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Samsung Electro-Mechanics

K6X0808C1D-GF55T00 - 32Kx8 SRAM 55ns 28-SOP | Samsung

N.º de pieza: K6X0808C1D-GF55T00 ✓ Activo
En stock Se envía en 1-3 días hábiles
28-SOP (450 mil) Package N/A (asynchronous) Speed SRAM - Asynchronous Memory
Desde $1.05 USD / unidad
MOQ: 1 |
Precio actualizado: 2026-09-01
Precios por volumen
Cant. Precio unitario Total
1 $1.85 $1,85
10 $1.66 $16,60
100 $1.42 $142,00
500 $1.21 $605,00
1.000 $1.05 $1.050,00
ℹ️ Todos los precios están en USD

K6X0808C1D-GF55T00 Descripción general

The Samsung Semiconductor K6X0808C1D-GF55T00 is a 256Kbit asynchronous static RAM (SRAM) memory IC organized as 32K x 8 bits, with a 55ns access time, fabricated in Samsung's low-power CMOS process and housed in a 28-pin SOP (450 mil) surface-mount package. The T00 suffix denotes the tape-and-reel packaging variant for automated assembly.

Asynchronous SRAM is a class of random-access memory that retains data as long as power is applied, without requiring refresh clocks or address strobes. Unlike DRAM, SRAM cells are built from CMOS latches, giving the K6X0808C1D family fast, deterministic access times and a simple parallel interface of address inputs (A0-A14), eight bidirectional data lines (I/O0-I/O7), and three control pins: chip enable (CE), output enable (OE), and write enable (WE). Within the memory hierarchy it sits between register files and dense DRAM, and within power management considerations it belongs to the low-power standby class of memories.

Key features include the 55ns address access time (the GF speed grade), a wide operating voltage class supporting low data retention voltage for battery-backed applications, and CMOS technology delivering very low standby power. The device supports various operating temperature ranges and package options across the family, giving designers flexibility in industrial and consumer system design, according to the Samsung K6X0808C1D-GF55 datasheet.

Architecturally, the device decodes 15 address lines into a 32768-word memory array of 8-bit wide CMOS cells. Fully static operation means no clock, no refresh, and no timing chains, which simplifies glueless interfacing to 8-bit microcontrollers, MCUs with external memory buses, and FPGA emulated buses. Three-state outputs with OE control allow direct bus connection with other memories or peripherals.

Typical applications include battery-backed data storage in industrial control systems, code and data expansion for embedded 8/16-bit MCUs, set-top box and consumer electronics buffers, telecom line cards, and automotive electronics modules requiring non-volatile-like retention with a small backup cell.

Design consideration: for battery backup designs, drive CE high in standby to enter data retention mode; verify the retention voltage and standby current from the manufacturer datasheet for your exact temperature range.

This page synthesizes distributor availability data, same-family drop-in speed and temperature-grade alternatives, and practical design notes not found in the manufacturer datasheet.

Alternativas directas para K6X0808C1D-GF55T00 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.

Variantes de esta serie

Modelos de la misma serie compatibles directamente con K6X0808C1D-GF55T00 (mismo factor de forma y huella) — difiere en Technology, Data Bus Width, Access Time, Memory Type, Package.

Samsung Electronics
Memory Type: Asynchronous SRAM
Package: 28-SOP
Comparar con K6X0808C1D-GF55T00 →
Samsung Electronics
Data Bus Width: 8 bit (I/O0-I/O7)
Access Time: 70 ns
Package: 28-SOP
Comparar con K6X0808C1D-GF55T00 →
Samsung Electronics
Technology: Low-power CMOS
Package: 28-SOP
Comparar con K6X0808C1D-GF55T00 →
Samsung Electro-Mechanics
Data Bus Width: 8 bit
Comparar con K6X0808C1D-GF55T00 →
Samsung Electronics
Technology: Low Power CMOS
Data Bus Width: 8 bit (tri-state I/O)
Access Time: 70 ns
Comparar con K6X0808C1D-GF55T00 →
Samsung Electro-Mechanics
Access Time: 70 ns
Package: 28-SOP
Comparar con K6X0808C1D-GF55T00 →

Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:

K6X0808C1D-GF55000

✅ Sustitución directa
Samsung Electronics
📦 28-SOP
SRAM - Asynchronous · 256 Kbit · 32K x 8 · 55 ns · Parallel · 5 V · Surface Mount · 28-SOP

✓ En stock

$3.2 / unidad

Ver hoja de datos →

K6X0808C1D-GF70000

✅ Sustitución directa
Samsung Electronics
📦 28-SOP
SRAM - Asynchronous · 256 Kbit · 32K x 8 bit · Parallel · 70 ns · 4.5 V · 5.5 V · Low Power CMOS

✓ En stock

$1.1 / unidad

Ver hoja de datos →

K6X0808C1D-BF55

✅ Sustitución directa
Samsung Electronics
📦 28-SOP
Asynchronous SRAM · 256 Kbit · 32K x 8 · 55 ns · Parallel · 5 V · CMOS · 28-SOP

✓ En stock

$1.85 / unidad

Ver hoja de datos →

K6X0808C1D-BF70T

✅ Sustitución directa
Samsung Electronics
📦 28-SOP
SRAM - Asynchronous · 256 Kbit · 32K x 8 · Parallel · 70 ns · 70 ns · 4.5 V to 5.5 V · -40C to +85C (TA)

✓ En stock

$1.05 / unidad

Ver hoja de datos →

K6X0808C1D-GF55T00 Valores máximos y características eléctricas

Tipo de memoria SRAM - Asynchronous
Tamaño de memoria 256 Kbit
Organización de memoria 32K x 8
Access Time 55 ns
Interfaz Parallel
Clock Frequency N/A (asynchronous)
Technology CMOS
Data Retention Low data retention voltage supported
Encapsulado 28-SOP (450 mil)
Tipo de montaje Surface Mount
Packaging Variant Tape & Reel (T00 suffix)

Configuración de pines de K6X0808C1D-GF55T00

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 A14 — Address input bit 14
Pin 2 A12 — Address input bit 12
Pin 3 A7 — Address input bit 7
Pin 4 A6 — Address input bit 6
Pin 5 A5 — Address input bit 5
Pin 6 A4 — Address input bit 4
Pin 7 A3 — Address input bit 3
Pin 8 A2 — Address input bit 2
Pin 9 A1 — Address input bit 1
Pin 10 A0 — Address input bit 0
Pin 11 I/O0 — Data input/output bit 0
Pin 12 I/O1 — Data input/output bit 1
Pin 13 I/O2 — Data input/output bit 2
Pin 14 GND — Ground
Pin 15 I/O3 — Data input/output bit 3
Pin 16 I/O4 — Data input/output bit 4
Pin 17 I/O5 — Data input/output bit 5
Pin 18 I/O6 — Data input/output bit 6
Pin 19 I/O7 — Data input/output bit 7
Pin 20 CE — Chip enable (active low)
Pin 21 A10 — Address input bit 10
Pin 22 OE — Output enable (active low)
Pin 23 A11 — Address input bit 11
Pin 24 A9 — Address input bit 9
Pin 25 A8 — Address input bit 8
Pin 26 A13 — Address input bit 13
Pin 27 WE — Write enable (active low)
Pin 28 VCC — Power supply

Aplicaciones típicas

K6X0808C1D-GF55T00 es adecuado para 6 aplicacións: Battery-Backed Industrial Data Storage, External Memory Expansion for 8/16-bit MCUs, Telecom and Networking Line Cards, Consumer Electronics and Set-Top Boxes, Automotive Electronics Modules, FPGA and CPLD Emulated Memory Buses.

🏭

Battery-Backed Industrial Data Storage

In industrial controllers, metering equipment, and PLC I/O modules, the K6X0808C1D-GF55T00 stores configuration parameters, event logs, and calibration constants that must survive power loss. Its low-power CMOS design and support for low data retention voltage allow the memory to hold contents for months on a small lithium backup cell when CE is held deselected. The 55ns access time comfortably meets typical 8-bit MCU external bus timing, while the 32K x 8 organization maps directly to a single 15-bit address window. Because it is fully asynchronous and requires no refresh, the retention path is a simple diode-or supply circuit - no battery-management controller is needed.

🧩

External Memory Expansion for 8/16-bit MCUs

Legacy and cost-sensitive microcontroller systems (8051 derivatives, H8, and similar external-bus MCUs) often lack on-chip RAM for buffers and variables. The K6X0808C1D-GF55T00 provides a glueless 32K x 8 expansion bank: 15 address lines connect to the MCU bus, I/O0-I/O7 to the data bus, and CE/OE/WE to RD/WR strobes - no external glue logic is required. The 55ns access time supports fast bus cycles that slower 70ns or 120ns SRAMs cannot meet, reducing wait states. Three-state outputs let the same bus serve flash, EEPROM, and peripherals, and the 28-SOP surface-mount package fits dense two-layer boards.

🌐

Telecom and Networking Line Cards

Telecom line cards, protocol converters, and legacy network interface modules use fast asynchronous SRAM as frame buffers, lookup tables, and statistics counters. The K6X0808C1D-GF55T00's deterministic 55ns access - with no refresh latency - guarantees worst-case read/write timing that DRAM cannot offer, which matters for firmware that services time-slotted protocol tasks. The 32K x 8 array accommodates typical MAC address tables or HDLC buffer rings, and CMOS standby current keeps rack-level power budgets low across many populated card slots. Tape-and-reel T00 delivery suits the automated assembly of production card volumes.

📺

Consumer Electronics and Set-Top Boxes

Set-top boxes, DVD players, feature phones, and gaming peripherals of the classic embedded era used 32Kx8 SRAM parts like the K6X0808C1D-GF55T00 for OSD buffers, channel tables, and user settings. The device's simple asynchronous interface keeps the bill-of-materials minimal, and its wide temperature-range family options let one PCB design serve both indoor consumer and semi-outdoor variants. The 55ns speed grade supports memory-mapped graphics dot fetch loops without wait states. Because the SOP-28 footprint is shared across the whole K6X0808C1D family, cost-down moves from 55ns to 70ns grades require no layout changes.

🚗

Automotive Electronics Modules

Body control modules, instrument clusters, and audio head units in classic automotive platforms used K6X0808C1D-family SRAM for volatile working memory and fault-code storage between ignition cycles. Selecting the correct B or G temperature grade from the family ensures operation over the required under-hood or cabin ambient range, per Samsung's family datasheet that highlights various operating temperature ranges for design flexibility. The 55ns access time supports gauge-stepping lookups and CAN message buffers on 8/16-bit MCUs, while CMOS low standby current reduces key-off battery drain when combined with a keep-alive supply feed.

🖥️

FPGA and CPLD Emulated Memory Buses

When replacing obsolete SRAM in FPGA-based retrofits, the K6X0808C1D-GF55T00 attaches directly to an FPGA bank emulating the legacy asynchronous bus. Its 55ns access time defines the worst-case FPGA read latency budget: a design meeting 55ns address-to-data timing can replicate the original board's behavior cycle-accurately. Because the device is asynchronous, no clock-domain crossing is needed - the FPGA simply drives address and control with registered outputs. The 28-SOP package hand-solders easily onto adapter boards, and low standby current suits always-on FPGA platforms where the SRAM persists configuration data.

What is the K6X0808C1D-GF55T00?
The K6X0808C1D-GF55T00 is a 256Kbit asynchronous SRAM memory IC from Samsung Semiconductor, organized as 32K x 8 bits with a 55ns access time in a 28-pin SOP package. According to the Samsung K6X0808C1D-GF55 datasheet, the family is fabricated in advanced low-power CMOS process technology and supports low data retention voltage for battery-backed designs. The T00 suffix indicates tape-and-reel packaging for automated pick-and-place assembly.
What is the access time of K6X0808C1D-GF55T00?
The access time is 55ns, indicated by the GF55 speed grade in the part number. This means data becomes valid on the output pins within 55ns of a valid address or control signal transition. According to Samsung's K6X0808C1D datasheet, the same family is also offered in slower grades such as 70ns (BF70/GF70), so the GF55 device suits systems with tighter timing margins on a parallel memory bus.
What is the memory organization of the K6X0808C1D-GF55T00?
The K6X0808C1D-GF55T00 is organized as 32K words x 8 bits, giving a total density of 256Kbit (262,144 bits). It uses 15 address lines (A0 through A14), eight bidirectional I/O lines (I/O0 through I/O7), and three asynchronous control pins: CE (chip enable), OE (output enable), and WE (write enable). This 8-bit wide organization makes it a natural external memory upgrade for 8-bit microcontroller systems.
What package does the K6X0808C1D-GF55T00 come in?
The K6X0808C1D-GF55T00 comes in a 28-pin SOP (small outline package) with a 450 mil body width, in tape-and-reel packaging denoted by the T00 suffix. According to the Samsung datasheet, the K6X0808C1D family is also offered in a 28-pin DIP 600 mil (28-DIP-600B) package, so the SOP version targets automated surface-mount assembly while the DIP version serves socketed or through-hole designs.
Where can I buy K6X0808C1D-GF55T00?
The K6X0808C1D-GF55T00 is available from distributors including DigiKey and DigiKey Marketplace, plus secondary sourcing channels such as Ampheo, Amcore, Xecor, Avaq, and IC-MAX. According to DigiKey's listing, the part ships today from stock under DigiKey part number 5736-K6X0808C1D-GF55T00TR-ND. Pricing varies by distributor and quantity; XAIPART pricing on this page is updated as of 2026-09-01.
What is the price of K6X0808C1D-GF55T00?
XAIPART lists K6X0808C1D-GF55T00 pricing starting at approximately $1.85 at quantity 1 as of 2026-09-01, decreasing to around $1.05 at quantity 1000. Note that this legacy Samsung SRAM is frequently sourced through the open market, so distributor pricing fluctuates with stock availability; always confirm real-time pricing on the XAIPART product page or at DigiKey before placing volume orders.
What is the best drop-in replacement for K6X0808C1D-GF55T00?
The closest drop-in replacements are same-family Samsung parts in the identical 28-SOP package with the same 32Kx8 organization: K6X0808C1D-GF55000 (identical speed, tray packaging), K6X0808C1D-GF70000 (70ns, slower grade), and K6X0808C1D-BF55 (different temperature range grade). Because they share the same die family and pinout, no PCB or firmware changes are needed; only the timing budget and temperature qualification differ between grades.
What is the difference between K6X0808C1D-GF55 and K6X0808C1D-GF70?
The only meaningful difference is speed: GF55 offers a 55ns access time while GF70 offers 70ns, both with the same 32Kx8 organization, CMOS process, and 28-SOP/28-DIP package options. According to Samsung's K6X0808C1D datasheet, they are pin-to-pin compatible. A design with a 55ns timing budget must keep GF55; a design with 70ns or slower bus timing can use either, often at lower cost for the GF70.
What is the difference between the B and G temperature grades in K6X0808C1D?
In the K6X0808C1D part numbering, the letter before the speed code designates the operating temperature range variant (B grade versus G grade). According to Samsung's family datasheet, the family supports various operating temperature ranges for user flexibility. The exact ranges for each grade should be confirmed in the Samsung datasheet; K6X0808C1D-BF55 and K6X0808C1D-GF55T00 are pin-compatible but qualified for different temperature windows.
Is K6X0808C1D-GF55T00 the same as K6X0808C1D-GF55000?
Electrically, yes - both are 32Kx8, 55ns asynchronous SRAMs from the same Samsung family. The difference is packaging: the T00 suffix denotes tape-and-reel delivery for automated assembly, while the non-suffixed GF55000 is typically supplied in tray or tube form. Both share the same 28-SOP footprint and pinout, so they are functionally and physically interchangeable on the same PCB - choose based on your assembly method.
When should I choose K6X0808C1D-GF55T00 over a 70ns grade?
Choose the GF55 55ns grade when your memory bus timing leaves less than 70ns for address access plus data setup - common in faster 8/16-bit MCU designs running near maximum external bus speed. Choose the 70ns grade (K6X0808C1D-GF70000 or BF70T) when bus timing is relaxed, as slower grades are often cheaper and draw lower operating current. Both share the identical 28-SOP package and pinout, so the choice is purely a timing and cost trade-off.
Is there a cross-brand equivalent for the K6X0808C1D-GF55T00?
Functionally similar 32Kx8 asynchronous SRAMs exist from other vendors (for example Alliance Memory and ISSI 256Kbit SRAM families), but pin-compatible, same-package cross-brand drop-ins must be verified against the Samsung 28-SOP pinout and speed before substitution. The cross-reference data retrieved for this part did not return a verified cross-brand pin-compatible part, so XAIPART recommends same-family Samsung grades listed in the alternatives table for guaranteed drop-in replacement.
Where can I download the K6X0808C1D-GF55T00 datasheet PDF?
The K6X0808C1D-GF55 datasheet PDF (9 pages, covering the 32Kx8 Low Power CMOS Static RAM family) is available from datasheet archives such as datasheet.iiic.cc and AllDataSheet, and is linked from this page. According to the datasheet, it covers general description, pin configurations for the 28-DIP-600B and 28-SOP-450 packages, absolute maximum ratings, DC/AC characteristics, and timing diagrams for the full K6X0808C1D family.
Where can I find the K6X0808C1D-GF55T00 pinout?
The K6X0808C1D-GF55T00 uses the industry-standard 28-pin asynchronous SRAM pinout: pins 1-10 carry A14, A12, A7, A6, A5, A4, A3, A2, A1, A0; pins 11-13 are I/O0-I/O2; pin 14 is GND; pins 15-18 are I/O3-I/O6; pin 19 is I/O7; pin 20 is CE; pin 21 is A10; pin 22 is OE; pins 23-25 are A11, A9, A8; pin 26 is A13; pin 27 is WE; and pin 28 is VCC. Verify against the official Samsung datasheet pin diagram before layout.
What are the key specifications of K6X0808C1D-GF55T00 that engineers should know?
Engineers should know: 256Kbit asynchronous SRAM, 32K x 8 organization, 55ns access time (GF55 grade), low-power CMOS technology, 15 address lines, 8 bidirectional I/O lines with three-state outputs, CE/OE/WE asynchronous control, low data retention voltage support for battery backup, and a 28-pin SOP 450-mil package supplied in tape-and-reel. According to the Samsung datasheet, the family spans multiple temperature ranges and package options for design flexibility.
Is K6X0808C1D-GF55T00 suitable for battery-backed data storage?
Yes. The K6X0808C1D family is explicitly described by Samsung as supporting low data retention voltage, meaning the SRAM keeps its contents at a reduced supply voltage when the main power is removed and a backup battery or supercapacitor takes over. For proper retention, hold CE at VCC (deselected) during backup mode, verify the datasheet retention voltage and standby current for your temperature range, and size the backup cell against the standby current draw and required retention duration.
Is the K6X0808C1D-GF55T00 still in production and available?
The part is listed as orderable and shipping from distributor stock; DigiKey and DigiKey Marketplace show buy-now, ships-today availability as of 2026-09-01. However, this is a legacy 256Kbit SRAM first introduced years ago, and Samsung's roadmaps for mature commodity SRAM can change. For new designs requiring long-term supply, qualify a second source or same-family grade early; for maintenance of existing designs, current distributor stock remains readily available.

Datos de referencia de ingeniería para K6X0808C1D-GF55T00 — comparación, orientación de diseño e información de cumplimiento.

Guía de selección

Choose the K6X0808C1D-GF55T00 when your 8/16-bit memory bus needs a 55ns address-to-data window and you want tape-and-reel feeding for production assembly. If your bus timing is 70ns or slower, step down to K6X0808C1D-GF70000 or BF70T for lower cost with the same 28-SOP footprint and pinout - no layout change is needed. For hand-built prototypes or tray-based kitting, K6X0808C1D-GF55000 is electrically identical to this T00 reel variant. If your qualification spans a different ambient window, K6X0808C1D-BF55 offers the same 55ns speed in the B temperature grade. All listed alternatives are pin-to-pin drop-ins sharing the 32Kx8 organization; the only differences are access time, temperature grade, and delivery format. Before finalizing, confirm supply continuity for this legacy part and qualify a same-family second grade as risk mitigation.

Comparación con alternativas

Parámetro Este producto K6X0808C1D-GF55000 K6X0808C1D-GF70000 K6X0808C1D-BF55 K6X0808C1D-BF70T
Package 28-SOP (450 mil) 28-SOP (450 mil) - same 28-SOP (450 mil) - same 28-SOP (450 mil) - same 28-SOP (450 mil) - same
Brand Samsung Samsung Samsung Samsung Samsung
Memory Organization 32K x 8 (256 Kbit) 32K x 8 (256 Kbit) 32K x 8 (256 Kbit) 32K x 8 (256 Kbit) 32K x 8 (256 Kbit)
Access Time 55 ns 55 ns 70 ns 55 ns 70 ns
Temperature Grade G grade G grade G grade B grade B grade
Data Retention Support Yes (low retention voltage) Yes (same die) Yes (same family) Yes (same family) Yes (same family)
Technology Low-power CMOS Low-power CMOS Low-power CMOS Low-power CMOS Low-power CMOS

Diferenciadores clave

  • Fastest standard speed grade in the family (frente a K6X0808C1D-GF70000)
  • Tape-and-reel delivery for automated assembly (frente a K6X0808C1D-GF55000)
  • Low data retention voltage for battery backup (frente a Competing 256Kbit SRAM families)

Notas de diseño

For battery-backed designs, hold CE high (deselected) whenever the main supply is removed - this places the SRAM in its lowest-current data retention state. Use a diode-OR (e.g., Schottky diode plus backup cell) between the main 5V rail and the retention battery, and verify the datasheet retention voltage and standby current figures for the G temperature grade at your worst-case ambient. Estimated retention duration = backup cell capacity (Ah) divided by standby current (A); always derate by 50% for cell aging.

Place a 0.1uF ceramic decoupling capacitor within 3 mm of the VCC pin (pin 28) with a solid via to the ground plane near GND (pin 14). Although asynchronous SRAM generates little switching noise itself, the data bus it drives can; a short ground return path under the SOP-28 keeps I/O ground bounce below the VOH/VOL margins during fast 55ns bus cycles. Avoid routing address lines under the package to reduce coupling into the memory array sense paths.

Never assert CE and WE low simultaneously during power-up or power-down - a write cycle with an unstable VCC can corrupt the addressed cell. Add a power-supply supervisor (such as a reset IC with active-low MR) that gates WE until the bus MCU is out of reset. Also confirm the speed grade in your timing closure: a 70ns alternative is pin-compatible but will fail 55ns bus timing, so lock the GF55 MPN in the BOM if your address-to-data window is under 70ns.

Información de cumplimiento

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Libre de plomo
Unknown
Libre de halógenos
Unknown
Minerales en conflicto
Unknown

Compliance status not stated in the retrieved distributor listings; verify against the Samsung product page or ask the distributor for a material declaration before export-controlled or EU shipments.

Datos verificados el: 2026-09-01 — datos verificados y seleccionados por el equipo de ingeniería de componentes de XAIPART

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Componentes & términos relacionados

Samsung Semiconductor K6X0808C1D-GF55T00 K6X0808C1D-GF55000 K6X0808C1D-GF70000 K6X0808C1D-BF55 K6X0808C1D-BF70T SRAM static random access memory asynchronous SRAM CMOS static RAM 32K x 8 256 Kbit 28-SOP SOP-28 package family surface mount DigiKey low data retention voltage battery backup access time tape and reel industrial control systems consumer electronics memory expansion parallel interface RoHS
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