EP1AGX50CF484I6N - 3.125 Gbps, 50K FPGA | Altera
N.º de pieza: EP1AGX50CF484I6N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $504.158 | $504,16 |
| 10 | $504.158 | $5.041,58 |
| 100 | $504.158 | $50.415,80 |
| 500 | $504.158 | $252.079,00 |
| 1.000 | $504.158 | $504.158,00 |
EP1AGX50CF484I6N Descripción general
An FPGA is a programmable semiconductor containing configurable logic, memory, routing, and specialized I/O resources. Unlike a fixed-function application-specific integrated circuit, an FPGA can be configured after manufacturing. Within the semiconductor hierarchy, it belongs to programmable logic devices, sits alongside CPLDs and other programmable logic, and ultimately falls under integrated circuits. Its architecture allows parallel processing, deterministic interfaces, and hardware updates through configuration memory rather than a new silicon mask.
The defining feature of the Arria GX family is serial transceiver capability up to 3.125 gigabits per second (Gbps). The device also provides 229 user I/O according to distributor specifications and 2,508 LABs in the Mouser listing. The 484-BBGA package supports 484 terminals, while the package body measures 23 mm by 23 mm. The combination is intended for systems requiring substantial programmable logic density and high-speed serial connectivity in a single surface-mount component.
A typical high-speed communications or networking design can instantiate protocol handling, packet processing, buffering, and control logic in the FPGA while the integrated serial transceivers handle differential links. The logic capacity supports parallel datapaths, while the package's 229 I/O expand access to external memory, converters, control devices, and backplane interfaces. Engineers should still validate transceiver channel count, supported protocols, power rails, configuration mode, and signal-integrity requirements against the complete manufacturer documentation before release.
Key applications include communications equipment, industrial imaging, test and measurement, video processing, and embedded control. The industrial temperature-grade identifier makes the part appropriate for systems designed for harsher operating environments than typical commercial products. The 1 mm ball pitch and 484-terminal package demand controlled assembly, inspection, escape routing, and power distribution, so the PCB stack-up and decoupling network should be designed with the FPGA package and reference schematics in mind.
Selection should emphasize total system fit rather than logic count alone. EP1AGX50CF484I6N is appropriate when an Arria GX-class FPGA with 3.125 Gbps transceivers, 229 I/O, and 484-BBGA packaging matches the design. The supplied sources identify lifecycle status as obsolete, so long-term production planning and lifecycle risk should be evaluated. The information on this page combines verified distributor facts, package details, pricing evidence, and procurement guidance; unavailable pin-level and operating values are explicitly left marked rather than inferred.
Alternativas directas para EP1AGX50CF484I6N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1AGX50CF484I6N (mismo factor de forma y huella) — difiere en Package, Speed Grade, Embedded Memory, Operating Temperature, Process Technology.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1AGX50CF484I6
✅ Sustitución directa✓ En stock
$275 / unidad
Ver hoja de datos →EP1AGX50CF484C6N
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP1AGX50CF484C6
✅ Sustitución directa✓ En stock
$189.5 / unidad
Ver hoja de datos →EP1AGX50CF484C5N
✅ Sustitución directa✓ En stock
$108.4 / unidad
Ver hoja de datos →EP1AGX50CF484C4N
✅ Sustitución directa✓ En stock
$175 / unidad
Ver hoja de datos →EP1AGX50CF484I6N Valores máximos y características eléctricas
| Device Type | Field Programmable Gate Array (FPGA) |
| Series | Arria GX |
| Programmable Logic Capacity | 2,475,072 bits |
| Number of Configurable Logic Blocks | 50,160 |
| Number of LABs | 2,508 |
| Number of User I/O | 229 |
| Maximum Serial Transceiver Data Rate | 3.125 Gbps |
| Encapsulado | 484-BBGA, FCBGA |
| Terminal Count | 484 |
| Package Body Width | 23 mm |
| Package Body Length | 23 mm |
| Terminal Pitch | 1 mm |
| Terminal Form | Ball |
| Temperature Grade | Industrial |
| Lead-Free | Yes |
| Core Clock | 640 MHz |
| Configuration Status | Not Verified |
| Product Status | Obsolete |
| Tipo de montaje | Surface Mount |
Guía de configuración de pines de EP1AGX50CF484I6N 23 mm
Configuración de pines para EP1AGX50CF484I6N (encapsulado 23 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1AGX50CF484I6N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1AGX50CF484I6N es adecuado para 6 aplicacións: Communications Equipment, Industrial Imaging and Video Processing, Test and Measurement Systems, Embedded Control Platforms, High-Speed Data Acquisition, Industrial Networking and Control.
Communications Equipment
EP1AGX50CF484I6N fits communications equipment that needs programmable parallel processing alongside serial links rated up to 3.125 Gbps. The FPGA can implement framing, packet handling, buffering, protocol adaptation, and control functions, while the 229 I/O provide access to external memory, management devices, and board-level data paths. Its 484-BBGA package concentrates those resources in a 23 mm by 23 mm footprint, but the 1 mm pitch requires controlled PCB escape routing, impedance planning, and thorough signal-integrity verification. The industrial temperature-grade designation is relevant for equipment exposed to wider environmental operating conditions. Because the device is listed as obsolete, the design team should also assess the availability of supported configuration tools, qualified transceivers, and a long-term sourcing strategy before committing to a new platform.
Recomendado
Industrial Imaging and Video Processing
EP1AGX50CF484I6N can serve as a programmable processing and interface hub in industrial imaging, machine vision, or video systems. The listed 2,475,072 programmable logic bits, 50,160 configurable logic blocks, and 229 I/O support sensor aggregation, frame buffering, format conversion, filtering, timing generation, and control logic. A 3.125 Gbps serial capability can provide a high-speed path between processing boards, camera modules, or backplane equipment. The 484-BBGA package provides many I/O and power connections but places significant demands on PCB layout, thermal analysis, and assembly. Designers should preserve controlled-impedance differential routes, provide low-noise power, and verify I/O-bank constraints. The obsolete lifecycle listing means production teams should validate the availability of replacement devices and ensure that a new design is not unnecessarily dependent on a constrained supply chain.
Recomendado
Test and Measurement Systems
EP1AGX50CF484I6N is suitable for test and measurement systems that need deterministic hardware processing, multiple external interfaces, and high-speed data movement. The FPGA fabric can implement trigger logic, counters, filters, encoders, decoders, and protocol-specific state machines, while the serial transceivers support links up to 3.125 Gbps where appropriate. Its 229 user I/O can interface with analog-to-digital converters, digital-to-analog converters, memory, clocks, and control circuitry. The 484-terminal 1 mm-pitch BGA package helps integrate a large number of signals but requires careful power-distribution-network design, signal return continuity, and thermal evaluation. The industrial-grade ordering code is useful for equipment operating outside benign commercial conditions. Since the part is listed as obsolete, any new test platform should pair the technical decision with a documented lifecycle and obsolescence-management plan.
Recomendado
Embedded Control Platforms
EP1AGX50CF484I6N can provide the programmable control and real-time processing core in an embedded platform. The 2,508 LABs and 50,160 configurable logic blocks allow designers to implement custom register maps, motor or actuator control, safety interlocks, communication bridges, and deterministic timing functions. The 229 user I/O are valuable when the controller must coordinate sensors, memory, converters, and management buses, while the 3.125 Gbps serial capability can be used for inter-board or high-speed peripheral connections. The 484-BBGA package offers high connection density but makes package-aware PCB design essential. The industrial temperature-grade classification supports designs intended for wider environmental ranges, although the exact operating limits require manufacturer documentation. Before a new production launch, confirm the obsolete status, remaining stock, configuration support, and the risk profile of the selected supplier.
Recomendado
High-Speed Data Acquisition
EP1AGX50CF484I6N can coordinate acquisition, formatting, and transport in a high-speed data-acquisition system. The FPGA fabric can process parallel converter data, apply real-time filtering, manage buffers, and generate timing or trigger controls, while the 3.125 Gbps serial transceivers provide a potential path for transmitting processed data to another board or processing subsystem. The listed 229 user I/O support interfaces to converters, memories, clocks, and control devices, but the designer must verify bank availability, voltage compatibility, and pin multiplexing. The 484-BBGA, 23 mm by 23 mm package is suitable for high-density systems when the PCB can support 1 mm-pitch escape and robust power delivery. A 640 MHz core-clock listing indicates a verified summary value, not a substitute for checking the full timing specification. For new products, obsolete status should be treated as a design constraint requiring supply-chain review.
Recomendado
Industrial Networking and Control
EP1AGX50CF484I6N fits industrial networking and control platforms that combine serial connectivity with deterministic programmable logic. Its Arria GX architecture supports custom packet processing, protocol conversion, traffic shaping, and control-state machines, while the 3.125 Gbps transceiver capability can connect to compatible high-speed links. The 229 I/O allow the FPGA to connect with Ethernet controllers, management processors, memory, sensors, and other industrial devices. The 484-BBGA package is dense and well suited to complex boards, but designers must plan power integrity, thermal paths, controlled-impedance routing, and assembly inspection from the earliest schematic stage. The industrial temperature-grade code is relevant to factory and automation environments, subject to confirmation of the exact operating range. Since the verified data labels the device obsolete, engineering and procurement teams should jointly review alternative family devices and the impact of availability on product support.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1AGX50CF484I6N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1AGX50CF484I6 | EP1AGX50CF484C6N | EP1AGX50CF484C6 | EP1AGX50CF484C5N | EP1AGX50CF484C4N |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel | Intel | Intel | Intel | Intel |
| Package | 484-BBGA, FCBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA | 484-BBGA |
Diferenciadores clave
- Higher listed logic-resource count than the comparison candidate (frente a EP1AGX20CF484C6N)
- High-speed serial capability (frente a EP1AGX20CF484C6N)
- High-density 484-terminal integration (frente a EP1AGX20CF484C6N)
Notas de diseño
Design the 484-BBGA footprint with the 1 mm ball pitch, 23 mm by 23 mm package dimensions, and the manufacturer's land-pattern recommendations. Use a controlled PCB stack-up, verify via and escape rules, and route high-speed differential pairs with continuous reference planes. The package contains 484 terminals, so an incomplete escape strategy can force a board revision. Confirm the exact land pattern and pin assignments from the official package drawing before releasing the PCB.
Build the power-distribution network from the complete FPGA power-supply requirements rather than assigning a single rail. Separate core, I/O, auxiliary, and transceiver supplies where required, and place local decoupling close to the relevant package balls. Validate regulator stability, current capability, startup sequencing, and load transients against the selected design configuration. Use the reference-design power sequence and the datasheet limits; a general FPGA decoupling rule is not a substitute for the device-specific values.
Estimate thermal performance from the actual logic utilization, toggle rate, I/O loading, transceiver activity, and board airflow because the supplied data does not provide a verified junction-temperature or thermal-resistance value. A dense 484-BBGA assembly can still be reliable when the PCB provides solid thermal paths, but a high-utilization design may require additional copper, thermal vias, airflow, or a board-level heat spreader. Perform worst-case analysis and verify the resulting temperature with the production configuration and enclosure conditions.
Do not assume that a similar Arria GX ordering code is a drop-in replacement without checking the complete part-number decoding, package drawing, pin table, transceiver resources, speed grade, temperature grade, configuration interface, and timing limits. The supplied data identifies the target as obsolete and lists nearby same-package options, but it does not provide their full electrical specifications. Treat procurement alternatives as engineering candidates until equivalence is documented, sampled, and validated on the target PCB.
Información de cumplimiento
Lead-free is explicitly listed in the verified FindIC result. RoHS, REACH, halogen-free, and conflict-minerals statuses are not stated in the supplied data and remain unknown. AEC-Q100 is not applicable to the supplied evidence for this industrial-grade FPGA.