A3PE3000L-1FG896I - 3M-Gate Low-Power Flash FPGA | Microchip
N.º de pieza: A3PE3000L-1FG896I ✓ Activo| Cant. | Precio unitario | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
A3PE3000L-1FG896I Descripción general
A flash FPGA is a field-programmable gate array whose configuration is stored in on-chip non-volatile flash memory rather than an external configuration PROM. Within the programmable logic hierarchy, the ProASIC3L sits under the broader FPGA and programmable logic device categories and is distinguished from SRAM FPGAs by its single-chip, instant-on, secure, reprogrammable architecture.
Key differentiating features include Flash*Freeze technology, which allows near-zero static power consumption while retaining state; live reprogrammability; single-chip operation with no external boot device; weak pull-up/down options and Schmitt trigger inputs on single-ended I/Os (A3PE3000L); and IEEE 1149.1 (JTAG) boundary scan test support. Pin-compatible packages across the ProASIC3L family simplify migration between densities.
Technically, the device uses a 130 nm CMOS flash process with a Sea-of-Tiles switch fabric. The low core voltage (1.2 V nominal) plus Flash*Freeze mode yields very low static power, making it suited to battery-sensitive and thermally constrained systems. The 896-ball FBGA offers a 1.00 mm ball pitch for surface mounting.
Typical applications include industrial automation and control, portable and battery-powered instrumentation, secure military and communications systems, and bridge/interconnect logic where instant-on and configuration security matter.
A key design consideration is power-rail sequencing: the ProASIC3L requires the 2.5 V I/O/auxiliary supply and 1.2 V core supply per datasheet recommendations, and Flash*Freeze entry/exit timing should be validated in system.
This page synthesizes distributor availability data, drop-in alternatives within the same FG896 footprint, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para A3PE3000L-1FG896I — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con A3PE3000L-1FG896I (mismo factor de forma y huella) — difiere en Package, Family, Configuration Memory, Operating Temperature, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
A3PE3000L-1FGG896I
✅ Sustitución directa✓ En stock
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Ver hoja de datos →A3PE3000L-1FGG896
✅ Sustitución directa✓ En stock
$255 / unidad
Ver hoja de datos →A3PE3000L-FGG896I
✅ Sustitución directa✓ En stock
$139.9 / unidad
Ver hoja de datos →A3PE3000L-FG896I
✅ Sustitución directa✓ En stock
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Ver hoja de datos →A3PE3000L-1FGG896M
✅ Sustitución directa✓ En stock
$432 / unidad
Ver hoja de datos →A3PE3000L-FGG896M
✅ Sustitución directa✓ En stock
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Ver hoja de datos →A3PE3000L-FGG896
✅ Sustitución directa✓ En stock
$55 / unidad
Ver hoja de datos →A3PE3000-FGG896I
✅ Sustitución directa✓ En stock
$135.2 / unidad
Ver hoja de datos →A3PE3000L-1FG896I Valores máximos y características eléctricas
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/O | 620 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash |
| Maximum Frequency | 892.86 MHz |
| Encapsulado | 896-ball FBGA (FG896), 1.00 mm pitch |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +85C (Industrial) |
| Configuration Memory | On-chip Flash (non-volatile, single chip) |
| Low Power Feature | Flash*Freeze Technology |
| JTAG Boundary Scan | IEEE 1149.1 |
| Input Options | Schmitt trigger option on single-ended inputs |
| Pull Options | Weak pull-up / pull-down |
| Reprogrammability | Live reprogrammable |
| Speed Grade | -1 |
Guía de configuración de pines de A3PE3000L-1FG896I 896-ball fbga (fg896), 1.00 mm pitch
Configuración de pines para A3PE3000L-1FG896I (encapsulado 896-ball fbga (fg896), 1.00 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para A3PE3000L-1FG896I.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
A3PE3000L-1FG896I es adecuado para 6 aplicacións: Industrial Automation and Control, Battery-Powered Portable Instrumentation, Secure Military and Aerospace Systems, Communications Bridge and Interconnect Logic, Test and Measurement Equipment, Medical Diagnostic Equipment.
Industrial Automation and Control
The A3PE3000L-1FG896I fits industrial automation backplanes and machine-control logic because its 75,264 logic cells and 620 I/Os integrate large glue-logic, sequencing, and interfacing functions that would otherwise require multiple ASICs or CPLDs. The industrial -40C to +85C rating covers unconditioned factory floors, and the Schmitt trigger input option improves noise immunity on long field-wired signals. Instant-on flash configuration means the FPGA is functional within microseconds of power-up, which is valuable in safety-oriented machines that must respond immediately after power restoration. Place it between PLC communication controllers and I/O expansion; with 1.2 V core operation, board-level power budgets stay manageable even at high gate utilization, though Flash*Freeze entry timing should be validated against system standby requirements.
Recomendado
Battery-Powered Portable Instrumentation
Portable and handheld instruments benefit directly from the ProASIC3L value proposition: 130 nm flash technology with a 1.2 V core and Flash*Freeze technology that cuts static power to near zero while preserving register state. Between measurements, the system can drop into Flash*Freeze via the dedicated pin and resume in microseconds, avoiding the energy cost of FPGA reconfiguration that SRAM devices would incur. The 620 available I/Os support dense LCD, sensor-array, and peripheral interfaces in a single chip, simplifying the PCB in space-constrained enclosures. Because configuration is stored on-chip, there is no external boot flash drawing current at every wake cycle. Designers should budget the 2.5 V auxiliary rail carefully and debounce the Flash*Freeze control signal to prevent spurious mode transitions from mechanical switches or noise.
Recomendado
Secure Military and Aerospace Systems
Flash FPGAs are preferred in defense electronics because on-chip flash configuration cannot be read back like SRAM bitstreams, reducing cloning and reverse-engineering risk. The A3PE3000L-1FG896I's M-suffix military-flow siblings (e.g., A3PE3000L-1FGG896M) extend this to qualified flows, while the standard I-grade device supports -40C to +85C industrial-military environments. The 896-ball FBGA provides the 620 I/Os needed for bus interfaces, radar preprocessing, and secure communications datapaths, and IEEE 1149.1 JTAG boundary scan supports board-level test continuity programs. Single-chip, instant-on configuration removes configuration PROMs, a common failure and tamper point in SRAM FPGA systems. For new defense designs, verify Microchip long-term supply commitments and PCN notices, as assembly-site transitions have been announced for this family.
Recomendado
Communications Bridge and Interconnect Logic
With up to 892.86 MHz internal performance capability and 620 I/Os, the A3PE3000L-1FG896I serves as bridge and bus-translation logic in networking and communications line cards. Typical roles include PCI-to-local-bus bridging, legacy interface emulation, and datapath grooming between processors, PHYs, and backplane connectors. The weak pull-up/-down options on I/Os reduce external resistor counts on lightly-loaded buses, and Schmitt trigger inputs clean up noisy backplane signaling. Flash-based instant-on means bridges are active before host processors complete boot, simplifying bring-up and fault handling versus SRAM FPGAs that require loading before the datapath is live. Designers should verify I/O bank voltage compatibility with each interfaced standard (3.3 V, 2.5 V, 1.8 V banks) during pin planning in Libero.
Recomendado
Test and Measurement Equipment
Bench instruments, automated test equipment, and data-acquisition chassis use the A3PE3000L-1FG896I for timing generation, trigger logic, and channel aggregation. The 75,264-cell fabric absorbs wide counters, state machines, and pattern generators, while 620 I/Os connect to front-end ADCs, relays, and display interfaces. JTAG boundary scan (IEEE 1149.1) supports production board test strategies, and the industrial temperature range covers equipment in unconditioned labs and field calibrators. Because the configuration is flash-resident, instruments power up ready to run with no download delay, and field firmware updates are performed live via JTAG without replacing a configuration device. Take care with ground-ball allocation around high-speed measurement clocks; use the FG896's distributed power/ground pattern and solid via stitching to limit jitter.
Recomendado
Medical Diagnostic Equipment
Medical imaging front ends, patient-monitoring bases, and laboratory analyzers require deterministic, reliable logic that the flash-based A3PE3000L-1FG896I delivers with instant-on startup and no configuration-device failure mode. The 3M-gate fabric implements acquisition sequencing, filter pre-processing, and interface translation, while 620 I/Os handle dense sensor arrays and display links. Flash*Freeze technology allows the device to hold state during idle periods in battery-backed patient-portable equipment, conserving energy without losing acquisition context. The non-volatile configuration also aids regulatory traceability: the bitstream stored at calibration remains present across power cycles unless deliberately updated. Validate electromagnetic compatibility of the 1.00 mm-pitch FBGA layout against applicable medical emission limits, and use the Libero design suite's timing reports to document deterministic worst-case paths for design history files.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para A3PE3000L-1FG896I — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | A3PE3000L-1FGG896I | A3PE3000L-FG896I | A3PE3000L-1FGG896M | A3PE3000-FGG896I |
|---|---|---|---|---|---|
| Package | 896-ball FBGA (FG896) | 896-ball FBGA (FG896) - same | 896-ball FBGA (FG896) - same | 896-ball FBGA (FG896) - same | 896-ball FBGA (FG896) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 |
| User I/O | 620 | 620 | 620 | 620 | 620 |
| Speed Grade | -1 | -1 | Standard | -1 | Standard |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | No (ProASIC3E) |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | Military flow (M) | -40C to +85C (I) |
Diferenciadores clave
- Flash*Freeze ultra-low static power mode (frente a A3PE3000-FGG896I)
- Speed grade -1 timing headroom (frente a A3PE3000L-FG896I)
- Lead-free green ball finish for RoHS builds (frente a A3PE3000L-FG896I)
- Single-chip instant-on configuration (frente a SRAM FPGAs (e.g., Xilinx Virtex-class))
Notas de diseño
The ProASIC3L requires separate core and I/O/auxiliary rails; consult the ProASIC3L datasheet (DS50003268) power supply section for the exact rail voltages (core operates at 1.2 V to 1.5 V) and permitted sequencing. Estimated: at 75,264 logic cells with typical utilization, dynamic current scales with toggle rate - run the Microchip power calculator with your Libero netlist before fixing regulator sizing, rather than assuming worst-case datasheet numbers. Flash*Freeze mode reduces static power to near zero but validate the wake latency against your system's standby-to-active timing budget.
The 896-ball FBGA at 1.00 mm pitch requires a careful escape strategy: typically via-in-pad or dogbone escapes on a minimum 8-layer PCB to route out 620 user I/Os plus power/ground. Allocate solid power/ground planes and stitch ground vias around every I/O bank to control return paths. Verify ballout against the datasheet pin tables during Libero pin planning before PCB routing - I/O bank voltage constraints (multiple VCCI domains) can force re-assignments late in layout if not planned first.
Use the Schmitt trigger input option (available on A3PE3000L single-ended inputs) for signals arriving over cables, backplanes, or other noisy paths to improve noise margins. For high-speed interfaces within the 892.86 MHz performance envelope, keep stub lengths short on BGA escapes and impedance-control critical nets. Weak pull-up/pull-down options eliminate external resistors on lightly-loaded control lines, but do not rely on internal pulls for bus structures where contention or float conditions could occur during Flash*Freeze transitions.
Do not confuse the A3PE3000L with the A3PE3000: the L variant includes Flash*Freeze technology and lower static power but different power characteristics - porting a design between them requires re-running the power analysis. Also confirm the speed grade suffix (-1 vs standard) matches your timing closure: substituting a standard-grade part for a -1 design may fail timing. Finally, track Microchip PCN notices for this family; assembly-site changes can affect date codes and lead times on long-term programs.
Información de cumplimiento
The standard FG896 variant's finish and RoHS status were not stated in the verified web data; the FGG896 (G suffix) variants are Microchip's lead-free green offering. Verify RoHS/REACH certificates with Microchip or the distributor for the exact MPN before committing.
