A3PE3000L-1FG896I - 3M-Gate Low-Power Flash FPGA | Microchip
MPN: A3PE3000L-1FG896I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for A3PE3000L-1FG896I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
A3PE3000L-1FGG896I
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-1FGG896
✅ Drop-In✓ In Stock
$255 / Unit
View Datasheet →A3PE3000L-FGG896I
✅ Drop-In✓ In Stock
$139.9 / Unit
View Datasheet →A3PE3000L-FG896I
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-1FGG896M
✅ Drop-In✓ In Stock
$432 / Unit
View Datasheet →A3PE3000L-FGG896M
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →A3PE3000L-FGG896
✅ Drop-In✓ In Stock
$55 / Unit
View Datasheet →A3PE3000-FGG896I
✅ Drop-In✓ In Stock
$135.2 / Unit
View Datasheet →A3PE3000L-1FG896I Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Flash FPGA) |
| System Gates | 3,000,000 |
| Logic Cells | 75,264 |
| User I/O | 620 |
| Core Voltage | 1.2 V to 1.5 V |
| Process Technology | 130 nm CMOS flash |
| Maximum Frequency | 892.86 MHz |
| Package | 896-ball FBGA (FG896), 1.00 mm pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (Industrial) |
| Configuration Memory | On-chip Flash (non-volatile, single chip) |
| Low Power Feature | Flash*Freeze Technology |
| JTAG Boundary Scan | IEEE 1149.1 |
| Input Options | Schmitt trigger option on single-ended inputs |
| Pull Options | Weak pull-up / pull-down |
| Reprogrammability | Live reprogrammable |
| Speed Grade | -1 |
A3PE3000L-1FG896I 896-ball fbga (fg896), 1.00 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000L-1FG896I (896-ball fbga (fg896), 1.00 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1FG896I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1FG896I is suitable for 6 applications: Industrial Automation and Control, Battery-Powered Portable Instrumentation, Secure Military and Aerospace Systems, Communications Bridge and Interconnect Logic, Test and Measurement Equipment, Medical Diagnostic Equipment.
Industrial Automation and Control
The A3PE3000L-1FG896I fits industrial automation backplanes and machine-control logic because its 75,264 logic cells and 620 I/Os integrate large glue-logic, sequencing, and interfacing functions that would otherwise require multiple ASICs or CPLDs. The industrial -40C to +85C rating covers unconditioned factory floors, and the Schmitt trigger input option improves noise immunity on long field-wired signals. Instant-on flash configuration means the FPGA is functional within microseconds of power-up, which is valuable in safety-oriented machines that must respond immediately after power restoration. Place it between PLC communication controllers and I/O expansion; with 1.2 V core operation, board-level power budgets stay manageable even at high gate utilization, though Flash*Freeze entry timing should be validated against system standby requirements.
Recommended
Battery-Powered Portable Instrumentation
Portable and handheld instruments benefit directly from the ProASIC3L value proposition: 130 nm flash technology with a 1.2 V core and Flash*Freeze technology that cuts static power to near zero while preserving register state. Between measurements, the system can drop into Flash*Freeze via the dedicated pin and resume in microseconds, avoiding the energy cost of FPGA reconfiguration that SRAM devices would incur. The 620 available I/Os support dense LCD, sensor-array, and peripheral interfaces in a single chip, simplifying the PCB in space-constrained enclosures. Because configuration is stored on-chip, there is no external boot flash drawing current at every wake cycle. Designers should budget the 2.5 V auxiliary rail carefully and debounce the Flash*Freeze control signal to prevent spurious mode transitions from mechanical switches or noise.
Recommended
Secure Military and Aerospace Systems
Flash FPGAs are preferred in defense electronics because on-chip flash configuration cannot be read back like SRAM bitstreams, reducing cloning and reverse-engineering risk. The A3PE3000L-1FG896I's M-suffix military-flow siblings (e.g., A3PE3000L-1FGG896M) extend this to qualified flows, while the standard I-grade device supports -40C to +85C industrial-military environments. The 896-ball FBGA provides the 620 I/Os needed for bus interfaces, radar preprocessing, and secure communications datapaths, and IEEE 1149.1 JTAG boundary scan supports board-level test continuity programs. Single-chip, instant-on configuration removes configuration PROMs, a common failure and tamper point in SRAM FPGA systems. For new defense designs, verify Microchip long-term supply commitments and PCN notices, as assembly-site transitions have been announced for this family.
Recommended
Communications Bridge and Interconnect Logic
With up to 892.86 MHz internal performance capability and 620 I/Os, the A3PE3000L-1FG896I serves as bridge and bus-translation logic in networking and communications line cards. Typical roles include PCI-to-local-bus bridging, legacy interface emulation, and datapath grooming between processors, PHYs, and backplane connectors. The weak pull-up/-down options on I/Os reduce external resistor counts on lightly-loaded buses, and Schmitt trigger inputs clean up noisy backplane signaling. Flash-based instant-on means bridges are active before host processors complete boot, simplifying bring-up and fault handling versus SRAM FPGAs that require loading before the datapath is live. Designers should verify I/O bank voltage compatibility with each interfaced standard (3.3 V, 2.5 V, 1.8 V banks) during pin planning in Libero.
Recommended
Test and Measurement Equipment
Bench instruments, automated test equipment, and data-acquisition chassis use the A3PE3000L-1FG896I for timing generation, trigger logic, and channel aggregation. The 75,264-cell fabric absorbs wide counters, state machines, and pattern generators, while 620 I/Os connect to front-end ADCs, relays, and display interfaces. JTAG boundary scan (IEEE 1149.1) supports production board test strategies, and the industrial temperature range covers equipment in unconditioned labs and field calibrators. Because the configuration is flash-resident, instruments power up ready to run with no download delay, and field firmware updates are performed live via JTAG without replacing a configuration device. Take care with ground-ball allocation around high-speed measurement clocks; use the FG896's distributed power/ground pattern and solid via stitching to limit jitter.
Recommended
Medical Diagnostic Equipment
Medical imaging front ends, patient-monitoring bases, and laboratory analyzers require deterministic, reliable logic that the flash-based A3PE3000L-1FG896I delivers with instant-on startup and no configuration-device failure mode. The 3M-gate fabric implements acquisition sequencing, filter pre-processing, and interface translation, while 620 I/Os handle dense sensor arrays and display links. Flash*Freeze technology allows the device to hold state during idle periods in battery-backed patient-portable equipment, conserving energy without losing acquisition context. The non-volatile configuration also aids regulatory traceability: the bitstream stored at calibration remains present across power cycles unless deliberately updated. Validate electromagnetic compatibility of the 1.00 mm-pitch FBGA layout against applicable medical emission limits, and use the Libero design suite's timing reports to document deterministic worst-case paths for design history files.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1FG896I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-1FGG896I | A3PE3000L-FG896I | A3PE3000L-1FGG896M | A3PE3000-FGG896I |
|---|---|---|---|---|---|
| Package | 896-ball FBGA (FG896) | 896-ball FBGA (FG896) - same | 896-ball FBGA (FG896) - same | 896-ball FBGA (FG896) - same | 896-ball FBGA (FG896) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| Logic Cells | 75,264 | 75,264 | 75,264 | 75,264 | 75,264 |
| User I/O | 620 | 620 | 620 | 620 | 620 |
| Speed Grade | -1 | -1 | Standard | -1 | Standard |
| Flash*Freeze Low-Power Mode | Yes | Yes | Yes | Yes | No (ProASIC3E) |
| Operating Temperature | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | Military flow (M) | -40C to +85C (I) |
| Lead Finish | [DATA_NEEDED: lead finish] | Lead-free (G, green) | Standard finish | Lead-free (G, green) | Lead-free (G, green) |
Key Differentiators
- Flash*Freeze ultra-low static power mode (vs A3PE3000-FGG896I)
- Speed grade -1 timing headroom (vs A3PE3000L-FG896I)
- Lead-free green ball finish for RoHS builds (vs A3PE3000L-FG896I)
- Single-chip instant-on configuration (vs SRAM FPGAs (e.g., Xilinx Virtex-class))
Design Notes
The ProASIC3L requires separate core and I/O/auxiliary rails; consult the ProASIC3L datasheet (DS50003268) power supply section for the exact rail voltages (core operates at 1.2 V to 1.5 V) and permitted sequencing. Estimated: at 75,264 logic cells with typical utilization, dynamic current scales with toggle rate - run the Microchip power calculator with your Libero netlist before fixing regulator sizing, rather than assuming worst-case datasheet numbers. Flash*Freeze mode reduces static power to near zero but validate the wake latency against your system's standby-to-active timing budget.
The 896-ball FBGA at 1.00 mm pitch requires a careful escape strategy: typically via-in-pad or dogbone escapes on a minimum 8-layer PCB to route out 620 user I/Os plus power/ground. Allocate solid power/ground planes and stitch ground vias around every I/O bank to control return paths. Verify ballout against the datasheet pin tables during Libero pin planning before PCB routing - I/O bank voltage constraints (multiple VCCI domains) can force re-assignments late in layout if not planned first.
Use the Schmitt trigger input option (available on A3PE3000L single-ended inputs) for signals arriving over cables, backplanes, or other noisy paths to improve noise margins. For high-speed interfaces within the 892.86 MHz performance envelope, keep stub lengths short on BGA escapes and impedance-control critical nets. Weak pull-up/pull-down options eliminate external resistors on lightly-loaded control lines, but do not rely on internal pulls for bus structures where contention or float conditions could occur during Flash*Freeze transitions.
Do not confuse the A3PE3000L with the A3PE3000: the L variant includes Flash*Freeze technology and lower static power but different power characteristics - porting a design between them requires re-running the power analysis. Also confirm the speed grade suffix (-1 vs standard) matches your timing closure: substituting a standard-grade part for a -1 design may fail timing. Finally, track Microchip PCN notices for this family; assembly-site changes can affect date codes and lead times on long-term programs.
Compliance Information
The standard FG896 variant's finish and RoHS status were not stated in the verified web data; the FGG896 (G suffix) variants are Microchip's lead-free green offering. Verify RoHS/REACH certificates with Microchip or the distributor for the exact MPN before committing.
