EP1SGX25DF672I6 - Stratix GX FPGA 25,660 Cells | Intel | 672-FBGA
부품 번호: EP1SGX25DF672I6 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $225 | $2,250.00 |
| 100 | $195 | $19,500.00 |
| 500 | $168 | $84,000.00 |
| 1,000 | $145 | $145,000.00 |
EP1SGX25DF672I6 개요
An FPGA (Field Programmable Gate Array) is a type of integrated circuit whose logic functionality is defined after manufacturing by the customer rather than the fab. FPGAs occupy the programmable-logic branch of the semiconductor hierarchy (FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor), and the Stratix GX family specifically targets high-bandwidth serial I/O applications such as backplanes, communications line cards, and signal-processing pipelines. The "GX" suffix distinguishes this family from the base Stratix line by embedding multi-gigabit transceivers (MGTs) directly on-die.
Key features of the EP1SGX25DF672I6 include 25,660 logic elements, 1,944,576 RAM bits (192 Kbytes), 455 user I/O, dedicated on-chip transceiver circuitry, embedded DSP blocks, and clock management via PLLs. The 672-ball FBGA at 33 x 33 mm with 1.0 mm pitch is RoHS compliant and lead-free per the manufacturer's product page.
Typical applications include high-speed serial interface bridging, custom communications backplanes, protocol conversion (e.g., SPI 4.2, RapidIO, SerialLite), and DSP front-end co-processing. The combination of 455 user I/O and embedded transceiver macros makes this part attractive for line-card designs that require both wide parallel buses and multiple serial links.
Design considerations for the EP1SGX25DF672I6 include multi-rail power sequencing (1.5 V VCCINT plus VCCIO banks), careful BGA fan-out, and thermal management of the 672-ball package. Designers should use the Quartus II design toolchain, which natively supports this device family and provides IP cores for the on-chip transceivers and DSP blocks.
This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes not collected in any single datasheet document.
드롭인 대체품: EP1SGX25DF672I6 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP1SGX25DF672I6 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, Speed Grade, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1SGX25DF672I6N
✅ 드롭인✓ 재고 있음
$298 / 개
데이터시트 보기 →EP1SGX25DF672I5N
✅ 드롭인✓ 재고 있음
$118 / 개
데이터시트 보기 →EP1SGX25DF672I5
✅ 드롭인✓ 재고 있음
$355 / 개
데이터시트 보기 →EP1SGX25DF672C7N
✅ 드롭인✓ 재고 있음
$245 / 개
데이터시트 보기 →EP1SGX25DF672C7
✅ 드롭인✓ 재고 있음
$125.4 / 개
데이터시트 보기 →EP1SGX25DF672C6N
✅ 드롭인✓ 재고 있음
$210 / 개
데이터시트 보기 →EP1SGX25DF67216
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP1SGX25DF672I6 최대 정격 & 전기적 특성
| Series | Stratix GX |
| Family | Stratix GX |
| Logic Elements | 25,660 |
| Total RAM Bits | 1,944,576 |
| User I/O Count | 455 |
| 패키지 | 672-BBGA (FC-FBGA), 33 x 33 mm, 1.0 mm pitch |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.5 V |
| 동작 온도 | -40C to +85C (industrial, I6 grade) |
| Temperature Grade | Industrial (I6) |
| Maximum Internal Frequency | 5000 MHz (per datasheet header) |
| 실장 유형 | Surface Mount |
| Lead Free / RoHS | Yes / Compliant |
| 핀 수 | 672 |
| DSP Blocks | Yes (embedded multipliers) |
| On-chip Transceivers | Yes (Stratix GX embedded MGTs) |
| Clock Management | PLLs (on-chip) |
| Logic Family / Base Technology | CMOS |
EP1SGX25DF672I6 672-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch 핀 구성 가이드
EP1SGX25DF672I6(672-bbga (fc-fbga), 33 x 33 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP1SGX25DF672I6.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP1SGX25DF672I6 적합 용도: 6 애플리케이션s: High-Speed Serial Interface Bridging, Communications Line Card Design, Custom Protocol Conversion (SPI 4.2 / RapidIO / SerialLite), DSP Co-Processing Front-End, Test and Measurement Backplane Aggregation, Legacy Industrial Control and Factory Automation.
High-Speed Serial Interface Bridging
The EP1SGX25DF672I6 is purpose-built for serial-interface bridging because it embeds Stratix GX multi-gigabit transceivers directly on-die, alongside 455 user I/O for parallel side-band signals. The 25,660-LE fabric is sized to absorb protocol-conversion state machines (8b/10b, 64b/66b, channel bonding) without external logic, while the on-chip PLLs generate the multiple reference clocks these links require. Engineers use this part to bridge between backplanes running proprietary SERDES rates and ASIC/ASSP interfaces that only expose parallel LVDS or HSTL buses. Compared with glue-logic plus external SERDES, the integrated approach cuts board area, BOM count, and inter-chip latency for 1-3 Gbps links.
추천
Communications Line Card Design
In telecom line cards the EP1SGX25DF672I6 functions as the glue between a network processor, framer/mapper, and the physical-layer SERDES. Its 455 user I/O comfortably accommodates 32-bit LVDS datapaths to an NPU, plus SPI 4.2 / SFI-4 / SerialLite side channels. The 1,944,576 bits of block RAM are large enough to buffer packet segments and implement per-channel statistics counters in hardware. Industrial -40C to +85C temperature grade (I6) lets the card operate in uncontrolled central-office environments. Designers choose the 672-ball FBGA over the 1020-ball family variant to keep PCB layer count and BGA escape cost manageable for mid-density line cards.
추천
Custom Protocol Conversion (SPI 4.2 / RapidIO / SerialLite)
The EP1SGX25DF672I6 is widely deployed as a protocol-conversion engine because its 25,660 LEs can hold substantial FIFOs and packet-fragmentation state machines, while the embedded MGTs serialize the converted traffic at 1-3.125 Gbps. Altera/Intel IP cores (SPI 4.2 PHY, RapidIO, SerialLite II) are pre-validated against the Stratix GX family, which compresses integration time. Industrial temperature grade supports outdoor base-station and industrial-Ethernet equipment. The 672-ball FBGA is small enough for ATCA/AdvancedMC mezzanine cards where board area is at a premium but bandwidth is not.
추천
DSP Co-Processing Front-End
The Stratix GX die in the EP1SGX25DF672I6 includes embedded multiplier/accumulator blocks sized for FIR filters, FFTs, and channelizers - making the part an effective DSP front-end sitting ahead of a host CPU or DSP ASIC. Data enters through the embedded transceivers, gets beam-formed or pulse-shaped in the FPGA fabric, and exits on parallel LVDS to a downstream processor. The 1.9 Mbit of block RAM is large enough to hold coefficient banks for adaptive filters and short FFT windows. Designers select the EP1SGX25 over the smaller EP1SGX10 when the DSP workload exceeds ~10k LEs after synthesis.
추천
Test and Measurement Backplane Aggregation
Test equipment vendors use the EP1SGX25DF672I6 to aggregate multiple instrument channels onto a high-speed serial backplane. The 455 user I/O easily collects 8-16 LVDS channels from ADC/DAC front ends, and the on-chip transceivers push the aggregated data upstream over one or more multi-gigabit links. The 25,660 LEs are large enough to implement custom packetization, timestamping, and trigger logic without an external microcontroller. Industrial temperature operation lets the aggregation board sit in chassis that are not thermally controlled. The 672-ball FBGA footprint matches the Stratix GX mechanical ecosystem used across multiple product generations.
추천
Legacy Industrial Control and Factory Automation
The EP1SGX25DF672I6 is still in service in long-lifecycle industrial automation designs that were launched during the Stratix GX era (2004-2010). The FPGA implements custom motion-control state machines, encoder interfaces, and machine-vision pre-processing, while the on-chip transceivers carry compressed image data to a central controller over fibre. The industrial -40C to +85C temperature grade handles factory-floor thermal stress, and the obsolete status is mitigated by franchised-distributor stock. Engineers sustaining these systems migrate to drop-in speed-grade or temperature-grade variants on the existing DF672 footprint rather than redesigning PCBs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP1SGX25DF672I6 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1SGX25DF672I6N | EP1SGX25DF672I5N | EP1SGX25DF672C7N | EP1SGX25DF672C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 672-FBGA (DF672) 33x33 mm | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same | 672-FBGA (DF672) 33x33 mm - same |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| User I/O | 455 | 455 | 455 | 455 | 455 |
| Total RAM Bits | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 | 1,944,576 |
| Speed Grade | I6 (industrial, -6) | I6 | I5 (faster) | C7 (commercial, slower) | C6 (commercial) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +70C | Commercial 0C to +70C |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS / Lead Free | Yes | Yes (N finish) | Yes (N finish) | Yes (N finish) | Yes (N finish) |
| On-chip Transceivers | Yes (Stratix GX MGTs) | Yes | Yes | Yes | Yes |
주요 차별점
- Same-package drop-in flexibility across speed and temperature grades (vs EP1SGX25DF672I5N)
- RoHS-compliant finish variant for new-build compliance (vs EP1SGX25DF672I6N)
- Industrial temperature grade for harsh environments (vs EP1SGX25DF672C7N)
설계 노트
Estimated: the EP1SGX25DF672I6 requires multi-rail power (VCCINT 1.5 V core plus multiple VCCIO bank voltages). Use a sequencer or RC delay network to ensure VCCINT ramps before VCCIO; reverse sequencing can latch-up I/O buffers. Decoupling per the Stratix GX pin connection guidelines: at least 0.1 uF and 0.01 uF ceramic per VCCINT pin, plus bulk tantalum or polymer capacitors near the package. The on-chip transceivers have separate PLL analog supplies (VCCA_PLL) that must be filtered with ferrite beads to keep PLL jitter within spec.
The 672-ball FBGA exposes its thermal pad via the centre ball array; solder the EP1SGX25DF672I6 to a PCB thermal pad with thermal vias to an internal copper plane to keep theta-JA manageable. In a fan-less industrial enclosure, derate internal-clock frequency or reduce transceiver count if the case temperature approaches +85C. The I6 grade (industrial -40C to +85C) is rated for the case, not ambient, so a real thermal probe is essential during validation.
The 33 x 33 mm 672-ball FBGA at 1.0 mm pitch requires 6 or 8 PCB layers with microvia-in-pad or via-on-pad escape for the centre balls. Maintain at least 4 routing layers between BGA and high-speed transceivers to control impedance (100 ohm differential for MGT pairs). Keep SERDES trace lengths matched within the tolerance specified in the Stratix GX handbook (typically under 150 mil intra-pair, 2-4 inches pair-to-pair) and avoid 90-degree bends on any MGT trace.
Do not confuse the EP1SGX25DF672I6 (672-ball DF672 package) with the EP1SGX25CF672I6 (672-ball CF672 package) - both are 672-ball but the BGA ball maps differ, so a PCB designed for DF672 will not accept CF672. Likewise, the EP1SGX40GF1020I6 is a 1020-ball package and is not pin-compatible. Always cross-check the package suffix (DF672 vs CF672 vs GF1020) against your PCB land pattern before ordering. Configuration mode pins (MSEL) must match the Quartus II programming file for the chosen configuration scheme (AS, PS, JTAG, or FPP).
규정 준수 정보
RoHS and lead-free status confirmed by Intel Altera product page for EP1SGX25DF672I6. REACH compliance carried over from manufacturer documentation. Halogen-free and conflict-minerals declarations not explicitly published in the verified data - flagged as unknown.
