Samsung Electronics

K6X0808C1D-BF70T - 32Kx8 70ns Async SRAM 5V | Samsung

MPN: K6X0808C1D-BF70T βœ“ Active
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4.5 V to 5.5 V Vdss 28-SOP Package SRAM - Asynchronous Memory
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Price updated: 2026-09-01
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Drop-in alternatives for K6X0808C1D-BF70T β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

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K6X0808C1D-BF55

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Samsung Electronics
πŸ“¦ 28-SOP
Asynchronous SRAM Β· 256 Kbit Β· 32K x 8 Β· 55 ns Β· Parallel Β· 5 V Β· CMOS Β· 28-SOP

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$1.85 / Unit

View Datasheet β†’

K6X0808C1D-GF55000

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Samsung Electronics
πŸ“¦ 28-SOP
SRAM - Asynchronous Β· 256 Kbit Β· 32K x 8 Β· 55 ns Β· Parallel Β· 5 V Β· Surface Mount Β· 28-SOP

βœ“ In Stock

$3.2 / Unit

View Datasheet β†’

K6X0808C1D-BF70

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Samsung Electronics
πŸ“¦ 28-SOP
Asynchronous SRAM (CMOS) Β· 256 Kbit Β· 32K x 8 Β· 70 ns Β· Parallel Β· CMOS Β· 28-SOP (PDSO28) Β· Surface Mount

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$1.85 / Unit

View Datasheet β†’

K6X0808C1D-BF70T Maximum Ratings & Electrical Characteristics

Memory Type SRAM - Asynchronous
Memory Size 256 Kbit
Memory Organization 32K x 8
Memory Interface Parallel
Access Time 70 ns
Write Cycle Time - Word, Page 70 ns
Voltage - Supply 4.5 V to 5.5 V
Operating Temperature -40C to +85C (TA)
Package 28-SOP
Mounting Type Surface Mount
Process Technology CMOS
Address Bus Width 15 bit (A0-A14)
Data Bus Width 8 bit (I/O0-I/O7)
Control Signals CE, OE, WE
I/O Compatibility TTL compatible
Refresh Requirement None (fully static operation)
RoHS Status Compliant

K6X0808C1D-BF70T Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 NC β€” Not connected (per datasheet)
Pin 2 A14 β€” Address input bit 14
Pin 3 A12 β€” Address input bit 12
Pin 4 A7 β€” Address input bit 7
Pin 5 A6 β€” Address input bit 6
Pin 6 A5 β€” Address input bit 5
Pin 7 A4 β€” Address input bit 4
Pin 8 A3 β€” Address input bit 3
Pin 9 A2 β€” Address input bit 2
Pin 10 A1 β€” Address input bit 1
Pin 11 A0 β€” Address input bit 0
Pin 12 I/O0 β€” Data input/output bit 0
Pin 13 I/O1 β€” Data input/output bit 1
Pin 14 I/O2 β€” Data input/output bit 2
Pin 15 VSS β€” Ground
Pin 16 I/O3 β€” Data input/output bit 3
Pin 17 I/O4 β€” Data input/output bit 4
Pin 18 I/O5 β€” Data input/output bit 5
Pin 19 I/O6 β€” Data input/output bit 6
Pin 20 I/O7 β€” Data input/output bit 7
Pin 21 CE β€” Chip enable (active low)
Pin 22 A10 β€” Address input bit 10
Pin 23 OE β€” Output enable (active low)
Pin 24 A11 β€” Address input bit 11
Pin 25 A9 β€” Address input bit 9
Pin 26 A8 β€” Address input bit 8
Pin 27 A13 β€” Address input bit 13
Pin 28 VCC β€” Power supply, 4.5V to 5.5V

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for K6X0808C1D-BF70T Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

K6X0808C1D-BF70T is suitable for 6 applications: Industrial Control Systems, Legacy Embedded Controller Memory Expansion, Battery-Backed Data Logging, Telecom Line Cards, Test and Measurement Equipment, FPGA-Based Legacy System Retargeting.

🏭

Industrial Control Systems

The K6X0808C1D-BF70T fits industrial PLC I/O modules and process controllers that still use 5V parallel buses. Its 4.5V-5.5V supply range tolerates noisy industrial power rails, and the -40C to +85C operating range covers unconditioned cabinet environments. The 70 ns access time is fast enough for zero-wait-state operation with classic 8-bit MCU buses running up to roughly 14 MHz, so no bus wait states are needed. Because the device is fully static CMOS, it draws minimal standby current when CE is deasserted, reducing cabinet heat. Place the SRAM in the memory-map scratchpad region with CE gated from address decoding logic, and decouple VCC locally with 0.1uF ceramic capacitance for noise immunity in electrically harsh plants.

πŸ”§

Legacy Embedded Controller Memory Expansion

The K6X0808C1D-BF70T is a natural external RAM for 8051, 68HC11, H8, and other 8-bit MCU systems whose on-chip RAM is exhausted. Its glueless parallel interface (15 address lines, 8 data lines, CE/OE/WE) connects directly to typical MCU external bus signals without programmable logic. The 70 ns timing meets the external-memory access cycles of most 12-24 MHz 8051 derivatives, which stretch reads over several clocks. The 32K x 8 organization fills exactly half of a 16-bit address space, simplifying decoder design with a single high address line driving CE. TTL-compatible I/O levels and 5V supply match the native I/O of these controllers, and the 28-SOP package suits both new layouts and repair of legacy boards.

🧩

Battery-Backed Data Logging

The K6X0808C1D-BF70T suits battery-backed logging modules because its fully static CMOS core retains data without refresh, and the family datasheet specifies low standby current and data retention at reduced VCC when CE is held high and writes are inhibited. A 32K x 8 array stores tens of thousands of sensor samples or event records at byte granularity, which is awkward to achieve with serial EEPROM. A supervisor circuit holds WE high during power-down so no spurious writes corrupt data, and a lithium cell supplies the retention rail. Designers should verify the retention voltage and standby current figures from the Samsung K6X0808C1D datasheet when sizing the battery for multi-year service life in the field.

🌐

Telecom Line Cards

The K6X0808C1D-BF70T serves 5V telecom line cards for buffers, translation tables, and per-channel status storage in legacy T1/E1 and modem equipment. The wide 4.5V-5.5V supply tolerance absorbs backplane voltage droop, and the industrial -40C to +85C range covers central-office and outdoor plant thermal requirements. Its 70 ns access time keeps pace with line-rate processing loops in classic 8-bit bus architectures, while CMOS standby current limits card power budget consumption when the SRAM is idle. Because data retention requires no refresh, line-card firmware can power-gate or back up the SRAM contents during maintenance windows. The 28-SOP surface-mount package supports high-density card layouts with automated assembly.

πŸ–₯️

Test and Measurement Equipment

Bench instruments such as logic analyzers, pattern generators, and older oscilloscope acquisition modules use parallel SRAM as acquisition scratchpad memory, and the K6X0808C1D-BF70T fills this role in 5V designs. The deterministic 70 ns access time with no refresh latency makes sample-store and readout timing easy to calculate, unlike DRAM which requires refresh scheduling around capture windows. The 32K x 8 depth captures roughly 32K samples per channel at 8-bit resolution, adequate for slow-speed debug capture. CE, OE, and WE control allows hardware capture triggers to gate writes directly. For battery-backed calibration data in the same instrument, retention at reduced VCC lets a coin cell preserve settings, per the Samsung family datasheet retention specifications.

⚑

FPGA-Based Legacy System Retargeting

When redesigning obsolete boards around modern FPGAs, engineers often keep the K6X0808C1D-BF70T as the external scratchpad to preserve verified memory behavior. The FPGA emulates the legacy 8-bit bus and drives the SRAM's CE/OE/WE with margin to the 70 ns cycle time, easily met at typical FPGA I/O timing. Where 5V I/O standards are unavailable, series resistors and level translation protect the 5V SRAM inputs, or a 3.3V SRAM replaces it entirely in new layouts. Because the device is asynchronous and fully static, no memory controller IP with refresh state machines is required, reducing design risk. This makes the K6X0808C1D family a common bridge component in avionics and industrial obsolescence-management programs.

What is the memory organization of the K6X0808C1D-BF70T?
The K6X0808C1D-BF70T is organized as 32K x 8 bits, giving a total density of 256 Kbit (32,768 addressable byte-wide locations). Addressing uses 15 address lines (A0-A14), and data transfer uses 8 bidirectional I/O pins. According to the Samsung K6X0808C1D datasheet, the device is fabricated in low-power CMOS with fully static operation, so no refresh or clocking is required.
What is the access time of K6X0808C1D-BF70T?
The K6X0808C1D-BF70T has a 70 ns access time and a 70 ns write cycle time for both word and page operations. The suffix -70 in the part number denotes the 70 ns speed grade. This timing supports classic 8-bit microprocessor buses operating at up to roughly 14 MHz zero-wait-state read cycles, according to the Samsung K6X0808C1D datasheet timing tables.
What is the supply voltage range of K6X0808C1D-BF70T?
The K6X0808C1D-BF70T operates from a 4.5V to 5.5V supply, making it a native 5V memory IC. It is TTL-compatible on all inputs and I/O pins. Designers should not connect it to a 3.3V bus without level shifting, because input high thresholds assume TTL levels driven from a 5V system per the Samsung K6X0808C1D datasheet.
Where to download the K6X0808C1D-BF70T datasheet PDF?
The K6X0808C1D datasheet PDF is available through distributor listings such as DigiKey and archive sites including AllDataSheet, which hosts the Samsung K6X0808C1D datasheet covering the full family. The datasheet describes general description, absolute maximum ratings, DC and AC characteristics, timing diagrams, and package dimensions for all speed grades and package options of the 32K x 8 low-power CMOS SRAM family.
Where can I find the K6X0808C1D-BF70T pinout?
The K6X0808C1D-BF70T pinout is published in the Samsung K6X0808C1D datasheet for the 28-pin SOP package. The 28 pins comprise 15 address inputs (A0-A14), 8 bidirectional data I/O pins (I/O0-I/O7), three control pins (CE, OE, WE), VCC, VSS, and a no-connect pin. Verify each pin against the package drawing in the datasheet before layout, since 28-pin SRAM pin assignments follow the industry-standard 32K x 8 JEDEC-style arrangement.
What is the price of K6X0808C1D-BF70T?
The K6X0808C1D-BF70T typically trades in the 1 to 2 USD range for single-unit quantities, with volume breaks reducing the unit price below 1.10 USD at 1000 pieces as of 2026-09-01. Because this part is a mature legacy SRAM, stock is distributed across broker and marketplace channels such as DigiKey Marketplace and Ampheo, and pricing varies with stock position, so request a quote for exact current pricing.
Is K6X0808C1D-BF70T in stock?
Availability of the K6X0808C1D-BF70T changes frequently because it is a legacy 256Kbit SRAM. As of 2026-09-01, distributor marketplace channels (DigiKey Marketplace, Ampheo, SZComponents, Abrmicro) list stock or quote-based availability for this part, and XAIPART confirms inventory on request. For production volumes, verify quantity on hand and lead time before committing, since marketplace stock positions for legacy SRAM can be small-lot.
What is the difference between K6X0808C1D-BF70T and K6X0808C1D-BF55?
The primary difference is speed grade: the K6X0808C1D-BF55 has a 55 ns access time while the K6X0808C1D-BF70T is 70 ns. Both share the same 32K x 8 organization, 4.5V-5.5V supply, -40C to +85C range, and 28-SOP package, so the BF55 can replace the BF70T in the same footprint. The BF70T variant offers slightly better power and cost at lower speeds per the Samsung family datasheet.
Can I use K6X0808C1D-BF55 as a drop-in replacement for K6X0808C1D-BF70T?
Yes. The K6X0808C1D-BF55 is pin-to-pin compatible with the K6X0808C1D-BF70T in the same 28-SOP package and is actually faster (55 ns vs 70 ns access time). A faster SRAM can always substitute a slower one in the same system. According to the Samsung K6X0808C1D family datasheet, both variants belong to the identical low-power CMOS 32K x 8 family with the same control interface (CE, OE, WE).
What is the best drop-in replacement for K6X0808C1D-BF70T?
The best drop-in replacements are same-family Samsung parts: K6X0808C1D-BF55 (faster 55 ns grade) and K6X0808C1D-GF55000 (55 ns grade in the same 28-SOP footprint). All three share identical organization (32K x 8), supply range (4.5V-5.5V), and pinout. True cross-brand 32K x 8 28-pin SOP equivalents (for example ISSI or Alliance 32K x 8 SRAMs) exist, but pin compatibility must be verified against the Samsung datasheet drawing before substitution.
Is K6X0808C1D-BF70T suitable for battery-backed data storage?
Yes, the K6X0808C1D-BF70T is well suited to battery-backed designs because it is a fully static CMOS SRAM with data-retention capability at reduced VCC and no refresh requirement. For battery backup, hold CE high and keep VCC within the datasheet retention voltage while suppressing writes. The CMOS process gives very low standby current, so a lithium coin cell can preserve 32K x 8 data for years, per the Samsung family datasheet retention characteristics.
Is K6X0808C1D-BF70T the same as a 3.3V SRAM?
No. The K6X0808C1D-BF70T is a 5V SRAM with a specified 4.5V to 5.5V supply range and TTL-level I/O; it is not rated for a 3.3V supply and may not meet datasheet timing at lower voltages. For 3.3V systems, choose a low-voltage SRAM family member or an equivalent low-voltage 32K x 8 device instead. Interfacing 3.3V logic to this part requires level shifting on the bus per the Samsung datasheet electrical characteristics.
Hey Google, what can replace K6X0808C1D-BF70T?
The closest replacements for the K6X0808C1D-BF70T are Samsung family variants K6X0808C1D-BF55 and K6X0808C1D-GF55000, both 32K x 8 CMOS SRAMs in the same 28-SOP package. The BF55 is faster (55 ns) and pin-compatible. For cross-brand options, 32K x 8 parallel SRAMs from ISSI or Alliance in 28-pin packages can serve, but confirm pinout and 70 ns-or-faster timing against the Samsung datasheet before layout changes.
What is the best Samsung equivalent for K6X0808C1D-BF70T from another brand?
Among other manufacturers, 32K x 8 asynchronous SRAMs in 28-pin SOP packages, such as the ISSI IS62C256 series or Alliance AS7C256 series, are the recognized cross-brand equivalents for the K6X0808C1D-BF70T. These parts share the 256 Kbit density, parallel SRAM interface, and 5V operation. However, because no cross-reference was verified in the retrieved web data for this page, engineers must confirm pin-to-pin compatibility and access-time matching against the Samsung K6X0808C1D datasheet before substituting.
What are the key specifications of K6X0808C1D-BF70T that engineers should know?
Engineers should know these K6X0808C1D-BF70T specifications: 256 Kbit asynchronous CMOS SRAM organized 32K x 8; 70 ns access and write cycle time; 4.5V to 5.5V single supply; -40C to +85C industrial operating range; 28-pin SOP surface-mount package; parallel interface with CE, OE, and WE control; TTL-compatible I/O; and fully static operation with no refresh. Source: Samsung K6X0808C1D family datasheet and DigiKey product listing.
Does the K6X0808C1D-BF70T require refresh cycles?
No. The K6X0808C1D-BF70T is a static RAM and requires no refresh, clock, or strobe to retain data while power is applied - only VCC must remain within the operating or retention range. This contrasts with DRAM, which needs periodic refresh. According to the Samsung K6X0808C1D datasheet, fully static operation with low-power CMOS technology is a core feature of the family, simplifying controller design and enabling battery-backed retention.

Engineering reference data for K6X0808C1D-BF70T β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the K6X0808C1D-BF70T when you need 256 Kbit of 5V asynchronous SRAM with a 70 ns timing budget - typical for industrial controllers and legacy 8-bit MCU buses up to roughly 14 MHz zero-wait-state. If your bus is faster or margin-critical, select the K6X0808C1D-BF55 or K6X0808C1D-GF55000 (both 55 ns, same 28-SOP footprint, pin-compatible). If your BOM is supplied in tape-and-reel for automated assembly, the -T suffix variant (this part) is correct; for prototype or hand-assembly quantities, the tube-packaged K6X0808C1D-BF70 suffices. For 3.3V systems, this part is unsuitable - choose a low-voltage SRAM family instead. All same-family Samsung alternatives drop onto the same PCB footprint, so layout reuse is complete; only timing and packaging differ.

Comparison with Alternatives

Parameter This Product K6X0808C1D-BF55 K6X0808C1D-GF55000 K6X0808C1D-BF70
Package 28-SOP 28-SOP - same 28-SOP - same 28-SOP - same
Brand Samsung Electronics Samsung Electronics Samsung Electronics Samsung Electronics
Memory Organization 32K x 8 (256 Kbit) 32K x 8 (256 Kbit) 32K x 8 (256 Kbit) 32K x 8 (256 Kbit)
Access Time 70 ns 55 ns 55 ns 70 ns
Supply Voltage 4.5 V to 5.5 V 4.5 V to 5.5 V 4.5 V to 5.5 V 4.5 V to 5.5 V
Operating Temperature -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Interface / Control Parallel, CE/OE/WE Parallel, CE/OE/WE Parallel, CE/OE/WE Parallel, CE/OE/WE
Packaging Option Tape & Reel (-T) [DATA_NEEDED] [DATA_NEEDED] Tube/Tray

Key Differentiators

  • Balanced speed/cost point in family (vs K6X0808C1D-BF55)
  • Native 5V operation, no level shifting (vs 3.3V SRAM families (e.g., low-voltage 32Kx8 parts))
  • Fully static, zero refresh overhead (vs PSRAM/DRAM alternatives)

Design Notes

Place a 0.1uF ceramic decoupling capacitor within 3 mm of the VCC (pin 28) to VSS (pin 15) pair, plus one bulk 10uF capacitor per eight SRAMs on the memory rail. The 28-SOP lead frame presents moderate lead inductance; short, wide traces on address lines reduce ringing at 70 ns edge rates. Keep the trace lengths of CE, OE, and WE matched to the address bus to avoid skew-induced bus contention during read-to-write transitions.

Estimated: standby current depends on the Samsung datasheet DC characteristics, which were not numerically provided in this page's source data - consult the datasheet table before sizing the battery for retention. For battery-backup designs, hold CE high during power-down and gate WE with a supervisor IC so that no write pulse occurs while VCC crosses the retention threshold. Do not connect this 5V part to a 3.3V rail; input thresholds assume 5V TTL drive levels.

Common failure mode: simultaneous OE and WE assertion causes I/O pins to drive, creating bus contention and possible damage. Ensure controller logic guarantees WE and OE never overlap low. A second pitfall is substituting a 3.3V 32K x 8 SRAM without checking pinout - some 28-pin SRAMs place VCC and VSS differently, so always compare against the Samsung 28-SOP drawing pin-for-pin. Finally, the -70 speed grade means 70 ns, not 7 ns; do not assume zero-wait-state operation on fast buses above roughly 14 MHz.

Compliance Information

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS compliance inferred from marketplace listing of the BF70T (Pb-free suffix convention) and green family variants (GF prefix); verify on Samsung product page. REACH and conflict-minerals status not stated in provided data.

Data verified on: 2026-09-01 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Samsung Electronics Samsung Semiconductor K6X0808C1D-BF70T K6X0808C1D-BF55 K6X0808C1D-GF55000 SRAM static random-access memory asynchronous SRAM 32K x 8 256 Kbit 28-SOP small outline package surface mount CMOS TTL compatible RoHS DigiKey Marketplace parallel memory interface access time battery backup data retention 8051 external memory industrial control voltage regulator chip enable
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