EDB4432BBPA-1D-F-D - 4Gbit LPDDR2 SDRAM 128Mx32 FBGA-168 | Micron
N.º de pieza: EDB4432BBPA-1D-F-D ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $4.23 | $4,23 |
| 10 | $3.82 | $38,20 |
| 100 | $3.41 | $341,00 |
| 500 | $3.05 | $1.525,00 |
| 1.000 | $2.74 | $2.740,00 |
EDB4432BBPA-1D-F-D Descripción general
Mobile LPDDR2 (Low-Power Double Data Rate 2) SDRAM is a class of low-voltage DRAM designed for portable and battery-powered applications. Compared to standard DDR SDRAM, LPDDR2 operates at lower voltage (1.2 V typical VDD) and includes architectural features such as partial-array self-refresh (PASR) and deep power-down (DPD) modes. It sits within the broader taxonomy: volatile memory -> DRAM -> SDRAM -> DDR SDRAM -> Mobile SDRAM -> LPDDR2, and is widely used in smartphones, tablets, and embedded systems where power efficiency is critical.
Key features of the EDB4432BBPA-1D-F-D include a supply voltage range of 1.14 V to 1.95 V (1.2 V nominal), operating temperature range of -30C to +85C for commercial/industrial-grade environments, and the compact FBGA-168 12 x 12 mm footprint. The single-channel x32 organization simplifies memory controller design and routing. The 4 Gbit density supports moderate memory arrays in tablets, single-board computers, and embedded multimedia devices.
The device uses a JEDEC-standard LPDDR2 interface that supports both HSUL (high-speed unterminated logic) and LVCMOS I/O. The internal architecture employs multiple internal bank groups for reduced power and improved throughput. Refresh management, temperature-compensated refresh, and partial-array self-refresh are supported, enabling power savings when only portions of memory are actively used.
Typical applications include Android/Linux-based tablets, portable media players, automotive infotainment displays, single-board computers, and industrial HMI panels. In each scenario, the 1.2 V supply voltage and low-power operating modes directly extend battery runtime. The 128M x 32 organization is well-suited for direct attachment to 32-bit application processors that integrate an LPDDR2 controller.
When designing with this device, ensure the host processor includes a JEDEC-compliant LPDDR2 controller and that the PCB layout uses controlled-impedance traces for the high-speed byte lanes. Decoupling capacitors must be placed close to each supply pin, and the ZQ calibration pin must be tied to ground through the specified 240 ohm resistor. The FBGA package requires X-ray or automated optical inspection for solder joint verification.
This page synthesizes distributor pricing, cross-references, drop-in alternatives, and practical design notes not aggregated on the manufacturer datasheet, providing engineers with an actionable comparison resource for legacy LPDDR2 sourcing decisions.
Alternativas directas para EDB4432BBPA-1D-F-D — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EDB4432BBPA-1D-F-R
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EDB4432BAPA-1D-F
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EDB8132B4PM
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EDBM432B3PB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EDBM432B3PF
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EDBA232B2PB
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EDBA232B2PF
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
EDB4432BBPA-1D-F-D Valores máximos y características eléctricas
| Tipo de memoria | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - Mobile LPDDR2 |
| Tamaño de memoria | 4 Gbit (128M x 32) |
| Memory Organization | 128M x 32 |
| Clock Rate | 533 MHz |
| Velocidad de datos | 1066 Mb/s/pin |
| WRITE Latency | 4 |
| READ Latency | 8 |
| Interfaz | Parallel |
| Tensión de alimentación | 1.14 V to 1.95 V (1.2 V nominal) |
| Temperatura de funcionamiento | -30C to +85C |
| Encapsulado / Carcasa | 168-FBGA (12 x 12 mm) |
| Tipo de montaje | Surface Mount |
| Compliance | RoHS |
| Speed Grade | 1D |
| Channel Configuration | Single-channel |
Guía de configuración de pines de EDB4432BBPA-1D-F-D 168-fbga (12 x 12 mm)
Configuración de pines para EDB4432BBPA-1D-F-D (encapsulado 168-fbga (12 x 12 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EDB4432BBPA-1D-F-D.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EDB4432BBPA-1D-F-D es adecuado para 6 aplicacións: Android Tablet Main Memory, Single-Board Computer DRAM, Portable Media Player Storage, Industrial HMI Panel Memory, Automotive Infotainment Memory, Embedded Linux Module DRAM.
Android Tablet Main Memory
The EDB4432BBPA-1D-F-D is well-suited as the main system memory for Android-based tablets where 4 Gbit capacity and 32-bit organization are sufficient for the OS and applications. The 1.2 V nominal supply voltage aligns with typical tablet PMIC rails, and the 1066 Mb/s/pin data rate supports modern Cortex-A class processors with integrated LPDDR2 controllers. Power-saving modes like PASR and DPD extend battery life during idle periods, while the FBGA-168 12 x 12 mm footprint enables compact PCB layouts typical of tablet form factors.
Recomendado
Single-Board Computer DRAM
For single-board computers like Raspberry Pi-class or custom Linux boards, the EDB4432BBPA-1D-F-D provides adequate RAM capacity in a compact FBGA-168 package. The 128M x 32 organization interfaces directly with 32-bit SoCs that integrate LPDDR2 controllers. The 533 MHz clock rate and 1066 Mb/s/pin data rate deliver sufficient bandwidth for desktop-style applications. The -30C to +85C operating temperature range supports industrial SBC deployments in factory automation and edge computing scenarios.
Recomendado
Portable Media Player Storage
The EDB4432BBPA-1D-F-D serves as working memory for portable media players handling video decode buffers and audio streaming. Its 4 Gbit capacity accommodates compressed video frames at 1080p resolution, while the low-voltage LPDDR2 operation extends playback battery life. The parallel x32 interface simplifies PCB routing compared to multi-channel configurations. The single-channel design reduces controller complexity and BOM cost for cost-sensitive consumer PMP designs.
Recomendado
Industrial HMI Panel Memory
In industrial human-machine interface panels with touch displays, the EDB4432BBPA-1D-F-D provides the working memory for GUI rendering and data logging. The -30C to +85C operating temperature range covers factory floor environments. The FBGA-168 12 x 12 mm package fits compact HMI enclosures, and the 1.2 V supply rail is compatible with industrial PMICs. The 4 Gbit density supports modern embedded Linux HMI frameworks with sufficient headroom for application memory and frame buffers.
Recomendado
Automotive Infotainment Memory
The EDB4432BBPA-1D-F-D can be used in aftermarket automotive infotainment systems where AEC-Q100 qualification is not strictly required. The wide operating temperature range of -30C to +85C handles cabin environments, and the 4 Gbit capacity supports navigation maps and media buffering. Engineers should verify automotive EMC requirements; for OEM designs, AEC-Q100 qualified LPDDR2 or LPDDR4 parts are recommended over this obsolete commercial-grade Micron device.
Recomendado
Embedded Linux Module DRAM
For System-on-Module designs that pair an application processor with discrete LPDDR2 memory, the EDB4432BBPA-1D-F-D delivers the standard 4 Gbit capacity expected by Linux distributions. The parallel interface simplifies SoM PCB layout and the FBGA-168 package is compatible with JEDEC-standard SoM footprints. The LPDDR2 standard ensures broad driver support across ARM SoCs including NXP i.MX and Texas Instruments Sitara families. Engineers should confirm the host SoC's LPDDR2 controller timing requirements against the Micron speed grade 1D specification.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EDB4432BBPA-1D-F-D — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EDB4432BBPA-1D-F-R | EDB4432BAPA-1D-F | EDB8132B4PM | EDBM432B3PB | EDBM432B3PF | EDBA232B2PB | EDBA232B2PF |
|---|---|---|---|---|---|---|---|---|
| Package | FBGA-168 (12x12 mm) | FBGA-168 (12x12 mm) | FBGA-168 (12x12 mm) | FBGA-168 (12x12 mm) | FBGA-168 (12x12 mm) | FBGA-168 (12x12 mm) | FBGA-168 (12x12 mm) | FBGA-168 (12x12 mm) |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Memory Density | 4 Gbit | 4 Gbit | 4 Gbit | 8 Gbit | 4 Gbit | 4 Gbit | 2 Gbit | 2 Gbit |
| Memory Technology | LPDDR2 SDRAM | LPDDR2 SDRAM | LPDDR2 SDRAM | LPDDR2 SDRAM | LPDDR2 SDRAM | LPDDR2 SDRAM | LPDDR2 SDRAM | LPDDR2 SDRAM |
| Clock Rate | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz | 533 MHz |
| Data Rate | 1066 Mb/s/pin | 1066 Mb/s/pin | 1066 Mb/s/pin | 1066 Mb/s/pin | 1066 Mb/s/pin | 1066 Mb/s/pin | 1066 Mb/s/pin | 1066 Mb/s/pin |
| Supply Voltage | 1.14 V to 1.95 V | 1.14 V to 1.95 V | 1.14 V to 1.95 V | 1.14 V to 1.95 V | 1.14 V to 1.95 V | 1.14 V to 1.95 V | 1.14 V to 1.95 V | 1.14 V to 1.95 V |
| Operating Temperature | -30C to +85C | -30C to +85C | -30C to +85C | -30C to +85C | -30C to +85C | -30C to +85C (industrial) | -30C to +85C | -30C to +85C (industrial) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Single-channel x32 organization simplifies PCB routing (frente a EDB8132B4PM)
- JEDEC LPDDR2 standard for broad SoC compatibility (frente a EDBA232B2PB)
- Tape and Reel variant available for SMT production (frente a EDB4432BBPA-1D-F-R)
Notas de diseño
The EDB4432BBPA-1D-F-D FBGA-168 package requires controlled-impedance PCB traces for the high-speed byte lanes. Per the Micron datasheet, route CA, DQ, and DQS signals with matched trace lengths within the byte group. Use 100 ohm differential impedance for DQS pairs and 50 ohm single-ended for other signals. Place decoupling capacitors as close as possible to each VDD and VDDQ pin.
The EDB4432BBPA-1D-F-D operates from a 1.14 V to 1.95 V supply with 1.2 V nominal for VDD and VDDQ. The Micron datasheet specifies the ZQ pin must be connected to ground through a 240 ohm 1% resistor for output driver calibration. Power supply decoupling requires 0.1 uF and 1 uF ceramic capacitors near each supply pin to handle transient current during DDR transitions.
Since the EDB4432BBPA-1D-F-D is marked obsolete by Micron, engineers designing new products should verify long-term availability with their supply chain. Consider active LPDDR2 or LPDDR4 alternatives for new designs. Verify the host SoC supports the specific speed grade 1D timing (WRITE latency 4, READ latency 8) before committing to this part. LPDDR2 controllers in modern SoCs may default to faster speed grades.
The EDB4432BBPA-1D-F-D operates over -30C to +85C ambient temperature range per the Micron datasheet. Power dissipation scales with clock rate and bus activity; in continuous high-bandwidth operation, monitor junction temperature through the optional TS (Thermal Sensor) interface if available. Ensure adequate PCB thermal relief under the FBGA land pattern for sustained operation near upper temperature limits.
Información de cumplimiento
RoHS compliant per JLCPCB listing. Not AEC-Q100 qualified - not suitable for automotive OEM designs requiring certified memory. Obsolete per Micron product catalog.
