProASIC3E family includes global low-skew VersaNet networks for clocks and resets, and supports numerous single-ended and differential I/O standards as defined in the DS0098 datasheet.

Typical applications include industrial automation and control, communications infrastructure, medical imaging, automotive electronics, defense and aerospace systems, and IoT edge computing. The instant-on capability is particularly useful in safety-critical systems that must begin processing immediately after power application, while the 3M-gate density is suited to motor control, image processing, protocol bridging, and custom coprocessing tasks.

When designing with this FPGA, plan a clean 1.5V core supply with adequate decoupling on all VCC and VCCPLL balls. The 484-ball FBGA package with 1mm pitch requires a controlled BGA fanout strategy. Because the device is flash-based, power sequencing is simpler than SRAM-based FPGAs, but the recommended ramp and sequencing guidelines in the manufacturer datasheet should still be followed.

This page synthesizes distributor pricing, drop-in alternative parts, and practical PCB design guidance that are not all published in a single datasheet, enabling faster selection and design-in decisions for the A3PE3000-1FG484.

드롭인 대체품: A3PE3000-1FG484 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: A3PE3000-1FG484 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Family, Core Supply Voltage, System Gates.

Microchip Technology
Package: 484-BGA (FBGA-484, 1 mm pitch)
Process Technology: 130-nm, 7-layer metal (6 copper) flash-based CMOS
Family: ProASIC3E (Flash-based FPGA)
비교 대상: A3PE3000-1FG484 →
Microchip Technology
Package: 484-ball FBGA, 1.0 mm pitch (FGG484)
Process Technology: 130-nm, 7-layer metal (6 copper), flash-based CMOS
System Gates: 3,000,000 (3M)
비교 대상: A3PE3000-1FG484 →
Microchip Technology
Package: 484-pin FBGA (23x23 mm, 1.0 mm pitch)
Process Technology: 130 nm
Core Supply Voltage: 1.5 V
비교 대상: A3PE3000-1FG484 →
Microchip Technology
Package: 484-ball FBGA (23 x 23 mm, 1.0 mm pitch)
Process Technology: 130 nm
Family: ProASIC3E (A3PE3000)
비교 대상: A3PE3000-1FG484 →
Microchip Technology
Package: 484-ball FBGA (FG484), 23 x 23 mm, 1.0 mm pitch, 2.23 mm height
Process Technology: 130 nm flash CMOS
Family: ProASIC3E Flash FPGA
비교 대상: A3PE3000-1FG484 →
Microchip Technology
Package: 484-BGA (FBGA-484)
Process Technology: 130 nm
Family: ProASIC3E (Flash FPGA)
비교 대상: A3PE3000-1FG484 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

A3PE3000-1FGG484I

✅ 드롭인
Microchip Technology
📦 FBGA-484 (FG484)
ProASIC3E · 3,000,000 (3M) · 35,000 · 504 Kbits (516,096 bits) · 341 · 484 · 484-ball FBGA, 1.0 mm pitch (FGG484) · CMOS

✓ 재고 있음

$1336.6 / 개

데이터시트 보기 →

A3PE3000-FG484

✅ 드롭인
Microchip Technology
📦 FBGA-484 (FG484)
ProASIC3E Flash FPGA · 3000000 · 75264 · 341 · 1.5 V · 231 MHz · 130 nm flash CMOS · On-chip flash (non-volatile, single-chip)

✓ 재고 있음

$139.75 / 개

데이터시트 보기 →

A3PE3000-FG484I

✅ 드롭인
Microchip Technology
📦 FBGA-484 (FG484)
ProASIC3E (Flash FPGA) · 3000000 · 35K · 341 · 516096 bit (504 Kbit) · 1 Kbit · 1.425 V to 1.575 V (1.5 V nominal) · 130 nm

✓ 재고 있음

$98.6 / 개

데이터시트 보기 →

A3PE3000-1FGG484I

✅ 드롭인
Microchip Technology
📦 FBGA-484 (FG484)
ProASIC3E · 3,000,000 (3M) · 35,000 · 504 Kbits (516,096 bits) · 341 · 484 · 484-ball FBGA, 1.0 mm pitch (FGG484) · CMOS

✓ 재고 있음

$1336.6 / 개

데이터시트 보기 →

A3PE3000-2FG484I

✅ 드롭인
Microchip Technology
📦 FBGA-484 (FG484)
ProASIC3E · 3,000,000 · 75,264 · 516,096 · 341 · 310 MHz · 1.5 V · 130 nm

✓ 재고 있음

$59.6 / 개

데이터시트 보기 →

A3PE3000-2FGG484

✅ 드롭인
Microchip Technology
📦 FBGA-484 (FG484)
ProASIC3E (A3PE3000) · 3,000,000 · 75,264 · 516,096 · 341 · -2 · 310 MHz · 1.5 V (1.425 V to 1.575 V)

✓ 재고 있음

$28.9 / 개

데이터시트 보기 →

A3PE3000-1FG484 최대 정격 & 전기적 특성

Family ProASIC3E
System Gates 3M (3.00E6)
Logic Elements 35KLEs
User I/Os 341
RAM Bits 516096 bits
True Dual-Port SRAM Up to 504 kbits (family)
Core Supply Voltage 1.5V
System Performance 272MHz
Process Technology 130nm, 7-layer metal (6 copper), flash-based CMOS
Flash-Based Yes, Live-At-Power-Up
패키지 484-ball FBGA (FG484), 1mm pitch
실장 유형 Surface Mount
동작 온도 0 to 70C
Configuration Single-chip, no external boot PROM required
Level 0 Support Yes

A3PE3000-1FG484 484-ball fbga (fg484), 1mm pitch 핀 구성 가이드

A3PE3000-1FG484(484-ball fbga (fg484), 1mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

A3PE3000-1FG484의 484-ball fbga (fg484), 1mm pitch 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: A3PE3000-1FG484.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

A3PE3000-1FG484 적합 용도: 6 애플리케이션s: Industrial Automation and Motor Control, Communications Infrastructure, Medical Imaging and Diagnostic Equipment, Automotive Electronics and Infotainment, Defense and Aerospace Computing, IoT Edge Computing and Smart Sensors.

🏭

Industrial Automation and Motor Control

The A3PE3000-1FG484 provides 3M gates and 341 user I/Os for implementing multi-axis motor control, PLC I/O bridging, and high-speed fieldbus interfaces. Its 1.5V core and flash-based live-at-power-up behavior let the controller begin executing logic immediately on power-up, reducing system boot time in safety-rated automation equipment. With 516,096 bits of true dual-port SRAM, designers can build local data buffers for Ethernet/IP, PROFINET, or Modbus TCP without external memory. The commercial 0C-70C range covers machine-room and cabinet installations. For wider ambient requirements, choose the -I suffix version. The instant-on characteristic is valuable in applications where a host processor must not be held in reset while configuration data streams from a flash device.

🌐

Communications Infrastructure

In networking and telecom line cards, the A3PE3000-1FG484 handles protocol bridging, packet parsing, and time-stamping with 272MHz system performance and 341 I/Os. The 3M gates are sufficient for small switch-fabric elements or deterministic traffic shaping logic. True dual-port SRAM blocks allow simultaneous read/write access for queue management and buffer control, which is important in high-throughput data paths. Flash-based configuration means the FPGA is ready immediately after power-up, enabling hitless protection switching and faster recovery in carrier-grade equipment. Designers must follow the datasheet I/O standards table to match 1.8V, 2.5V, or 3.3V transceivers; the BGA-484 package with 1mm pitch enables compact board layouts. Use the -2 speed grade for timing-critical 10GbE or CPRI interfaces.

💊

Medical Imaging and Diagnostic Equipment

Medical ultrasound, CT, and MRI systems require deterministic, low-latency digital processing for image formation, filtering, and sensor interfacing. The A3PE3000-1FG484 delivers 3M gates and 516,096 bits of SRAM to implement beamforming coefficients, digital down-conversion, and image preprocessing. Its flash architecture eliminates the need for external configuration PROM on every board, reducing BOM size and improving system reliability in devices that must power on in seconds without software loading. The commercial temperature range suits controlled clinical environments. For high-reliability imaging consoles, add the M1 variant for ARM Cortex-M3 processing alongside the FPGA fabric. The 341 user I/Os allow direct connection to high-speed ADCs, LVDS sensors, and display controllers. Please verify EMC/ESD compliance per the system-level medical standard during layout.

🚗

Automotive Electronics and Infotainment

The A3PE3000-1FG484 supports automotive gateway, telematics, and infotainment bridge applications with 3M gates and a 1.5V core. Although the standard part is 0C-70C, the FG484 package family includes -I industrial variants commonly used in automotive body controllers and head units with proper thermal management. Flash-based live-at-power-up avoids the long configuration delays of SRAM FPGAs during ignition events. With 341 I/Os, it can interface to CAN transceivers, Ethernet PHYs, and LVDS display links. Use the M1 ProASIC3E family if ARM processor firmware is needed alongside FPGA logic. For production, order the FGG lead-free finish to meet RoHS/REACH requirements. Designers should follow AEC-Q100 practices and additional qualification requirements if the system demands it, as this product is not explicitly marketed as AEC-Q100 in the verified data.

✈️

Defense and Aerospace Computing

In defense/aerospace systems, the A3PE3000-1FG484 provides secure, flash-based FPGA fabric that is resistant to configuration bitstream readback attacks because the programming data is stored on-chip. The 3M gates and 341 user I/Os support custom encryption, telemetry, sensor processing, and interface conversion. Live-at-power-up is critical for mission computers that cannot wait for configuration from an external memory. The commercial temperature range limits use to sealed or temperature-controlled avionics bays; use -I variants for wider ambient operation. Additional radiation-tolerant or hi-rel qualification is not offered standard, so select a rad-tolerant ProASIC3E derivative if needed. This page provides drop-in alternatives with the same 484-ball BGA footprint to ease second-sourcing in long-life programs.

🧩

IoT Edge Computing and Smart Sensors

The A3PE3000-1FG484 can serve as the digital brain in high-end IoT edge nodes that require deterministic real-time response, multiple sensor interfaces, and secure boot. Its 1.5V core and flash configuration simplify power supplies because no SPI NOR configuration flash is needed. With 35K logic elements and 516,096 bits of SRAM, it can process sensor fusion, run lightweight neural-network inference, or implement custom protocol stacks in parallel with an external host SoC. Instant-on operation is valuable in battery-powered or energy-harvesting systems where the processor sleeps and the FPGA must react to wake events immediately. The 341 user I/Os can connect to cameras, MEMS microphones, environmental sensors, and wireless transceivers. For lower power, explore ProASIC3L variants such as M1A3PE3000L.

Where can I buy A3PE3000-1FG484?
You can order A3PE3000-1FG484 from authorized distributors including Mouser, Digi-Key, Arrow, and Octopart-listed channels. As of 2026-09-01, Mouser lists the part as ProASIC3 FPGA/35KLEs and DigiKey shows it as an active ProASIC3E FPGA IC in 484-BGA. Stock availability fluctuates, so request a quote from XAIPART for current lead time and volume pricing.
What is the price of A3PE3000-1FG484?
As of 2026-09-01, distributor pricing for A3PE3000-1FG484 is approximately $74.50 at quantity 1, decreasing to about $49.80 at quantity 1000. Prices vary across Mouser, DigiKey, Arrow, and Octopart channels. XAIPART can provide a firm quote for your target quantity and delivery date.
What is the lead time for A3PE3000-1FG484?
Lead time depends on distributor inventory. DigiKey indicates the part can ship the same day when stock is available, while out-of-stock orders may require 8 to 12 weeks due to semiconductor manufacturing lead times. For large-volume or allocation-sensitive projects, contact XAIPART for the latest lead-time information.
A3PE3000-1FG484 vs A3PE3000-2FG484I - what is the difference?
The A3PE3000-2FG484I uses the -2 speed grade, which offers higher guaranteed system performance than the -1 grade, and has an industrial temperature range (typically -40C to 100C), while the A3PE3000-1FG484 is a -1 part with a 0C to 70C commercial range. Both share the same FG484 484-ball FBGA footprint and 3M gate density, making the -2 industrial variant drop-in compatible on the same PCB.
A3PE3000-1FG484 vs A3PE3000-1FGG484 - what is the difference?
The A3PE3000-1FGG484 is the same die, same speed grade, and same 484-ball FBGA footprint as the A3PE3000-1FG484, but uses the FGG lead-free finish instead of the FG finish. Electrical logic, pinout, and in-system operation are identical. Choose the FGG variant when your assembly process requires RoHS-compliant lead-free solder.
When should I choose A3PE3000-1FG484 over A3PE3000-FG484?
Choose the A3PE3000-1FG484 when you need the guaranteed -1 speed grade, providing 272MHz system performance. The base A3PE3000-FG484 has a lower or standard speed-grade suffix and is suitable for less timing-critical designs. On the same PCB footprint, the -1 part gives better timing margins but may carry a slight price premium.
Is A3PE3000-1FG484 suitable for industrial applications?
The standard A3PE3000-1FG484 is specified for 0C to 70C operation, so it is suitable for commercial and controlled industrial environments. For full industrial ambient temperature ranges, choose a -I suffix variant such as A3PE3000-FG484I or A3PE3000-2FG484I. These share the same package and pinout but add the wider temperature operation.
What is the best drop-in replacement for A3PE3000-1FG484?
The best drop-in replacements are Microchip ProASIC3E variants in the same FG484 484-ball package: A3PE3000-FG484, A3PE3000-1FGG484, A3PE3000-1FGG484I, A3PE3000-2FG484I, and A3PE3000-2FGG484. All share the same 484-ball BGA footprint and pinout, with differences only in speed grade, temperature range, and finish. Always verify speed/thermal requirements before substitution.
Where can I download A3PE3000-1FG484 datasheet PDF?
The official datasheet, Microchip ProASIC3E Flash Family FPGAs (DS0098), is available from the Microchip product page and Mouser's datasheet library. The ProASIC3E FPGA Fabric User's Guide is also accessible from Microchip's documentation portal. Search for 'A3PE3000' on Microchip.com to find the LATEST version and package pinout files.
What are the key specifications of A3PE3000-1FG484 that engineers should know?
The A3PE3000-1FG484 contains 3 million system gates, 35,000 logic elements, 516,096 bits of true dual-port SRAM, and 341 user I/O pins in a 484-ball FBGA. It operates from a 1.5V core supply, uses 130nm 7-layer-metal flash CMOS, and supports 272MHz system performance. Its flash-based architecture provides live-at-power-up operation and eliminates external boot memory.
What is the operating voltage of A3PE3000-1FG484?
The core supply voltage of the A3PE3000-1FG484 is 1.5VDC, as stated in Microchip's ProASIC3E datasheet DS0098. I/O bank voltages depend on the selected I/O standard and are defined by the VCCO pins in the datasheet. Additional programming and auxiliary supplies may be required for in-system programming operations.
Is A3PE3000-1FG484 a flash-based FPGA?
Yes, the A3PE3000-1FG484 uses Microchip's flash-based ProASIC3E fabric manufactured on a 130nm CMOS process with seven metal layers. Flash configuration eliminates the need for external boot PROM, enables live-at-power-up, and provides instant-on operation. This makes the device well suited to security-sensitive and safety-critical systems that cannot wait for SRAM-based configuration loading.
What FPGA families are equivalent to A3PE3000-1FG484?
Within Microchip, M1 ProASIC3E parts such as M1A3PE3000-1FGG484 provide FPGA plus ARM Cortex-M3 capability in the same package family, but are not direct FG484 drop-ins without checking the exact ball map. Third-party sites sometimes mention Lattice MachXO2, Xilinx Spartan-6, or Intel MAX 10, but those are different package families and are not pin-compatible with the FG484 484-ball footprint. Always verify package and pinout before substituting.
What voltage supplies are needed for A3PE3000-1FG484?
The A3PE3000-1FG484 needs a 1.5V core supply. I/O supplies depend on the I/O standards implemented in each bank; the DS0098 datasheet specifies the VCCO ranges for standards such as LVCMOS, LVTTL, and differential pairs. Follow the power-up sequence and decoupling recommendations in the datasheet to avoid latch-up or startup failures.

엔지니어링 참조 데이터: A3PE3000-1FG484 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the A3PE3000-1FG484 when you need a 3M-gate ProASIC3E FPGA with a proven -1 speed grade (272MHz), 341 user I/Os, and live-at-power-up flash behavior in a 484-ball FBGA. It is ideal for industrial automation, communications infrastructure, medical imaging, and high-end IoT nodes where instant-on and single-chip configuration are valuable. If your assembly line mandates lead-free finish, select A3PE3000-1FGG484. If your application must operate at -40C, use A3PE3000-FG484I or A3PE3000-2FG484I. If you need even higher system performance, choose the -2 speed grade parts. For automotive-like environments, confirm that the system-level qualification meets your needs because this part is not explicitly AEC-Q100 in the verified data. All listed alternatives share the same FG484 footprint, making PCB reuse trivial.

대체품과의 비교

파라미터 이 제품 A3PE3000-1FGG484 A3PE3000-FG484I A3PE3000-2FG484I
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package FBGA-484 (FG484) FBGA-484 (FG484/FGG484) FBGA-484 (FG484) FBGA-484 (FG484)
System Gates 3M 3M 3M 3M
Logic Elements 35KLEs 35KLEs 35KLEs 35KLEs
User I/O 341 341 341 341
RAM Bits 516096 bits 516096 bits 516096 bits 516096 bits
Core Voltage 1.5V 1.5V 1.5V 1.5V
Speed Grade -1 (272MHz system performance) -1 (272MHz system performance) Standard (base speed grade) -2 (faster speed grade)
Operating Temperature 0 to 70C 0 to 70C Industrial (typically -40C to 100C) Industrial (typically -40C to 100C)

주요 차별점

  • Live-at-power-up flash configuration (vs SRAM-based FPGAs (e.g., Xilinx Spartan-6 or Intel MAX 10))
  • -1 speed grade with 272MHz system performance in the FG484 package (vs A3PE3000-FG484I (base speed grade))
  • Commercial temperature range lowers cost (vs A3PE3000-2FG484I (industrial -2 speed grade))

설계 노트

The A3PE3000-1FG484 core operates from a 1.5V supply. Place at least one 100nF ceramic capacitor on every VCC and VCCPLL ball and add a 10uF bulk capacitor per power bank. Because the device is flash-based, no external configuration voltage is required; however, follow the power-up sequencing requirements in the DS0098 datasheet to minimize inrush current and avoid undefined I/O states.

The FG484 package is a 484-ball FBGA with 1mm pitch. Use via-in-pad or dog-bone fanout depending on board density. Keep all high-speed differential pairs routed with controlled impedance and matched length, and place ground vias near signal vias to reduce return-path inductance. The package pinout should be obtained from the official Microchip DS0098 pin table, not from third-party sources.

Do not assume all 616 family I/Os are available on the FG484 package; this part exposes 341 user I/Os. Verify bank voltage assignments according to the I/O standards used. Since the device is flash-based and can be reprogrammed in-system, take care not to drive the programming pins from high-voltage supplies during normal operation. Also confirm the operating temperature range versus your enclosure environment.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

RoHS/REACH status not explicitly provided in the verified web data. FGG suffix variants are commonly associated with lead-free finish, but this should be confirmed with the manufacturer datasheet or Microchip sales before production.

데이터 검증일: 2026-09-01 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

Microchip Technology A3PE3000 A3PE3000-1FG484 A3PE3000-2FG484I A3PE3000-1FGG484 ProASIC3E FPGA Field Programmable Gate Array flash-based FPGA Live-At-Power-Up FBGA-484 FG484 130nm CMOS 7-layer metal 1.5V core supply 272MHz system performance DS0098 341 user I/O 516096 bits SRAM 3M system gates
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