EP1C4F324I7N - Cyclone I FPGA 4K LE FBGA-324 | Intel / Altera
MPN: EP1C4F324I7N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $36.47 | $36.47 |
| 10 | $32.82 | $328.20 |
| 100 | $29.18 | $2,918.00 |
| 500 | $26.45 | $13,225.00 |
| 1,000 | $23.1 | $23,100.00 |
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View Datasheet →EP1C4F324I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone I |
| Logic Elements | 4000 |
| Logic Array Blocks (LABs) | 400 |
| Maximum User I/Os | 249 |
| Embedded Memory | 78 Kbits (60 Kbits without parity) |
| M4K RAM Blocks | 17 |
| Embedded 18x18 Multipliers | 30 |
| Maximum Internal Frequency | 405 MHz |
| PLLs | 4 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm CMOS |
| Package | FBGA-324 (19 x 19 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount |
| Speed Grade | -7 |
| Operating Temperature (Industrial) | -40C to +100C |
| Configuration Modes | JTAG, Active Serial (AS), Passive Serial (PS) |
| Lead-Free / RoHS | Yes (per datasheet) |
| Device Type | FPGA - Field Programmable Gate Array |
EP1C4F324I7N fbga-324 (19 x 19 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EP1C4F324I7N (fbga-324 (19 x 19 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1C4F324I7N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C4F324I7N is suitable for 6 applications: Industrial Motor Control, Video Processing Front-End, Communication Protocol Bridging, Embedded Control and HMI, Test and Measurement Equipment, Aerospace and Defense Avionics (Legacy).
Industrial Motor Control
The EP1C4F324I7N fits industrial motor-control designs because its 4,000 logic elements and 30 embedded 18x18 multipliers can implement field-oriented control (FOC) algorithms, PWM modulators, and encoder interfaces in a single chip. The -7 industrial speed grade supports operation from -40C to +100C, matching factory-floor and outdoor cabinet environments. With 249 user I/Os the device can directly connect to multi-axis inverter boards, Hall sensors, and resolver excitation circuits. The four PLLs generate precisely phased clocks for ADC sampling and PWM switching, critical for current-loop stability. Compared with a microcontroller-only approach, the Cyclone I offers parallel DSP throughput and deterministic latency that simplify three-phase sine generation and space-vector modulation at switching rates above 20 kHz.
Recommended
Video Processing Front-End
In video bridge and display-controller applications, the EP1C4F324I7N provides enough logic to implement ITU-R BT.656 / BT.1120 capture, de-interlacing, color-space conversion, and overlay composition. The 17 M4K RAM blocks (78 Kbits total) serve as line buffers for temporal video processing at SD resolutions, and the LVDS receivers support direct connection to CMOS image sensors and HDMI bridges. The 405 MHz internal clock enables pixel-clock multiplication and frame-rate conversion. The 1.5 V core supply and 130 nm process deliver low-power operation suited to fanless embedded displays. Compared with a stand-alone video processor ASIC, the FPGA path allows in-field protocol upgrades and customer-specific menu or OSD customization without silicon re-spin.
Recommended
Communication Protocol Bridging
The EP1C4F324I7N is well suited to glue-logic and protocol-bridging applications, including PCI-to-local-bus bridges, UART/SPI/I2C aggregation, Ethernet MAC front-ends, and CAN-to-UART converters. The 249 user I/Os accept numerous parallel buses, while the embedded multipliers support CRC, checksum, and whitening operations required by serial protocols. The 4 K LE fabric comfortably absorbs state machines for arbitration, FIFO control, and timing-sensitive bit-banging. Industrial temperature grade and high I/O count make it a reliable host in telecom and industrial gateway equipment. Compared with discrete logic ICs, a single Cyclone I reduces board area, BOM count, and qualification effort when adding new peripherals to a legacy CPU board.
Recommended
Embedded Control and HMI
Human-machine interface (HMI) panels and embedded controllers use the EP1C4F324I7N to drive LCD / TFT panels, scan keypads, run real-time control loops, and interface with host processors. The 4K LE fabric is large enough to implement custom fonts, touch-panel decoding, and graphic primitives while leaving headroom for application logic. The SRAM-backed configuration enables instant-on and field-upgradable firmware via JTAG or active serial flash. The -7 industrial temperature grade allows deployment in factory and outdoor enclosures. Compared with microcontroller + LCD controller chip solutions, the FPGA consolidates timing generation, backlight PWM, and parallel-to-serial conversion in one device, simplifying the BOM.
Recommended
Test and Measurement Equipment
Test-and-measurement instruments such as protocol analyzers, logic analyzers front-ends, and programmable signal generators use the EP1C4F324I7N for high-speed pattern generation, capture, and real-time triggering. The 405 MHz internal clock and 30 multipliers support DDS (direct digital synthesis), I/Q generation, and FIR filter implementations. The 4 K LE fabric hosts custom stimulus patterns while the 78 Kbits of RAM captures acquisition buffers. The industrial temperature range and high I/O count allow interfacing with many channels of front-end ADCs and DACs. Compared with fixed-function ASICs, the FPGA path permits post-deployment protocol additions and bug-fix updates that extend product lifecycles.
Recommended
Aerospace and Defense Avionics (Legacy)
Long-lifecycle aerospace and defense programs often standardize on the Cyclone I family for non-flight-critical subsystems, mission computers, and ground support equipment, where the EP1C4F324I7N's industrial temperature grade and stable supply chain met qualification requirements when the family was active. The 4 K LE fabric hosts MIL-STD-1553 / ARINC 429 interfaces, custom backplane bridges, and discrete I/O aggregation. Because the Cyclone I family is in last-time-buy, such programs must qualify Cyclone IV or Cyclone 10 LP migration parts under their existing qualification processes. Compared with newer FPGAs, the Cyclone I's mature tool flow and predictable timing closure simplify DO-254 documentation for legacy refresh programs.
Recommended
Recommended Products Summary
Engineering reference data for EP1C4F324I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C4F324I7 | EP1C4F324C7N | EP1C4F324C8N | EP1C4F324C6N | EP1C4F324C6 |
|---|---|---|---|---|---|---|
| Package | FBGA-324 (19x19 mm) | FBGA-324 (19x19 mm) - same | FBGA-324 (19x19 mm) - same | FBGA-324 (19x19 mm) - same | FBGA-324 (19x19 mm) - same | FBGA-324 (19x19 mm) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| Speed Grade | -7 (industrial) | -7 (industrial) | -7 (commercial) | -8 (commercial, slower) | -6 (commercial, fastest) | -6 (commercial, fastest) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Maximum User I/Os | 249 | 249 | 249 | 249 | 249 | 249 |
| Embedded RAM | 78 Kbits (60 Kbits w/o parity) | 78 Kbits | 78 Kbits | 78 Kbits | 78 Kbits | 78 Kbits |
| Embedded Multipliers (18x18) | 30 | 30 | 30 | 30 | 30 | 30 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- Industrial temperature grade availability in same FBGA-324 footprint (vs EP1C4F324C7N)
- Higher performance per LE versus Cyclone I -8 variant (vs EP1C4F324C8N)
- Same logic element count as -6 grade with industrial temp (vs EP1C4F324C6N)
Design Notes
The EP1C4F324I7N requires a tightly regulated 1.5 V core supply (VCCINT) plus per-bank VCCIO supplies. Per the Cyclone I Device Handbook, each VCCINT pin should be decoupled with a 0.1 uF ceramic capacitor placed within 100 mil of the ball, plus a 10 uF bulk capacitor per bank of supply pins. VCCA_PLL (PLL analog supply) must be filtered with a ferrite bead and decoupled with 10 uF + 0.1 uF to prevent jitter. Failure to follow the decoupling guidelines can manifest as logic errors or PLL unlock at high toggle rates.
The 324-ball FBGA at 1.0 mm pitch requires microvia (laser-drilled) PCB technology or escape routing on inner layers. Fan-out from the BGA must follow Altera's reference layout, keeping all signal traces on the escape layer impedance-controlled (50 ohm single-ended, 100 ohm differential) when carrying high-speed LVDS or SSTL. Thermal vias under the center balls tied to an internal ground plane help spread the ~1-2 W typical dissipation of the EP1C4 device. Source: AN 114: Altera PCB Design Guidelines for BGA Packages.
Do not configure unused I/O banks without a valid VCCIO supply - leave them connected to a valid rail even if all pins in that bank are unused, or Quartus will flag the configuration as invalid. Also, when migrating between Cyclone I speed grades, the Quartus fitter report may show timing differences that require recompiling with the new device selected; bitstreams are not interchangeable across speed grades. Finally, JTAG chain ordering with EPCS configuration flash on the same chain can cause configuration failure if the order is incorrect.
For LVDS and RSDS outputs on the EP1C4F324I7N, use the Altera IBIS models to perform pre-layout signal-integrity simulation; the device's true and complement pins are tightly matched but board-level skew must be controlled to under 50 ps for >500 Mbps operation. Series-source termination (typically 30-50 ohms) on long LVDS traces reduces overshoot. When using SSTL Class II memories, place the VTT termination voltage and reference divider resistors close to the FPGA bank.
Compliance Information
RoHS-compliant per Altera / Intel product page (lead-free FBGA-324). AEC-Q100 not applicable (industrial temp grade is not the same as automotive qualification). Halogen-free status not stated in retrieved data; flagged unknown.
