EP1SGX25DF672I6 - Stratix GX FPGA 25,660 Cells | Intel | 672-FBGA
N.º de pieza: EP1SGX25DF672I6 ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $225 | $2.250,00 |
| 100 | $195 | $19.500,00 |
| 500 | $168 | $84.000,00 |
| 1.000 | $145 | $145.000,00 |
EP1SGX25DF672I6 Descripción general
An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose logic functionality is defined after manufacturing by the customer rather than the fab. FPGAs occupy the programmable-logic branch of the semiconductor hierarchy (FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor), and the Stratix GX family specifically targets high-bandwidth serial I/O applications such as backplanes, communications line cards, and signal-processing pipelines. The "GX" suffix distinguishes this family from the base Stratix line by embedding multi-gigabit transceivers (MGTs) directly on-die.
Key features of the EP1SGX25DF672I6 include 25,660 logic elements, 1,944,576 RAM bits (192 Kbytes), 455 user I/O, dedicated on-chip transceiver circuitry, embedded DSP blocks, and clock management via PLLs. The 672-ball FBGA at 33 x 33 mm with 1.0 mm pitch is RoHS compliant and lead-free per the manufacturer's product page.
Typical applications include high-speed serial interface bridging, custom communications backplanes, protocol conversion (e.g., SPI 4.2, RapidIO, SerialLite), and DSP front-end co-processing. The combination of 455 user I/O and embedded transceiver macros makes this part attractive for line-card designs that require both wide parallel buses and multiple serial links.
Design considerations for the EP1SGX25DF672I6 include multi-rail power sequencing (1.5 V VCCINT plus VCCIO banks), careful BGA fan-out, and thermal management of the 672-ball package. Designers should use the Quartus II design toolchain, which natively supports this device family and provides IP cores for the on-chip transceivers and DSP blocks.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes not collected in any single datasheet document.
Alternativas directas para EP1SGX25DF672I6 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1SGX25DF672I6 (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Process Technology, Speed Grade, Family.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1SGX25DF672I6N
✅ Sustitución directa✓ En stock
$298 / unidad
Ver hoja de datos →EP1SGX25DF672I5N
✅ Sustitución directa✓ En stock
$118 / unidad
Ver hoja de datos →EP1SGX25DF672I5
✅ Sustitución directa✓ En stock
$355 / unidad
Ver hoja de datos →EP1SGX25DF672C7N
✅ Sustitución directa✓ En stock
$245 / unidad
Ver hoja de datos →EP1SGX25DF672C7
✅ Sustitución directa✓ En stock
$125.4 / unidad
Ver hoja de datos →EP1SGX25DF672C6N
✅ Sustitución directa✓ En stock
$210 / unidad
Ver hoja de datos →EP1SGX25DF67216
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP1SGX25DF672I6 Valores máximos y características eléctricas
| Series | Stratix GX |
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 455 |
| Encapsulado | 672-BBGA (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Temperatura de funcionamiento | -40C to +85C (industrial, I6 grade) |
| Temperature Grade | Industrial (I6) |
| Maximum Internal Frequency | 5000 MHz (per datasheet header) |
| Tipo de montaje | Surface Mount |
| Lead Free / RoHS | Yes / Compliant |
| Número de pines | 672 |
| DSP Blocks | Yes (embedded multipliers) |
| On-chip Transceivers | Yes (Stratix GX embedded MGTs) |
| Clock Management | PLLs (on-chip) |
| Logic Family / Base Technology | CMOS |
Guía de configuración de pines de EP1SGX25DF672I6 672-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch
Configuración de pines para EP1SGX25DF672I6 (encapsulado 672-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1SGX25DF672I6.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1SGX25DF672I6 es adecuado para 6 aplicacións: High-Speed Serial Interface Bridging, Communications Line Card Design, Custom Protocol Conversion (SPI 4.2 / RapidIO / SerialLite), DSP Co-Processing Front-End, Test and Measurement Backplane Aggregation, Legacy Industrial Control and Factory Automation.
High-Speed Serial Interface Bridging
The EP1SGX25DF672I6 is purpose-built for serial-interface bridging because it embeds Stratix GX multi-gigabit transceivers directly on-die, alongside 455 user I/O for parallel side-band signals. The 25,660-LE fabric is sized to absorb protocol-conversion state machines (8b/10b, 64b/66b, channel bonding) without external logic, while the on-chip PLLs generate the multiple reference clocks these links require. Engineers use this part to bridge between backplanes running proprietary SERDES rates and ASIC/ASSP interfaces that only expose parallel LVDS or HSTL buses. Compared with glue-logic plus external SERDES, the integrated approach cuts board area, BOM count, and inter-chip latency for 1-3 Gbps links.
Recomendado
Communications Line Card Design
In telecom line cards the EP1SGX25DF672I6 functions as the glue between a network processor, framer/mapper, and the physical-layer SERDES. Its 455 user I/O comfortably accommodates 32-bit LVDS datapaths to an NPU, plus SPI 4.2 / SFI-4 / SerialLite side channels. The 1,944,576 bits of block RAM are large enough to buffer packet segments and implement per-channel statistics counters in hardware. Industrial -40C to +85C temperature grade (I6) lets the card operate in uncontrolled central-office environments. Designers choose the 672-ball FBGA over the 1020-ball family variant to keep PCB layer count and BGA escape cost manageable for mid-density line cards.
Recomendado
Custom Protocol Conversion (SPI 4.2 / RapidIO / SerialLite)
The EP1SGX25DF672I6 is widely deployed as a protocol-conversion engine because its 25,660 LEs can hold substantial FIFOs and packet-fragmentation state machines, while the embedded MGTs serialize the converted traffic at 1-3.125 Gbps. Altera/Intel IP cores (SPI 4.2 PHY, RapidIO, SerialLite II) are pre-validated against the Stratix GX family, which compresses integration time. Industrial temperature grade supports outdoor base-station and industrial-Ethernet equipment. The 672-ball FBGA is small enough for ATCA/AdvancedMC mezzanine cards where board area is at a premium but bandwidth is not.
Recomendado
DSP Co-Processing Front-End
The Stratix GX die in the EP1SGX25DF672I6 includes embedded multiplier/accumulator blocks sized for FIR filters, FFTs, and channelizers - making the part an effective DSP front-end sitting ahead of a host CPU or DSP ASIC. Data enters through the embedded transceivers, gets beam-formed or pulse-shaped in the FPGA fabric, and exits on parallel LVDS to a downstream processor. The 1.9 Mbit of block RAM is large enough to hold coefficient banks for adaptive filters and short FFT windows. Designers select the EP1SGX25 over the smaller EP1SGX10 when the DSP workload exceeds ~10k LEs after synthesis.
Recomendado
Test and Measurement Backplane Aggregation
Test equipment vendors use the EP1SGX25DF672I6 to aggregate multiple instrument channels onto a high-speed serial backplane. The 455 user I/O easily collects 8-16 LVDS channels from ADC/DAC front ends, and the on-chip transceivers push the aggregated data upstream over one or more multi-gigabit links. The 25,660 LEs are large enough to implement custom packetization, timestamping, and trigger logic without an external microcontroller. Industrial temperature operation lets the aggregation board sit in chassis that are not thermally controlled. The 672-ball FBGA footprint matches the Stratix GX mechanical ecosystem used across multiple product generations.
Recomendado
Legacy Industrial Control and Factory Automation
The EP1SGX25DF672I6 is still in service in long-lifecycle industrial automation designs that were launched during the Stratix GX era (2004-2010). The FPGA implements custom motion-control state machines, encoder interfaces, and machine-vision pre-processing, while the on-chip transceivers carry compressed image data to a central controller over fibre. The industrial -40C to +85C temperature grade handles factory-floor thermal stress, and the obsolete status is mitigated by franchised-distributor stock. Engineers sustaining these systems migrate to drop-in speed-grade or temperature-grade variants on the existing DF672 footprint rather than redesigning PCBs.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1SGX25DF672I6 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1SGX25DF672I6N | EP1SGX25DF672I5N | EP1SGX25DF672C7N | EP1SGX25DF672C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (DF672) 33x33 mm | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O | 455 | 455 | 455 | 455 | 455 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | I6 (industrial, -6) | I6 | I5 (faster) | C7 (commercial, slower) | C6 (commercial) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS / Lead Free | Yes | Yes (N finish) | Yes (N finish) | Yes (N finish) | Yes (N finish) |
| On-chip Transceivers | Yes (Stratix GX MGTs) | Yes | Yes | Yes | Yes |
Diferenciadores clave
- Same-package drop-in flexibility across speed and temperature grades (frente a EP1SGX25DF672I5N)
- RoHS-compliant finish variant for new-build compliance (frente a EP1SGX25DF672I6N)
- Industrial temperature grade for harsh environments (frente a EP1SGX25DF672C7N)
Notas de diseño
Estimated: the EP1SGX25DF672I6 requires multi-rail power (VCCINT 1.5 V core plus multiple VCCIO bank voltages). Use a sequencer or RC delay network to ensure VCCINT ramps before VCCIO; reverse sequencing can latch-up I/O buffers. Decoupling per the Stratix GX pin connection guidelines: at least 0.1 uF and 0.01 uF ceramic per VCCINT pin, plus bulk tantalum or polymer capacitors near the package. The on-chip transceivers have separate PLL analog supplies (VCCA_PLL) that must be filtered with ferrite beads to keep PLL jitter within spec.
The 672-ball FBGA exposes its thermal pad via the centre ball array; solder the EP1SGX25DF672I6 to a PCB thermal pad with thermal vias to an internal copper plane to keep theta-JA manageable. In a fan-less industrial enclosure, derate internal-clock frequency or reduce transceiver count if the case temperature approaches +85C. The I6 grade (industrial -40C to +85C) is rated for the case, not ambient, so a real thermal probe is essential during validation.
The 33 x 33 mm 672-ball FBGA at 1.0 mm pitch requires 6 or 8 PCB layers with microvia-in-pad or via-on-pad escape for the centre balls. Maintain at least 4 routing layers between BGA and high-speed transceivers to control impedance (100 ohm differential for MGT pairs). Keep SERDES trace lengths matched within the tolerance specified in the Stratix GX handbook (typically under 150 mil intra-pair, 2-4 inches pair-to-pair) and avoid 90-degree bends on any MGT trace.
Do not confuse the EP1SGX25DF672I6 (672-ball DF672 package) with the EP1SGX25CF672I6 (672-ball CF672 package) - both are 672-ball but the BGA ball maps differ, so a PCB designed for DF672 will not accept CF672. Likewise, the EP1SGX40GF1020I6 is a 1020-ball package and is not pin-compatible. Always cross-check the package suffix (DF672 vs CF672 vs GF1020) against your PCB land pattern before ordering. Configuration mode pins (MSEL) must match the Quartus II programming file for the chosen configuration scheme (AS, PS, JTAG, or FPP).
Información de cumplimiento
RoHS and lead-free status confirmed by Intel Altera product page for EP1SGX25DF672I6. REACH compliance carried over from manufacturer documentation. Halogen-free and conflict-minerals declarations not explicitly published in the verified data - flagged as unknown.
