EP1SGX40GF1020I6NA - Stratix GX FPGA, 41,250 LEs, 624 I/O, 1020-FBGA | Altera (Intel)
MPN: EP1SGX40GF1020I6NA ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
Drop-in alternatives for EP1SGX40GF1020I6NA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1SGX40GF1020I6N
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View Datasheet →EP1SGX40GF1020I6
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View Datasheet →EP1SGX40GF1020I5N
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View Datasheet →EP1SGX40GF1020I5
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View Datasheet →EP1SGX40DF1020I6N
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View Datasheet →EP1SGX40FF1020I6
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View Datasheet →EP1SGX40GF1020I6NA Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Family | Stratix |
| Logic Elements | 41,250 |
| Number of LABs/CLBs | 4125 |
| Embedded Memory (bits) | 3,423,744 |
| User I/O Count | 624 |
| Package | 1020-BBGA (FineLine BGA) |
| Operating Temperature | -40C to +100C (Industrial) |
| Speed Grade | I6 |
| Transceivers | Multi-gigabit GX transceivers (GigE, PCIe, Serial RapidIO, SONET/SDH) |
| Voltage - Core | 1.5 V |
| Mounting Type | Surface Mount |
| Process Technology | 0.13 micron CMOS |
| MSL Level | 3 (168 hours) |
| RoHS Status | Non-compliant (legacy Altera generation) |
EP1SGX40GF1020I6NA 1020-bbga (fineline bga) Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020I6NA (1020-bbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020I6NA.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020I6NA is suitable for 6 applications: Multi-Gigabit Serial Backplane Aggregation, Broadband Access and DSLAM Line Cards, Military and Aerospace Signal Processing, Industrial Imaging and Machine Vision, ASIC Prototyping and Emulation, Wireline Telecom and Datacom Line Cards.
Multi-Gigabit Serial Backplane Aggregation
The EP1SGX40GF1020I6NA's hardened multi-gigabit transceivers (GigE, PCIe, Serial RapidIO, SONET/SDH) and 41,250 logic elements make it a drop-in aggregation fabric for ATCA/AdvancedTCA backplanes. It supports deterministic IEEE 802.3 clause 36 rate matching and clock compensation on /I2/ ordered sets, simplifying protocol stack integration. The 1020-FBGA exposes 624 user I/O alongside 20+ transceiver channels for line-card designs aggregating 10G Ethernet, SONET OC-192, or Serial RapidIO traffic.
Recommended
Broadband Access and DSLAM Line Cards
The EP1SGX40GF1020I6NA combines high logic density (4,125 LABs) with embedded transceivers to terminate multiple DSL or PON channels on a single line card. Its 3,423,744 bits of TriMatrix memory buffers packet bursts and its 624 user I/O connect to PHY devices, TDM fabrics, and network processors. Industrial temperature range (-40C to +100C) supports outdoor cabinet deployment typical of central office and remote DSLAM sites.
Recommended
Military and Aerospace Signal Processing
Industrial temperature range (-40C to +100C), high logic density, and ruggedized BGA packaging make the EP1SGX40GF1020I6NA well-suited for military radar, electronic warfare, and avionics DSP subsystems. The FPGA runs FFT, channelization, and pulse-compression algorithms at hardware speeds using dedicated DSP blocks, while transceivers digitize and forward IF streams to downstream processors. Engineers should verify MIL-STD-810 shock/vibration qualification with their PCB assembly house.
Recommended
Industrial Imaging and Machine Vision
The EP1SGX40GF1020I6NA's parallel-processing capability and 624 I/O suit it for high-speed image acquisition in machine vision, automated optical inspection, and medical imaging. Its embedded memory buffers raw sensor data from Camera Link or CoaXPress links, while logic elements run Bayer demosaicing, edge detection, and compression. The industrial temperature range supports factory-floor deployments where ambient temperatures can exceed 70C.
Recommended
ASIC Prototyping and Emulation
The EP1SGX40GF1020I6NA's 41,250 logic elements and 624 I/O provide substantial capacity for ASIC prototyping and in-circuit emulation. Design teams partition large ASIC RTL across multiple Stratix GX FPGAs and use the embedded transceivers for chip-to-chip interconnect between FPGA sites. The Quartus II design flow supports incremental synthesis, place-and-route, and timing closure for SoC bring-up before tape-out, validating functional correctness and firmware integration.
Recommended
Wireline Telecom and Datacom Line Cards
The EP1SGX40GF1020I6NA serves as the framer/mapper/forward-error-correction engine in SONET/SDH, OTN, and 10G Ethernet line cards. The hardened transceivers implement PHY-side serial I/O at 1-3 Gbps rates, while logic elements run HDLC/PPP framing, GFP encapsulation, and Reed-Solomon FEC. Industrial temperature grade supports central-office and outside-plant deployment where ambient temperatures may fluctuate widely.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020I6NA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020I6N | EP1SGX40GF1020I6 | EP1SGX40GF1020I5N | EP1SGX40GF1020I5 | EP1SGX40DF1020I6N |
|---|---|---|---|---|---|---|
| Package | 1020-BBGA (FineLine BGA) | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same | 1020-BBGA (FineLine BGA) - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Number of LABs/CLBs | 4125 | 4125 | 4125 | 4125 | 4125 | 4125 |
| User I/O Count | 624 | 624 | 624 | 624 | 624 | 624 |
| Speed Grade | I6 | I6 | I6 | I5 (slower) | I5 (slower) | I6 |
| Embedded Memory (bits) | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 | 3,423,744 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Qty-1 Unit Price (USD) | 285.00 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Stratix GX multi-gigabit transceivers hardened on-die (vs EP1S40B956I6 (Stratix non-GX))
- Industrial temperature range for rugged deployments (vs EP1SGX40GF1020C6N (commercial temp))
- 41,250 logic elements with 624 user I/O (vs EP1SGX25FF1020C6 (Stratix GX 25))
Design Notes
Estimated: At typical 1.5V core operation with 41,250 logic elements and active transceivers, the EP1SGX40GF1020I6NA core current can reach 3-5 A under maximum toggle activity. Designers should budget 8-10 W core power plus per-bank I/O supply current. Use a multi-phase synchronous buck regulator for the core rail with 1% set-point accuracy, and sequence the 1.5 V core before per-bank I/O supplies to prevent I/O latch-up during power-up. Add bulk decoupling (220 uF polymer) plus 0.1 uF / 1 uF / 10 uF ceramic capacitors distributed around the BGA periphery.
The 1020-ball FineLine BGA requires a high-density interconnect PCB stack-up with microvias (laser-drilled, 4-6 mil pads) and a 1.0-1.27 mm ball pitch. Use a 6-8 layer stack-up with dedicated ground and power planes directly beneath the BGA to provide low-impedance return paths for high-speed transceiver signals. Maintain 100-ohm differential impedance for transceiver lanes with length-matched routing (within 5 mils across P/N pairs) and use buried vias or back-drilled through-vias for signal transitions.
Multi-gigabit transceivers (GigE, PCIe, Serial RapidIO, SONET/SDH) require careful signal integrity management: AC-coupling capacitors on transmit pairs (100 nF X7R 0402), pre-emphasis and de-emphasis settings per channel, and proper reference clock distribution with low-jitter PLLs. Use IBIS-AMI models for channel simulation including package parasitics, PCB traces, and connector/cable models. Validate eye diagrams at receiver side with target mask per protocol specification before committing to layout.
Do not confuse the EP1SGX40GF1020I6NA (Stratix GX, with transceivers) with the EP1S40B956I6 (Stratix, no transceivers) - both are obsolete but they are not drop-in replacements. When sourcing for legacy repairs, verify date code and lot number with the distributor to ensure functional continuity. Some Stratix GX parts have lead-based BGA balls (non-RoHS); confirm RoHS/REACH status against your program's environmental requirements before procurement.
Compliance Information
Legacy Altera Stratix GX generation predates RoHS compliance requirements. RoHS status non-compliant per distributor listing. AEC-Q100 not applicable for FPGAs - this part targets industrial / military-grade applications rather than automotive. REACH, halogen-free, and conflict minerals status not specifically reported for this legacy part.
