MPC8535ECVTAKGA - PowerQUICC III MPU, 600MHz, 783-FCBGA | NXP
N.º de pieza: MPC8535ECVTAKGA ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $109.4 | $109,40 |
| 10 | $104.1 | $1.041,00 |
| 100 | $96.8 | $9.680,00 |
| 500 | $88.5 | $44.250,00 |
| 1.000 | $81.2 | $81.200,00 |
MPC8535ECVTAKGA Descripción general
PowerQUICC III is the third-generation Power Architecture communications processor family from NXP (formerly Freescale), succeeding PowerQUICC II and combining a high-performance e500 core with on-chip peripherals formerly found in external ASICs. Within the broader system hierarchy it sits between a generic microprocessor (MPU) and a fully integrated network processor, integrating the CPU core, memory controller, DMA engines, security accelerator and multi-protocol peripherals on a single die for deterministic, low-latency packet handling.
Key features include a 32-bit PowerPC e500 core with up to 600 MHz core frequency, an integrated SEC security engine for IPSec, SSL/TLS and bulk encryption, dual Gigabit Ethernet controllers with TCP/IP acceleration, four SerDes lanes configurable for PCI/PCIe and SATA, an enhanced local bus controller, dual I2C, DUART, GPIO and DDR2/DDR3 SDRAM controller with ECC. The 783-FCBGA package provides ample thermal headroom for industrial-temperature operation and exposes all high-speed interfaces without external glue logic.
Typical applications include industrial routers and gateways, secure VPN concentrators, networked storage controllers (NAS/iSCSI), factory-floor control and edge compute platforms, and aerospace/defense communications where the -40C to +105C temperature range and SEC engine are required. The integrated DDR2/3 controller with ECC further supports designs that need error-corrected memory for high-availability systems.
When designing with the MPC8535ECVTAKGA, plan a 6-layer PCB at minimum for DDR3 signal integrity, provide a dedicated 1.0V core supply with tight load-line regulation, and follow NXP hardware specifications document for SerDes reference clock jitter. Bypass capacitors must be placed as close as possible to each supply pin, and unused balls must remain connected per the package layout guide to avoid signal coupling.
This page synthesizes distributor availability, drop-in alternatives drawn from the PowerQUICC III family, and practical hardware-design considerations not consolidated in the original datasheet.
Alternativas directas para MPC8535ECVTAKGA — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8535ECVTAKGA (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Series, Memory Controller, Core Architecture.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8535EBVTAKGA
✅ Sustitución directa✓ En stock
$178.12 / unidad
Ver hoja de datos →MPC8535EVTANGA
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8535ECVTANG
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8535BVTANGA
✅ Sustitución directa✓ En stock
$79.4 / unidad
Ver hoja de datos →MPC8555EVTAPF
✅ Sustitución directa✓ En stock
$218.75 / unidad
Ver hoja de datos →MPC8535ECVTAKGA Valores máximos y características eléctricas
| Core Architecture | PowerPC e500 |
| Family | PowerQUICC III (MPC85xx) |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-bit |
| Maximum Core Frequency | 600 MHz |
| Core Voltage (typ.) | 1.0 V |
| Memory Controller | DDR2 / DDR3 with ECC |
| Peripheral Interfaces | PCI / PCIe, SATA, GbE, SDHC, Local Bus, I2C, UART, GPIO |
| Security Engine | SEC (IPSec / SSL / TLS / bulk crypto) |
| Encapsulado | 783-FCBGA (29x29 mm) |
| Tipo de montaje | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +105C (Extended) |
Guía de configuración de pines de MPC8535ECVTAKGA 783-fcbga (29x29 mm)
Configuración de pines para MPC8535ECVTAKGA (encapsulado 783-fcbga (29x29 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8535ECVTAKGA.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8535ECVTAKGA es adecuado para 6 aplicacións: Industrial Router / Gateway, Secure VPN Concentrator, Networked Storage Controller (NAS/iSCSI), Factory-Floor Edge Compute Platform, Aerospace / Defense Communications, Industrial Print / Imaging Controller.
Industrial Router / Gateway
The MPC8535ECVTAKGA is well suited for industrial-grade routers and protocol gateways because of its dual Gigabit Ethernet MACs, TCP/IP acceleration engine and PCI/PCIe expansion capability. The 600 MHz e500 core handles routing table lookups, NAT and QoS classification at line rate on routed GbE links. The integrated SEC engine secures site-to-site VPN tunnels using IPSec/SSL without burdening the main CPU, while the -40C to +105C temperature range supports outdoor cabinet and factory-floor deployment. The 783-FCBGA package and DDR2/DDR3 controller with ECC further enable long-life industrial designs.
Recomendado
Secure VPN Concentrator
The integrated SEC engine makes the MPC8535ECVTAKGA an efficient host for IPSec and SSL/TLS VPN concentrators servicing multiple remote sites. Hardware-accelerated AES, DES/3DES, SHA and RSA operations offload encryption from the 600 MHz e500 core, allowing the CPU to focus on IKE key exchange and tunnel management. Dual GbE interfaces provide segmented WAN/LAN planes, while ECC-protected DDR2/DDR3 prevents silent memory corruption in always-on security appliances. Extended -40C to +105C operation supports unheated telecom cabinets.
Recomendado
Networked Storage Controller (NAS/iSCSI)
The MPC8535ECVTAKGA's combination of dual GbE, SATA via SerDes, PCI/PCIe expansion and DDR2/DDR3 with ECC supports entry-level NAS and iSCSI storage controllers. The e500 core handles file-system metadata and iSCSI protocol processing while SATA channels connect directly to disk drives without external bridge chips. ECC-protected memory detects and corrects single-bit DRAM errors that would otherwise corrupt stored data in 24/7 operation. The extended temperature grade suits small-office NAS appliances without active cooling.
Recomendado
Factory-Floor Edge Compute Platform
Industrial edge platforms benefit from the MPC8535ECVTAKGA's deterministic e500 core, real-time peripheral mix and -40C to +105C operating range. The integrated local bus controller interfaces to legacy industrial I/O, dual I2C and DUART connect to sensors and HMIs, while GbE uplinks aggregate data to higher-level SCADA systems. The SEC engine secures Modbus/TCP, EtherNet/IP and PROFINET traffic at the edge. The 783-FCBGA package and 1.0 V core supply simplify thermal design in sealed enclosures with limited airflow.
Recomendado
Aerospace / Defense Communications
The MPC8535ECVTAKGA's extended -40C to +105C operating range, integrated SEC engine and high-reliability FCBGA package make it a candidate for aerospace and defense communications subsystems. Hardware-accelerated cryptography supports classified-network encryption requirements, while dual GbE provides redundant data paths for mission-critical links. ECC-protected memory meets reliability targets for airborne and ground-mobile platforms, and the PowerPC architecture has long-standing support in military and aerospace software ecosystems including VxWorks and INTEGRITY.
Recomendado
Industrial Print / Imaging Controller
Industrial multi-function printers and high-speed document imaging systems use the MPC8535ECVTAKGA as an embedded controller thanks to its PCI/PCIe expansion, local bus for image-capture ASICs and dual GbE for network printing. The 600 MHz e500 core handles raster image processing, JPEG/JBIG compression and job queueing in real time. ECC memory prevents single-bit DRAM faults from corrupting large print jobs, and the extended temperature range supports industrial print-shop environments without climate control.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8535ECVTAKGA — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8535EBVTAKGA | MPC8535EVTANGA | MPC8535ECVTANG | MPC8535BVTANGA | MPC8555EVTAPF |
|---|---|---|---|---|---|---|
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same | 783-FCBGA (29x29 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e500, 1 core | PowerPC e500, 1 core | PowerPC e500, 1 core | PowerPC e500, 1 core | PowerPC e500, 1 core | PowerPC e500, 1 core |
| Maximum Core Frequency | 600 MHz | 600 MHz | 600 MHz | 600 MHz | 600 MHz | ~833 MHz |
| Security Engine (SEC) | Yes | Yes | Yes | Yes | Yes | Yes |
| Memory Controller | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC | DDR2 / DDR3 with ECC |
| Operating Temperature | -40C to +105C (Extended) | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C | -40C to +105C (suffix-dependent) |
| Silicon Revision | Original (Rev 1.0) | B-step (later) | Original | Original | B-step | MPC8555 family |
Diferenciadores clave
- Original silicon revision widely available with mature firmware support (frente a MPC8535EBVTAKGA)
- Lower clock-grade variant for cost-sensitive designs (frente a MPC8555EVTAPF)
- Integrated SEC engine for hardware-accelerated cryptography (frente a Non-E variant (no SEC))
Notas de diseño
Use a minimum 6-layer PCB stack-up with dedicated ground and power planes for the MPC8535ECVTAKGA 783-FCBGA breakout. Per NXP hardware specifications, microvia-in-pad or stacked-microvia construction is recommended for reliable BGA fan-out to DDR3, SerDes and core supply rails. Route DDR3 byte lanes with matched lengths within the tolerance listed in the hardware specifications and avoid routing signals across plane splits beneath the BGA shadow.
Estimated: at maximum 600 MHz core activity and 1.0 V VDD_CORE, design core current up to ~3-4 A peak with a switching regulator that meets the load-transient step listed in the hardware specifications. Place 10 uF + 0.1 uF ceramic bypass capacitors within 100 mil of each VDD_CORE / VDD_DDR supply ball cluster, and provide a star-ground return for the SEC and SerDes analog supplies. Keep the 1.0 V regulator's feedback traces short and away from switching edges.
Match SerDes reference clock jitter to the mask in the NXP hardware specifications document; typical requirement is below 1 ps RMS (12 kHz-20 MHz) for PCI/PCIe and SATA links. Use a dedicated clock generator with low-jitter LVDS or HCSL output. Keep SerDes TX/RX pairs length-matched within 5 mil on the breakout layer, and provide a clean reference ground directly under the SerDes lane area to control return-path impedance.
Estimated: at 1.0 V core and full 600 MHz activity, total device power is several watts. Use a thermal via array under the BGA thermal balls connected to an inner copper plane, and consider a small heatsink for sealed enclosures. The -40C to +105C operating range assumes adequate PCB copper for heat spreading - derate clock activity or add airflow if junction temperature approaches the maximum in the hardware specifications.
Do not leave any unused ball floating on the 783-FCBGA - tie per the hardware specifications to avoid antenna effects and crosstalk into active nets. Ensure the JTAG chain is brought out to a header for boundary-scan and code download. Verify DDR3 DRAM ZQ calibration resistor placement at the memory controller reference, and confirm boot ROM configuration (HRCW) settings match the design's boot source before first silicon-up.
Información de cumplimiento
Specific RoHS, REACH and lead-free status for the MPC8535ECVTAKGA were not present in the Verified Web Data excerpts; consult the NXP material declaration or product environmental compliance page for current status.