EP1SGX40GF1020I6NA - Stratix GX FPGA, 41,250 LEs, 624 I/O, 1020-FBGA | Altera (Intel)
N.º de pieza: EP1SGX40GF1020I6NA ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
EP1SGX40GF1020I6NA Descripción general
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP such as transceivers, PLLs, and block RAM. FPGAs sit at the top of the programmable logic hierarchy (above CPLDs and PALs) and below ASICs in terms of unit volume per design. Stratix GX belongs to Altera's high-performance transceiver-equipped family, bridging discrete logic and ASIC-level integration by combining soft logic flexibility with hardened multi-gigabit serial I/O.
Key features include 624 user I/O pins, embedded transceiver channels supporting protocols such as Gigabit Ethernet (per IEEE 802.3 clause 36 rate matching), PCI Express, Serial RapidIO, and SONET/SDH. The device also integrates TriMatrix on-chip memory, DSP blocks, and an enhanced Phase-Locked Loop (PLL) array. The 1020-FBGA package exposes the full transceiver and I/O bandwidth of the die while providing robust thermal dissipation for sustained operation.
Architecturally, the EP1SGX40GF1020I6NA leverages a 1.5 V core voltage with 0.13-micron process technology typical of the Stratix GX generation. The integrated rate matcher adheres to IEEE 802.3 clause 36 for idle additions or removals, performing clock compensation only on /I2/ ordered sets (/K28.5/+ followed by /D16.2/-). This makes the part well-suited for wireline telecom and datacom line cards where deterministic clock compensation is mandatory.
Typical applications include high-speed serial backplane aggregation, broadband access equipment, military/aerospace signal processing, industrial imaging systems, and ASIC prototyping. Engineers typically pair the part with Altera's Quartus II design suite for HDL synthesis, place-and-route, and timing closure. Designers selecting this FPGA should plan power-rail sequencing for the 1.5 V core and per-bank I/O supplies, allocate sufficient board area for the 1020-ball BGA, and ensure JTAG access for in-system programming and boundary-scan test.
Alternativas directas para EP1SGX40GF1020I6NA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1SGX40GF1020I6NA (mismo factor de forma y huella) — difiere en Operating Temperature, Package, Process Technology, Family, RoHS Status.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1SGX40GF1020I6N
✅ Sustitución directa✓ En stock
$1195 / unidad
Ver hoja de datos →EP1SGX40GF1020I6
✅ Sustitución directa✓ En stock
$175 / unidad
Ver hoja de datos →EP1SGX40GF1020I5N
✅ Sustitución directa✓ En stock
$140 / unidad
Ver hoja de datos →EP1SGX40GF1020I5
✅ Sustitución directa✓ En stock
$1325 / unidad
Ver hoja de datos →EP1SGX40DF1020I6N
✅ Sustitución directa✓ En stock
$1450 / unidad
Ver hoja de datos →EP1SGX40FF1020I6
✅ Sustitución directa✓ En stock
$950 / unidad
Ver hoja de datos →EP1SGX40GF1020I6NA Valores máximos y características eléctricas
| Series | Stratix GX |
| Family | Stratix |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4125 |
| Embedded Memory (bits) | 3,423,744 |
| User I/O Count | 624 |
| Encapsulado | 1020-BBGA (FineLine BGA) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Speed Grade | I6 |
| Transceivers | Multi-gigabit GX transceivers (GigE, PCIe, Serial RapidIO, SONET/SDH) |
| Voltage - Core | 1.5 V |
| Tipo de montaje | Surface Mount |
| Process Technology | 0.13 micron CMOS |
| Nivel MSL | 3 (168 hours) |
| Estado RoHS | Non-compliant (legacy Altera generation) |
Guía de configuración de pines de EP1SGX40GF1020I6NA 1020-bbga (fineline bga)
Configuración de pines para EP1SGX40GF1020I6NA (encapsulado 1020-bbga (fineline bga)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP1SGX40GF1020I6NA.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP1SGX40GF1020I6NA es adecuado para 6 aplicacións: Multi-Gigabit Serial Backplane Aggregation, Broadband Access and DSLAM Line Cards, Military and Aerospace Signal Processing, Industrial Imaging and Machine Vision, ASIC Prototyping and Emulation, Wireline Telecom and Datacom Line Cards.
Multi-Gigabit Serial Backplane Aggregation
The EP1SGX40GF1020I6NA's hardened multi-gigabit transceivers (GigE, PCIe, Serial RapidIO, SONET/SDH) and 41,250 logic elements make it a drop-in aggregation fabric for ATCA/AdvancedTCA backplanes. It supports deterministic IEEE 802.3 clause 36 rate matching and clock compensation on /I2/ ordered sets, simplifying protocol stack integration. The 1020-FBGA exposes 624 user I/O alongside 20+ transceiver channels for line-card designs aggregating 10G Ethernet, SONET OC-192, or Serial RapidIO traffic.
Recomendado
Broadband Access and DSLAM Line Cards
The EP1SGX40GF1020I6NA combines high logic density (4,125 LABs) with embedded transceivers to terminate multiple DSL or PON channels on a single line card. Its 3,423,744 bits of TriMatrix memory buffers packet bursts and its 624 user I/O connect to PHY devices, TDM fabrics, and network processors. Industrial temperature range (-40C to +100C) supports outdoor cabinet deployment typical of central office and remote DSLAM sites.
Recomendado
Military and Aerospace Signal Processing
Industrial temperature range (-40C to +100C), high logic density, and ruggedized BGA packaging make the EP1SGX40GF1020I6NA well-suited for military radar, electronic warfare, and avionics DSP subsystems. The FPGA runs FFT, channelization, and pulse-compression algorithms at hardware speeds using dedicated DSP blocks, while transceivers digitize and forward IF streams to downstream processors. Engineers should verify MIL-STD-810 shock/vibration qualification with their PCB assembly house.
Recomendado
Industrial Imaging and Machine Vision
The EP1SGX40GF1020I6NA's parallel-processing capability and 624 I/O suit it for high-speed image acquisition in machine vision, automated optical inspection, and medical imaging. Its embedded memory buffers raw sensor data from Camera Link or CoaXPress links, while logic elements run Bayer demosaicing, edge detection, and compression. The industrial temperature range supports factory-floor deployments where ambient temperatures can exceed 70C.
Recomendado
ASIC Prototyping and Emulation
The EP1SGX40GF1020I6NA's 41,250 logic elements and 624 I/O provide substantial capacity for ASIC prototyping and in-circuit emulation. Design teams partition large ASIC RTL across multiple Stratix GX FPGAs and use the embedded transceivers for chip-to-chip interconnect between FPGA sites. The Quartus II design flow supports incremental synthesis, place-and-route, and timing closure for SoC bring-up before tape-out, validating functional correctness and firmware integration.
Recomendado
Wireline Telecom and Datacom Line Cards
The EP1SGX40GF1020I6NA serves as the framer/mapper/forward-error-correction engine in SONET/SDH, OTN, and 10G Ethernet line cards. The hardened transceivers implement PHY-side serial I/O at 1-3 Gbps rates, while logic elements run HDLC/PPP framing, GFP encapsulation, and Reed-Solomon FEC. Industrial temperature grade supports central-office and outside-plant deployment where ambient temperatures may fluctuate widely.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1SGX40GF1020I6NA — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1SGX40GF1020I6N | EP1SGX40GF1020I6 | EP1SGX40GF1020I5N | EP1SGX40GF1020I5 | EP1SGX40DF1020I6N |
|---|---|---|---|---|---|---|
| Package | 1020-BBGA (FineLine BGA) | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Number of LABs/CLBs | 4125 | 4125 | 4125 | 4125 | 4125 | 4125 |
| User I/O Count | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | I6 | I6 | I6 | I5 (slower) | I5 (slower) | I6 |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Stratix GX multi-gigabit transceivers hardened on-die (frente a EP1S40B956I6 (Stratix non-GX))
- Industrial temperature range for rugged deployments (frente a EP1SGX40GF1020C6N (commercial temp))
- 41,250 logic elements with 624 user I/O (frente a EP1SGX25FF1020C6 (Stratix GX 25))
Notas de diseño
Estimated: At typical 1.5V core operation with 41,250 logic elements and active transceivers, the EP1SGX40GF1020I6NA core current can reach 3-5 A under maximum toggle activity. Designers should budget 8-10 W core power plus per-bank I/O supply current. Use a multi-phase synchronous buck regulator for the core rail with 1% set-point accuracy, and sequence the 1.5 V core before per-bank I/O supplies to prevent I/O latch-up during power-up. Add bulk decoupling (220 uF polymer) plus 0.1 uF / 1 uF / 10 uF ceramic capacitors distributed around the BGA periphery.
The 1020-ball FineLine BGA requires a high-density interconnect PCB stack-up with microvias (laser-drilled, 4-6 mil pads) and a 1.0-1.27 mm ball pitch. Use a 6-8 layer stack-up with dedicated ground and power planes directly beneath the BGA to provide low-impedance return paths for high-speed transceiver signals. Maintain 100-ohm differential impedance for transceiver lanes with length-matched routing (within 5 mils across P/N pairs) and use buried vias or back-drilled through-vias for signal transitions.
Multi-gigabit transceivers (GigE, PCIe, Serial RapidIO, SONET/SDH) require careful signal integrity management: AC-coupling capacitors on transmit pairs (100 nF X7R 0402), pre-emphasis and de-emphasis settings per channel, and proper reference clock distribution with low-jitter PLLs. Use IBIS-AMI models for channel simulation including package parasitics, PCB traces, and connector/cable models. Validate eye diagrams at receiver side with target mask per protocol specification before committing to layout.
Do not confuse the EP1SGX40GF1020I6NA (Stratix GX, with transceivers) with the EP1S40B956I6 (Stratix, no transceivers) - both are obsolete but they are not drop-in replacements. When sourcing for legacy repairs, verify date code and lot number with the distributor to ensure functional continuity. Some Stratix GX parts have lead-based BGA balls (non-RoHS); confirm RoHS/REACH status against your program's environmental requirements before procurement.
Información de cumplimiento
Legacy Altera Stratix GX generation predates RoHS compliance requirements. RoHS status non-compliant per distributor listing. AEC-Q100 not applicable for FPGAs - this part targets industrial / military-grade applications rather than automotive. REACH, halogen-free, and conflict minerals status not specifically reported for this legacy part.