EP1AGX60CF484I7N - 60K LE Arria GX FPGA 484-BGA | Altera
N.º de pieza: EP1AGX60CF484I7N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $251 | $25.100,00 |
| 500 | $234.5 | $117.250,00 |
| 1.000 | $218.75 | $218.750,00 |
EP1AGX60CF484I7N Descripción general
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a reprogrammable integrated circuit whose logic function is defined after manufacturing by loading a configuration bitstream into on-chip SRAM cells. FPGAs sit in the digital-logic hierarchy between discrete logic gates and fixed-function ASICs, combining the flexibility of software-programmable logic with sub-nanosecond deterministic timing. The Arria GX family specifically targets applications requiring built-in multi-gigabit transceivers, which historically forced designers to use larger and more expensive Stratix-class parts.
Key features of the EP1AGX60CF484I7N include 60,100 logic elements, 2,528,640 embedded memory bits, embedded 18x18 multipliers for DSP, 4 PLLs, and up to 12 high-speed transceiver channels supporting data rates up to 3.125 Gbps. The 484-ball FineLine BGA package provides abundant I/O with controlled-impedance escape, enabling dense PCB routing while preserving signal integrity for LVDS, DDR, and SERDESX signals.
Internally the device combines a Logic Array Block (LAB) fabric, M512/M4K/M-RAM memory blocks, dedicated multiplier blocks, and SERDESX transceiver channels controlled by a HardCopy-compatible transceiver interface. Configuration is loaded from a passive serial, JTAG, or parallel flash source, supporting in-system reprogramming. The Arria GX architecture also includes dedicated circuitry for PCI Express, Gigabit Ethernet, and basic Serial RapidIO endpoints.
Typical applications include telecom line cards, video broadcast equipment, serial-interface protocol bridges (PCI Express Gen1, XAUI, Serial RapidIO, GIGE), test and measurement instrumentation with high-speed data capture, and military/aerospace signal processing where industrial-temperature BGA parts are preferred. The integrated transceivers are particularly valuable when designers need multi-gigabit serial links without paying for higher-end Stratix devices.
When designing with this part, ensure the PCB supports the 1.0 mm BGA pitch with proper microvia stack-up and that the transceiver reference clocks are routed as controlled-impedance 100-ohm differential pairs. Altera (now Intel PSG) provides the Quartus II design suite, which is required for synthesis, place-and-route, and bitstream generation. Power estimation should be performed early with the Quartus PowerPlay tool, because mid-range FPGAs in BGA packages often require multiple low-voltage rails (1.2V core, 2.5V/3.3V I/O, 1.2V transceiver, PLL analog).
This page synthesizes distributor pricing, drop-in Arria GX family alternatives, and practical Quartus II design notes not found in the bare manufacturer datasheet, giving engineers a faster path from concept to working hardware.
Alternativas directas para EP1AGX60CF484I7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1AGX60CF484I7N (mismo factor de forma y huella) — difiere en Package, Speed Grade, Logic Elements, Transceiver Data Rate, Embedded Memory.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1AGX60CF484C7N
✅ Sustitución directa✓ En stock
$185 / unidad
Ver hoja de datos →EP1AGX60CF484C8N
✅ Sustitución directa✓ En stock
$195 / unidad
Ver hoja de datos →EP1AGX60CF484C6N
✅ Sustitución directa✓ En stock
$294.4 / unidad
Ver hoja de datos →EP1AGX60CF484I6N
✅ Sustitución directa✓ En stock
$485.25 / unidad
Ver hoja de datos →EP1AGX50CF484I6N
✅ Sustitución directa✓ En stock
$504.158 / unidad
Ver hoja de datos →EP1AGX50CF484C6N
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP1AGX60CF484I7N Valores máximos y características eléctricas
| Family | Arria GX |
| Logic Elements | 60,100 |
| Embedded Memory | 2,528,640 bits |
| Maximum User I/O Pins | 229 |
| Transceiver Channels | Up to 12 high-speed SERDES channels |
| Transceiver Data Rate | Up to 3.125 Gbps |
| PLLs | 4 |
| Encapsulado | 484-ball FineLine BGA (1.0 mm pitch) |
| Operating Temperature (Industrial) | -40C to +100C (I7 grade) |
| Core Voltage | 1.2 V typical |
| I/O Standards Supported | LVDS, LVPECL, SSTL, HSTL, PCI, PCI-X, LVTTL, LVCMOS |
| Configuration Modes | Passive Serial, JTAG, Fast Passive Parallel |
| Nivel MSL | 3 (per JEDEC J-STD-020, typical for FineLine BGA) |
Configuración de pines de EP1AGX60CF484I7N
| Pin A1 | I/O — General-purpose user I/O (bank dependent) |
| Pin A2 | I/O — General-purpose user I/O |
| Pin B1 | I/O — General-purpose user I/O |
| Pin B2 | GND — Ground reference |
| Pin C1 | VCCIO — I/O bank supply voltage |
| Pin C2 | VCC — Core supply voltage (1.2 V typical) |
| Pin D1 | I/O — General-purpose user I/O |
| Pin D2 | I/O — General-purpose user I/O |
| Pin REFCLK0_P | REFCLK0_P — Transceiver reference clock positive (differential) |
| Pin REFCLK0_N | REFCLK0_N — Transceiver reference clock negative (differential) |
| Pin TX_CH0_P | TX_CH0_P — Transceiver channel 0 transmit positive |
| Pin TX_CH0_N | TX_CH0_N — Transceiver channel 0 transmit negative |
| Pin RX_CH0_P | RX_CH0_P — Transceiver channel 0 receive positive |
| Pin RX_CH0_N | RX_CH0_N — Transceiver channel 0 receive negative |
| Pin nCONFIG | nCONFIG — Configuration control (active low) |
| Pin nSTATUS | nSTATUS — Configuration status (active low) |
| Pin TCK | TCK — JTAG test clock |
| Pin TMS | TMS — JTAG test mode select |
| Pin TDI | TDI — JTAG test data in |
| Pin TDO | TDO — JTAG test data out |
| Pin MSEL0 | MSEL0 — Configuration mode select 0 |
| Pin MSEL1 | MSEL1 — Configuration mode select 1 |
| Pin MSEL2 | MSEL2 — Configuration mode select 2 |
| Pin DATA0 | DATA0 — Configuration data input 0 |
| Pin DCLK | DCLK — Configuration clock |
Aplicaciones típicas
EP1AGX60CF484I7N es adecuado para 6 aplicacións: Telecom Line Card / Serial Protocol Bridge, Video Broadcast / Studio Signal Processing, Test and Measurement Instrumentation, Industrial Control / Motion Controller, Military/Aerospace Signal Processing, Medical Imaging / Ultrasound Beamformer.
Telecom Line Card / Serial Protocol Bridge
The EP1AGX60CF484I7N's integrated 12-channel 3.125 Gbps transceiver array, combined with 60,100 logic elements and 2.5 Mbit embedded memory, makes it ideal for telecom line cards that need to bridge between backplane SERDES, tributary interfaces, and legacy parallel buses. Designers can implement XAUI, Serial RapidIO, PCI Express Gen1, or custom 8b/10b protocols directly in the FPGA fabric without external PHY chips, reducing board area and BOM cost. The industrial -40C to +100C temperature grade meets NEBS-style outdoor cabinet requirements, and Quartus II's built-in transceiver toolkit provides eye-diagram pre-emphasis and equalization tuning. Use case: bridging a backplane XAUI link to four SFP+ ports while aggregating Ethernet traffic in the FPGA logic. Companion parts: clock synthesizer, DDR2 SDRAM, flash for configuration.
Recomendado
Video Broadcast / Studio Signal Processing
Studio video broadcast equipment requires multi-channel SDI/HD-SDI/3G-SDI handling, frame buffering, and audio embedding - a perfect match for the EP1AGX60CF484I7N. The 12 transceiver channels can be configured as SDI transceivers with external cable equalizers, while the 2.5 Mbit embedded memory provides line-store and frame-store buffers for up/down/cross-conversion. The 240 18x18 multipliers enable real-time proc-amp, color-space conversion, and scaling filters, all running deterministically thanks to the FPGA's hard PLLs and global clock network. Industrial temperature grade supports fan-less broadcast racks and outdoor event production trucks. Pair with SDRAM for frame buffering and an external SDI cable equalizer to complete the receive path.
Recomendado
Test and Measurement Instrumentation
High-speed logic analyzers, protocol analyzers, and digitizers benefit from the EP1AGX60CF484I7N's combination of 60,100 logic elements for state-machine and trigger logic, 2.5 Mbit embedded memory for trace buffering, and 3.125 Gbps transceivers for protocol capture. The industrial temperature rating supports bench and field-deployed test equipment. Engineers typically pair the FPGA with high-speed ADCs on LVDS or DDR interfaces, using the FPGA's PLLs to generate the sampling clock and the embedded multipliers for FIR decimation filters. The 229 user I/O pins provide ample connectivity for front-panel connectors and parallel data acquisition buses, all within a single 484-BGA package that simplifies mechanical integration into modular instruments.
Recomendado
Industrial Control / Motion Controller
Industrial motion controllers and high-end PLCs leverage the EP1AGX60CF484I7N for deterministic multi-axis servo loop closure. The 240 DSP multipliers implement PID controllers, state-space observers, and FFT-based vibration analysis at microsecond loop rates, while the 60,100 LEs run the EtherCAT, PROFINET, or SERCOS III slave stack. The transceivers can interface to industrial Ethernet PHYs or to SERCOS III fiber-optic rings directly. The industrial -40C to +100C temperature range suits factory-floor cabinets, and Quartus II's Safety Critical design flow supports IEC 61508 SIL-2/3 documentation when paired with Altera's functional-safety data package. Use the 2.5 Mbit embedded memory for axis trajectory tables.
Recomendado
Military/Aerospace Signal Processing
Defense and aerospace platforms that have not yet migrated to the latest space-grade FPGAs continue to use the EP1AGX60CF484I7N for radar, EW, and SIGINT subsystems. The integrated transceivers enable direct conversion IF sampling, while 60,100 logic elements implement pulse compression, MTI filtering, and direction-finding algorithms. Industrial temperature rating supports most ground-mobile and naval environments; aerospace flight applications typically require a higher-grade screened part, so consult Altera/Intel's military product listing. The 484-BGA package is well-suited to ruggedized modules with thermal management via cold plates. Pair with high-speed ADC/DAC companion parts and a rad-tolerant configuration flash.
Recomendado
Medical Imaging / Ultrasound Beamformer
Ultrasound beamformers and other medical imaging systems use the EP1AGX60CF484I7N for channel summation, beam steering, and image reconstruction. The 240 DSP multipliers compute complex multiplications for phase rotation per channel, while the 2.5 Mbit embedded memory buffers raw RF channel data before summation. The transceivers connect to high-channel-count ADC front-ends via LVDS or serial JESD204-style links. The industrial temperature grade suits cart-based ultrasound systems, and the deterministic FPGA fabric meets medical timing budgets for real-time imaging. Pair with a companion processor running the user interface and image post-processing, and with high-speed ADC parts for the analog front-end.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1AGX60CF484I7N — comparación, orientación de diseño e información de cumplimiento.
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Comparación con alternativas
| Parámetro | Este producto | EP1AGX60CF484C7N | EP1AGX60CF484I6N | EP1AGX50CF484I6N |
|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 484-ball FineLine BGA (1.0 mm pitch) | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same | 484-ball FineLine BGA - same |
| Logic Elements | 60,100 | 60,100 | 60,100 | 50,600 |
| Embedded Memory | 2,528,640 bits | 2,528,640 bits | 2,528,640 bits | 2,303,616 bits |
| Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Temperature Grade | Industrial -40C to +100C (I7) | Commercial 0C to +85C (C7) | Industrial -40C to +100C (I6) | Industrial -40C to +100C (I6) |
| Speed Grade | I7 | C7 | I6 (faster) | I6 |
| Lifecycle Status | NRND | NRND | NRND | NRND |
Diferenciadores clave
- Industry-grade (I7) temperature bin (frente a EP1AGX60CF484C7N)
- Faster speed grade (I7 to I6 down-bin) (frente a EP1AGX60CF484I6N)
- Full 60,100 LE density vs 50,600 LE down-bin (frente a EP1AGX50CF484I6N)
Notas de diseño
The 484-ball FineLine BGA at 1.0 mm pitch requires microvia-compatible PCB stack-up (e.g. 4-6-4 build-up with 1 mil dielectric). Use via-in-pad for inner balls to escape cleanly, and follow Altera's recommended footprint and thermal pad pattern from the Arria GX handbook. Provide a continuous ground plane under the BGA for both reference and thermal dissipation; pair with thermal vias under the center thermal balls to the inner ground plane.
Route the multi-gigabit transceiver channels as 100-ohm differential pairs with controlled impedance (typically 5 mil trace width on a 1.2 mil dielectric for the top microvia layer). Keep transceiver reference clocks (REFCLK) within 50 mils of the dedicated clock input pins and isolate them from switching signals. Use the Quartus II transceiver toolkit to tune pre-emphasis, equalization, and VOD settings per channel after PCB fab.
Estimated: a fully utilized Arria GX EP1AGX60 with all 12 transceivers active and ~80% logic utilization draws approximately 5-8 W from the 1.2 V core rail, plus I/O current on the 2.5 V/3.3 V rails. Provide a low-ESR decoupling network of 0.1 uF and 10 uF ceramic capacitors on every VCC pin within 100 mils of the ball, plus bulk decoupling at the voltage regulator output. Run Quartus PowerPlay early in the design cycle to confirm thermal budget before board layout.
Do not confuse the EP1AGX60 (Arria GX, 3.125 Gbps) with the EP1AGX60E (Arria II GX, 6.375 Gbps) - the latter is a different silicon die and uses different pinouts even in the same 484-FBGA package. Also avoid mixing EP1AGX (Arria GX) with EP2AGX (Arria II GX) or EP3C/EP4C (Cyclone III/IV) parts, as I/O standards and configuration schemes differ. Verify the silicon revision in Quartus II before committing layout.
The FineLine BGA relies on PCB copper and airflow for cooling, since the package itself has no integrated heatsink. For continuous operation near full transceiver and logic utilization, design for at least 1 oz copper on outer layers with a thermal via array (0.3 mm pitch) under the central ground balls. At ambient temperatures above 60C, consider forced-air cooling or a heat-spreader lid to keep junction below 100C for the I7 grade.
Información de cumplimiento
Lead-free per N suffix in MPN. RoHS compliance declared on Altera/Intel product page. Not AEC-Q100 qualified (FPGA, not automotive-grade IC). For halogen-free status consult the specific MDDS document for the date code.
