A3PE3000-2FG484I - ProASIC3E FPGA 3M Gates | Microchip
MPN: A3PE3000-2FG484I β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82.3 | $823.00 |
| 100 | $74.1 | $7,410.00 |
| 500 | $66.8 | $33,400.00 |
| 1,000 | $59.6 | $59,600.00 |
Drop-in alternatives for A3PE3000-2FG484I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
A3PE3000-2FGG484I
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000-2FG484
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000-2FGG484
β Drop-Inβ In Stock
$28.9 / Unit
View Datasheet βA3PE3000-1FG484I
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000-1FGG484I
β Drop-Inβ In Stock
$1336.6 / Unit
View Datasheet βA3PE3000-2FG484I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E |
| Total System Gates | 3,000,000 |
| Logic Cells (CLBs) | 75,264 |
| RAM Bits | 516,096 |
| User I/O Count | 341 |
| Maximum System Performance | 310 MHz |
| Core Supply Voltage | 1.5 V |
| Process Technology | 130 nm |
| Package | 484-pin FBGA (23x23 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40C to +100C (industrial) |
| Configuration Type | Flash-based (non-volatile) |
| I/O Standards Supported | LVCMOS, LVTTL, PCI, LVDS, LVPECL, etc. |
| PLLs / CCCs | 6 / 6 |
| RoHS Status | Compliant |
A3PE3000-2FG484I 484-pin fbga (23x23 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for A3PE3000-2FG484I (484-pin fbga (23x23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-2FG484I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-2FG484I is suitable for 6 applications: Industrial Automation, Communications Infrastructure, Medical Imaging, Aerospace and Defense, Consumer Electronics, Automotive Electronics.
Industrial Automation
The A3PE3000-2FG484I is ideal for industrial automation systems such as PLCs, motor control, and robotics. Its 3M gates and 341 I/Os allow implementation of complex control logic, communication interfaces (Ethernet, CAN, RS-485), and sensor fusion. The flash-based, non-volatile configuration ensures instant-on operation and high reliability in harsh environments. With 310 MHz performance, it can handle real-time processing tasks, while the 1.5V core reduces power consumption. The industrial temperature grade (-40C to +100C) makes it suitable for factory floors and outdoor installations. Its secure configuration prevents unauthorized access, protecting intellectual property in competitive industrial markets.
Recommended
Communications Infrastructure
In communications infrastructure, the A3PE3000-2FG484I excels in implementing protocol controllers, packet processing, and interface bridging. Its 516,096 bits of RAM provide ample buffering for data packets, while 341 I/Os support multiple high-speed interfaces like LVDS and LVPECL. The 310 MHz system performance enables line-rate processing for Gigabit Ethernet and other protocols. The device's low power consumption is critical for densely populated network equipment. Its non-volatile configuration ensures secure boot and prevents bitstream tampering, which is essential for network security. The 484-pin FBGA package offers good signal integrity for high-speed PCB designs.
Recommended
Medical Imaging
The A3PE3000-2FG484I is well-suited for medical imaging systems such as ultrasound, MRI, and CT scanners. Its 3M gates can implement image processing algorithms, sensor interfaces, and display controllers. The 516,096 bits of RAM support frame buffering and line storage. The device's high reliability and long-term availability are critical for medical devices with extended lifecycles. The flash-based configuration provides instant-on capability, reducing startup time in critical diagnostic equipment. The industrial temperature grade ensures operation in controlled clinical environments. Its secure configuration protects proprietary imaging algorithms from reverse engineering.
Recommended
Aerospace and Defense
The A3PE3000-2FG484I is a trusted choice for aerospace and defense applications due to its flash-based, non-volatile configuration that provides inherent security against reverse engineering and tampering. It is used in avionics, radar, electronic warfare, and secure communication systems. The 3M gates and 341 I/Os enable complex signal processing and interface management. The device's radiation-tolerant characteristics (though not fully rad-hard) make it suitable for certain space applications. Its instant-on capability is crucial for mission-critical systems. The industrial temperature grade and high reliability meet military standards. The 484-pin FBGA package offers robust mechanical integrity for harsh environments.
Recommended
Consumer Electronics
In consumer electronics, the A3PE3000-2FG484I can be used in smart home hubs, gaming peripherals, and multimedia devices. Its 3M gates provide ample logic for implementing user interfaces, protocol stacks, and audio/video processing. The 1.5V core and low power consumption extend battery life in portable devices. The flash-based configuration allows field updates via JTAG or SPI, enabling feature upgrades. The device's small footprint (23x23 mm) fits compact PCBs. Its non-volatile configuration eliminates the need for external configuration memory, reducing BOM cost. The industrial temperature grade ensures reliable operation in various consumer environments.
Recommended
Automotive Electronics
The A3PE3000-2FG484I is suitable for automotive applications such as infotainment systems, advanced driver-assistance systems (ADAS), and body control modules. Its 3M gates can implement video processing, sensor fusion, and communication interfaces (CAN, LIN, FlexRay). The device's flash-based configuration provides instant-on capability, essential for safety-critical systems. The industrial temperature grade (-40C to +100C) covers automotive under-hood and cabin environments. Its high reliability and long-term availability meet automotive quality requirements. The secure configuration protects against unauthorized modifications, enhancing vehicle security. The 484-pin FBGA package is suitable for automotive PCBs with proper thermal management.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-2FG484I β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-2FGG484I | A3PE3000-2FG484 | A3PE3000-2FGG484 | A3PE3000-1FG484I | A3PE3000-1FGG484I |
|---|---|---|---|---|---|---|
| Package | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA | 484-pin FBGA |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Total System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 |
| RAM Bits | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 | 516,096 |
| User I/O Count | 341 | 341 | 341 | 341 | 341 | 341 |
| Maximum System Performance | 310 MHz | 310 MHz | 310 MHz | 310 MHz | 250 MHz | 250 MHz |
| Operating Temperature Range | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | -40C to +100C | -40C to +100C |
Key Differentiators
- Industrial temperature grade (-40C to +100C) (vs A3PE3000-2FG484)
- Higher speed grade (310 MHz) (vs A3PE3000-1FG484I)
- Tin-lead finish for legacy processes (vs A3PE3000-2FGG484I)
Design Notes
The A3PE3000-2FG484I requires a 1.5V core supply and separate I/O supply voltages (typically 1.5V, 1.8V, 2.5V, or 3.3V depending on I/O standard). Use a dedicated voltage regulator for the core and ensure adequate decoupling: place 0.1uF and 10uF capacitors close to each VCC and GND pin. The total power consumption depends on logic utilization and toggle rate; estimate using the Microchip power calculator. For high-speed designs, consider using multiple power planes to minimize noise.
For the 484-pin FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm single-ended, 100 ohm differential). Place decoupling capacitors on the bottom side directly under the FPGA to minimize loop inductance. Follow the layout guidelines in the Microchip ProASIC3E user guide for optimal signal integrity. Ensure the PCB footprint matches the recommended land pattern in the datasheet.
A common pitfall is forgetting to connect the JTAG programming pins (TCK, TMS, TDI, TDO) to a header for in-system programming. Also, ensure the VCCPLL pins are properly connected to the PLL supply voltage (1.5V) and decoupled. Do not leave unused I/O pins floating; configure them as inputs with pull-ups or as outputs to avoid excessive current draw. Verify that the configuration voltage (VCC) is within the specified range to prevent programming failures.
Compliance Information
The -2FG484I has tin-lead finish, so it is not lead-free. RoHS compliance is indicated by the 'G' suffix in the part number; this part does not have the 'G', so it is not RoHS-compliant. For RoHS-compliant version, use A3PE3000-2FGG484I.
