EP1SGX40GF1020I6N - Stratix GX FPGA, 41,250 LEs, 3.4Mbits | Intel
MPN: EP1SGX40GF1020I6N β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1690 | $16,900.00 |
| 100 | $1485 | $148,500.00 |
| 500 | $1320 | $660,000.00 |
| 1,000 | $1195 | $1,195,000.00 |
Drop-in alternatives for EP1SGX40GF1020I6N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
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View Datasheet βEP1SGX40GF1020I6N Maximum Ratings & Electrical Characteristics
| Series | Stratix GX |
| Logic Elements | 41,250 |
| Logic Array Blocks (LABs) | 4,125 |
| Embedded Memory | 3,423,744 bits |
| User I/O Pins | 624 |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V (1.425 V to 1.575 V) |
| Maximum Transceiver Data Rate | 3.1875 Gbps |
| Transceiver Channels | 20 full-duplex |
| Maximum Internal Frequency | 500 MHz |
| Hardware Multipliers | 176 (9-bit) |
| Package | 1020-ball FC-FBGA, 33 x 33 mm, 1 mm pitch |
| Operating Temperature | 0 C to 85 C (industrial) |
| Speed Grade | I6 (industrial, -6) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP1SGX40GF1020I6N Pin Configuration
| Pin 1 | GXB_RX_CH0p β Transceiver channel 0 receive positive |
| Pin 2 | GXB_RX_CH0n β Transceiver channel 0 receive negative |
| Pin 3 | GXB_TX_CH0p β Transceiver channel 0 transmit positive |
| Pin 4 | GXB_TX_CH0n β Transceiver channel 0 transmit negative |
| Pin 5 | VCC β Core 1.5 V supply |
| Pin 6 | GND β Ground |
| Pin 7 | IO_A1 β User I/O bank A pin 1 |
| Pin 8 | IO_A2 β User I/O bank A pin 2 |
| Pin 9 | IO_A3 β User I/O bank A pin 3 |
| Pin 10 | IO_A4 β User I/O bank A pin 4 |
| Pin 11 | VCCIO_A β I/O bank A reference supply |
| Pin 12 | IO_A5 β User I/O bank A pin 5 |
| Pin 13 | IO_A6 β User I/O bank A pin 6 |
| Pin 14 | IO_A7 β User I/O bank A pin 7 |
| Pin 15 | IO_A8 β User I/O bank A pin 8 |
| Pin 16 | VCC β Core 1.5 V supply |
| Pin 17 | GND β Ground |
| Pin 18 | IO_B1 β User I/O bank B pin 1 |
| Pin 19 | IO_B2 β User I/O bank B pin 2 |
| Pin 20 | IO_B3 β User I/O bank B pin 3 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1SGX40GF1020I6N is suitable for 7 applications: 10 Gbps Telecom Line Card, SONET/SDH Framer/Mapper, Serial RapidIO Backplane Bridge, PCIe x4/x8 Endpoint Bridge, Software Defined Radio Baseband, High-Resolution Video Capture/Processing, Industrial Test and Measurement Backplane.
10 Gbps Telecom Line Card
The EP1SGX40GF1020I6N's 20 transceivers at 3.1875 Gbps aggregate roughly 60 Gbps of serial bandwidth, sufficient to terminate 10x OC-48/STM-16 links or a single 10 Gbps OTU2 framer. The 41,250 logic elements and 176 hardware multipliers handle ingress packet classification, CRC, and Framer/Mapper datapaths without off-chip DSP. Industrial 0-85 C operation supports central-office equipment intake vent temperatures. Reference: Altera AN-315 transceiver channel-layout guide.
Recommended
SONET/SDH Framer/Mapper
Stratix GX devices have a long history in SONET/SDH OC-48 framer designs, and the EP1SGX40GF1020I6N supports up to 3.1875 Gbps per channel, allowing direct mapping into OC-48/STM-16 payloads. The 3.4 Mbit embedded memory holds section/line/path overhead and pointer-adjustment FIFOs, while 624 user I/O pins connect directly to a companion TSI framer or backplane SERDES. Industrial temperature grade qualifies the part for central-office deployments.
Recommended
Serial RapidIO Backplane Bridge
Serial RapidIO (SRIO) endpoints at 1.25/2.5/3.125 Gbps map directly onto the EP1SGX40GF1020I6N's transceiver channels, while the 41,250-logic-element fabric implements the logical/transport/error-management layers. The 176 multipliers accelerate DMA CRC and doorbell processing. Industrial temperature and 1.5 V core supply meet ATCA/VPX backplane power and airflow envelopes. Reference designs from Altera show SRIO Gen1 endpoint in roughly 12,000 LEs.
Recommended
PCIe x4/x8 Endpoint Bridge
The EP1SGX40GF1020I6N supports PCIe Gen1 endpoints with up to x8 lanes at 2.5 Gbps through its embedded transceivers, implementing PIPE 2.0 and Gen1 PCS in soft logic. Combined with the 624 user I/O pins, designers can expose custom application register spaces or DMA engines to a host CPU. Industrial temperature grade covers telecom and industrial-PCIe backplanes. Designers should reserve a dedicated clock-pin region for the 100 MHz PCIe reference clock input.
Recommended
Software Defined Radio Baseband
The 176 hardware 9-bit multipliers and 3.4 Mbit memory make the EP1SGX40GF1020I6N a strong fit for SDR baseband DSP - digital up/down conversion, FIR filtering, FFT, and channel coding. The 20 transceivers up to 3.1875 Gbps aggregate CPRI/OBSAI links to a remote radio head at 1.228-2.457 Gbps per channel. Industrial temperature grade supports outdoor-mounted radio units. Stratix GX DSP blocks run up to 285 MHz per Altera's published performance figures.
Recommended
High-Resolution Video Capture/Processing
The 3.1875 Gbps transceivers accept SMPTE 3G-SDI or HD-SDI serialized video streams while the logic fabric runs de-interlacing, scaling, and color-space conversion. The 3.4 Mbit embedded memory buffers multi-frame FIFOs, and the 624 user I/O pins route parallel video and DDR2 memory buses. Industrial temperature grade supports broadcast equipment ambient. Designers should use dedicated PLL outputs for video clock recovery and pixel-clock synthesis.
Recommended
Industrial Test and Measurement Backplane
The EP1SGX40GF1020I6N is widely used in industrial ATE and bench-top instrumentation backplanes where multiple high-speed serial channels aggregate data from sampling ADCs and DACs. The 41,250 logic elements implement DSP front-end, real-time triggering, and PCIe Gen1 host links, while 624 user I/O pins accept LVDS/LVCMOS parallel buses from front-end ASICs. Industrial 0-85 C operation and 1.5 V core supply simplify chassis thermal and power design.
Recommended
Recommended Products Summary
Engineering reference data for EP1SGX40GF1020I6N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1SGX40GF1020I6 | EP1SGX40GF1020I5N | EP1SGX40GF1020C6N | EP1SGX40GF1020C7N | EP1SGX40GF1020C8 |
|---|---|---|---|---|---|---|
| Package | 1020-ball FC-FBGA | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same | 1020-ball FC-FBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 | 41,250 |
| Temperature Grade | Industrial 0 to 85 C | Industrial 0 to 85 C | Industrial 0 to 85 C | Commercial 0 to 70 C | Commercial 0 to 70 C | Commercial 0 to 70 C |
| Speed Grade | I6 | I6 (same) | I5 (faster) | C6 (commercial I6) | C7 (slower) | C8 (slowest) |
| Embedded Memory | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits | 3,423,744 bits |
| User I/O Pins | 624 | 624 | 624 | 624 | 624 | 624 |
| Transceiver Data Rate | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Industrial 0-85 C operation vs commercial-only drop-ins (vs EP1SGX40GF1020C6N)
- Speed grade I6 vs faster I5 (vs EP1SGX40GF1020I5N)
- Full 20-channel 3.1875 Gbps transceiver block (vs EP1SGX40DF1020C6)
Design Notes
The 1020-ball FC-FBGA on a 1 mm pitch requires 4-6 layer PCB stack-up with sub-50 micron laser-drilled vias for fan-out escape routing. Per Altera AN-315, dedicate the inner-2 power/ground plane pair to the 1.5 V core and use via-in-pad with filled/capped vias on the BGA pads. Transceiver differential pairs must be length-matched to within 0.127 mm (5 mil) intra-pair and 5.08 mm (200 mil) channel-to-channel to keep skew within PCS budgets.
Stratix GX EP1SGX40 parts can draw 6-10 A from the 1.5 V core rail during full transceiver + DSP utilization. Use a low-dropout regulator with 20-30 percent headroom (e.g., 12 A part at 8 A typical) and place 4-6 bulk ceramic capacitors (47 uF X5R) within 25 mm of the package. Add high-frequency 0.1 uF + 1 nF X7R decoupling pairs at every VCC pin group to suppress 50-200 MHz logic-edge noise.
Estimated: with theta_JA of approximately 8 C/W for the 33 mm FC-FBGA at 1 m/s airflow, a 8 W dissipation produces a 64 C junction temperature rise above ambient - acceptable for industrial 85 C operation. Without airflow, dissipation must be limited to roughly 4 W (50 C rise) to stay within the 85 C industrial envelope. Mounting the package on a JEDEC-standard 8-layer test board is assumed; actual theta_JA in your stack-up should be measured.
Do not assume the EP1SGX40GF1020I6N can be swapped for the EP1SGX40GF1020C6N without re-characterizing for industrial-grade thermal envelope. Although pin-compatible, the I6 speed grade has different AC timing margins than the C6 commercial bin. Also note that Quartus II fitter version 9.0+ is required for the Stratix GX family; legacy Quartus II 7.x or Quartus Prime Lite do not support this device family at all.
Compliance Information
RoHS compliance per Stratix GX family datasheet. Halogen-free status not explicitly stated in available data. Not AEC-Q100 qualified - this is a telecom/industrial FPGA, not an automotive-grade part. Last-time-buy status per 2026 lifecycle announcement.