EP1SGX40GF1020I5N - Stratix GX FPGA 41,250 LEs FC-FBGA-1020 | Altera
MPN: EP1SGX40GF1020I5N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $225 | $2,250.00 |
| 100 | $195 | $19,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $140 | $140,000.00 |
Drop-in alternatives for EP1SGX40GF1020I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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View Datasheet →EP1SGX40GF1020I5N Maximum Ratings & Electrical Characteristics
| Family | Stratix GX |
| Logic Elements | 41,250 |
| Configurable Logic Blocks (CLBs) | 4,125 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.425 V to 1.575 V (typ. 1.5 V) |
| High-Speed Transceiver Channels | 20 |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel |
| Aggregate Serial Bandwidth | Up to 127.5 Gbps full-duplex |
| Maximum Clock Frequency | 5000 MHz (transceiver; 6 MHz reported by some distributor aggregators) |
| Combinatorial Delay | 7.49 ns per CLB (reported) |
| Package | 1020-ball FineLine BGA (FC-FBGA), 33 x 33 mm, 1 mm pitch |
| Operating Temperature | 0 C to +85 C (commercial; 'I' grade per some aggregators) |
| Mounting Type | Surface Mount |
| Temperature Grade (per aggregator) | Military (per Vyrian aggregator listing) |
EP1SGX40GF1020I5N 1020-ball fineline bga (fc-fbga), 33 x 33 mm, 1 mm pitch Pin Configuration Guide
Complete pinout information for EP1SGX40GF1020I5N (1020-ball fineline bga (fc-fbga), 33 x 33 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1SGX40GF1020I5N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020I5N is suitable for 6 applications: Multi-Gigabit Serial Backplane Routing, SONET/SDH and OTN Line Cards, PCI Express Endpoint / Root Complex, Broadcast Video Router / Switcher, High-Speed Test and Measurement Equipment, Serial RapidIO / Fibre Channel Aggregation.
Multi-Gigabit Serial Backplane Routing
EP1SGX40GF1020I5N is purpose-built for serial backplane routing in central-office and data-center switches, with 20 CDR-based transceiver channels at up to 3.1875 Gbps each and 41,250 logic elements for switch-fabric arbitration. The on-chip rate matcher complies with IEEE 802.3 clause 36 for Gigabit Ethernet idle insertion/removal, eliminating external PHY chips. Compared to a discrete SERDES-plus-FPGA two-chip solution, EP1SGX40GF1020I5N reduces PCB area by roughly 40% and lowers bill-of-materials cost while simplifying signal-integrity closure.
Recommended
SONET/SDH and OTN Line Cards
EP1SGX40GF1020I5N supports OC-48/STM-16 (2.488 Gbps) and OTU1 (2.666 Gbps) line-card data rates directly through its on-chip transceivers, with the 41,250-LE fabric handling framer, mapper, and overhead-processing functions. The embedded CDR removes the need for external clock-recovery PLLs, simplifying the BOM and shortening design cycles. Designers targeting OC-192/STM-64 (10 Gbps) should migrate to Stratix II GX or later, because EP1SGX40 tops out at 3.1875 Gbps per lane.
Recommended
PCI Express Endpoint / Root Complex
EP1SGX40GF1020I5N implements the Physical Media Attachment (PMA) and Physical Coding Sublayer (PCS) of PCI Express 1.0a endpoints through its built-in 2.5 Gbps transceivers, while the 41,250-LE fabric hosts the Transaction Layer and Data Link Layer. Designers can build x4 or x8 PCIe endpoints in a single chip without external PHY silicon. For PCIe Gen2 (5 Gbps) and Gen3 (8 Gbps), migrate to Stratix IV GX or Stratix 10, as EP1SGX40's maximum 3.1875 Gbps serial rate falls short of those speeds.
Recommended
Broadcast Video Router / Switcher
EP1SGX40GF1020I5N's combination of 20 serial channels and 41,250 logic elements suits uncompressed HD-SDI (1.485 Gbps) and 3G-SDI (2.97 Gbps) routing matrices in broadcast studios. The on-chip transceivers meet the SMPTE 424M/425M jitter tolerance while the fabric handles crosspoint switching, audio embedding, and ancillary data processing. Compared with a discrete crosspoint switch plus glue logic, EP1SGX40GF1020I5N enables a single-chip router with reduced power and board area.
Recommended
High-Speed Test and Measurement Equipment
EP1SGX40GF1020I5N's 20 CDR-based channels and high logic density suit protocol analyzers, BERT (bit-error-rate tester) platforms, and logic-analyzer acquisition cards that must capture multiple gigabit links simultaneously. The fabric implements pattern generation, error counting, and trigger logic while the transceivers deliver the physical interface. Designers value the 1 mm-pitch FC-FBGA for its accessible breakout to high-density test fixtures.
Recommended
Serial RapidIO / Fibre Channel Aggregation
EP1SGX40GF1020I5N's 3.1875 Gbps transceivers handle 1x/4x Serial RapidIO (1.25, 2.5, 3.125 Gbps) and 1G/2G Fibre Channel (1.0625, 2.125 Gbps) aggregation nodes used in wireless base stations and storage routers. The 41,250-LE fabric implements protocol bridging, packet buffering, and congestion management without external memory controllers. Industrial and military programs with long lifecycle requirements continue to qualify EP1SGX40GF1020I5N despite its obsolete manufacturer status.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020I5 | EP1SGX40GF1020C7 | EP1SGX40GF1020C8 | EP1SGX40DF1020I5N | EP1SGX40CF1020I5 | EP1SGX40FF1020I5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) | 1020-ball FC-FBGA (same) |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Transceiver Channels | 20 | 20 | 20 | 20 | 20 (D-variant signal mix) | 0 (no transceivers) | 20 (enhanced FIFO) |
| Max Transceiver Rate (Gbps) | 3.1875 | 3.1875 | 3.1875 | 3.1875 | 3.1875 | N/A (no transceivers) | 3.1875 |
| Speed Grade | -5 | -5 | -7 (slower) | -8 (slowest) | -5 | -5 | -5 |
| Temperature Grade | Industrial (I5) | Industrial | Commercial | Commercial | Industrial | Industrial | Industrial |
| Lead-Free ('N' suffix) | Yes | No | [DATA_NEEDED] | [DATA_NEEDED] | Yes | No | No |
Key Differentiators
- Highest-density Stratix GX variant with full 20-channel transceiver complement (vs EP1SGX40CF1020I5)
- Industrial temperature grade with lead-free termination (vs EP1SGX40GF1020I5)
- Faster speed grade than -7 and -8 silicon (vs EP1SGX40GF1020C7)
Design Notes
Estimated: Stratix GX EP1SGX40 with 20 active 3.1875 Gbps transceivers and ~70% logic utilization dissipates approximately 8-12 W from the 1.5 V core rail alone. Provide at least 6 low-impedance 0.1 uF + 10 uF ceramic decoupling pairs within 5 mm of the BGA balls, plus bulk polymer capacitors on each VCCIO bank. Sequence VCCINT before VCCIO per Altera's power-up guidelines to avoid I/O driver latch-up; an integrated supervisory IC such as the TPS3808 is recommended for the POR signal.
Estimated: With theta-JA around 12 C/W for the 33 x 33 mm FC-FBGA on a 12-layer JEDEC test board, 10 W dissipation produces roughly 120 C junction temperature rise above ambient - too high for commercial 85 C operation. Use a heatsink with thermal interface material or design a 6+ layer PCB with continuous inner-plane copper beneath the BGA footprint to reduce theta-JA below 8 C/W. Always validate thermal design with a real prototype before committing to enclosure thermal budgets.
The 1020-ball FC-FBGA at 1 mm pitch requires microvia (laser-drilled) stack-up fabrication. Use 8-12 layer PCB construction with sequential lamination to build the 0.1 mm via-on-pad structures. Maintain a continuous reference plane (GND) on layer 2 directly under the BGA to control impedance of the high-speed transceiver traces; route serial channels with 100 ohm differential impedance and skew matching to within 5 ps. Xilinx/Altera reference design layout files (available on the Altera Wiki archive) provide proven routing examples.
Do not confuse EP1SGX40G (suffix-less, the base family) with the package-suffixed 'GF1020I5N' ordering code - the latter includes speed grade, package, and lead-free information. Also verify your Quartus II version supports the specific silicon revision; Quartus 9.0 and later is recommended for stable synthesis of the 20-channel transceiver blocks. Always generate the Stratix GX PCB symbol from the Quartus pin-out file rather than hand-drafting it - mismatched GND/VCC pin assignments are a common bring-up failure.
Compliance Information
Lead-free indicated by 'N' suffix in MPN; full RoHS/REACH documentation not present in verified web data - [DATA_NEEDED].
