MPC8535BVTANGA - PowerQUICC III e500 MPU 800MHz FCBGA-783
MPN: MPC8535BVTANGA ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $118.04 | $118.04 |
| 10 | $110.5 | $1,105.00 |
| 100 | $98.2 | $9,820.00 |
| 500 | $88.75 | $44,375.00 |
| 1,000 | $79.4 | $79,400.00 |
MPC8535BVTANGA Overview
What is a PowerQUICC processor? The PowerQUICC family (pronounced 'power-quic') is NXP's line of communications processors that integrate a Power Architecture CPU core with a Communications Processor Module (CPM) and rich high-speed peripheral set on a single die. The architecture sits within the broader taxonomy of integrated circuits: MPU -> microprocessor -> SoC -> communications processor -> embedded networking SoC. PowerQUICC III specifically targets gigabit-class networking equipment where deterministic protocol handling must coexist with general-purpose application processing.
The e500 core delivers 800 MHz of integer performance with a 32-bit Book E instruction set, dual-issue superscalar pipeline, and hardware MMU. The device integrates 256 KB of L2 cache (configurable), DDR2/DDR3 memory controller with ECC support, three Gigabit Ethernet controllers (two SGMII/RGMII plus one RGMII), dual SATA 2.0 ports, USB 2.0 (host/device), three PCI/PCIe controllers, SDHC, I2C, SPI, UARTs, and a local bus controller. Integrated security features include SEC 3.0 crypto acceleration on the MPC8535E variant.
Typical use cases include enterprise routing and switching line cards, industrial control gateways, networked printers, multi-function peripherals, secure access concentrators, factory automation controllers, and military/aerospace embedded systems requiring high I/O bandwidth. The integrated DDR2/DDR3 controller plus multiple gigabit Ethernet MACs make it well suited for line-rate packet processing at the network edge.
When designing with the MPC8535BVTANGA, note that this is the 'non-E' (no SEC crypto engine) variant - choose the MPC8535E for hardware-accelerated IPsec/SSL. The 783-ball FCBGA requires multilayer PCB with microvia stack-ups and matched-impedance routing for the DDR and SERDES interfaces. Power sequencing of the multiple voltage rails (core, DDR, I/O) must follow the datasheet reference design to avoid latch-up.
This page synthesizes distributor pricing, package-level compatibility notes, and design guidance not present in the standalone manufacturer datasheet, helping procurement and hardware teams shorten evaluation cycles for the PowerQUICC III platform.
Drop-in alternatives for MPC8535BVTANGA — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MPC8535BVTANGA (same form factor and footprint) — differing in Operating Temperature, Core Architecture, Package, Memory Controller, Maximum Core Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MPC8535EBVTAKGA
✅ Drop-In✓ In Stock
$178.12 / Unit
View Datasheet →MPC8535ECVTAKGA
✅ Drop-In✓ In Stock
$81.2 / Unit
View Datasheet →MPC8536EAVTANGA
✅ Drop-In✓ In Stock
$84.75 / Unit
View Datasheet →MPC8548EVTAUJB
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →MPC8535BVTANGA Maximum Ratings & Electrical Characteristics
| Series | PowerQUICC III |
| Core Processor | PowerPC e500 |
| Core Architecture | Power Architecture Book E (32-bit) |
| Core Speed | 800 MHz |
| Number of Cores | 1 |
| L2 Cache | 256 KB (configurable) |
| Operating Temperature | 0 C to +105 C |
| Package | 783-ball FCBGA (FC-PBGA), 29 x 29 mm |
| Mounting Type | Surface Mount |
| Memory Controller | DDR2 / DDR3 with ECC support |
| Ethernet | 3x Gigabit (2x SGMII/RGMII + 1x RGMII) |
| SATA | 2x SATA 2.0 |
| PCI / PCIe | 3x PCI / PCIe controllers |
| USB | USB 2.0 (Host + Device) |
| SD / SDHC | Yes (SDHC interface) |
| Security Engine | Not present (use MPC8535E variant) |
| RoHS Status | Compliant |
MPC8535BVTANGA 783-ball fcbga (fc-pbga), 29 x 29 mm Pin Configuration Guide
Pin configuration for MPC8535BVTANGA (783-ball fcbga (fc-pbga), 29 x 29 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MPC8535BVTANGA.
Refer to the datasheet for full pin configuration.
Typical Applications
MPC8535BVTANGA is suitable for 6 applications: Enterprise Routing and Switching Line Cards, Industrial Control and Factory Gateways, Networked Multi-Function Peripherals and Printers, Secure Access Concentrators and VPN Gateways, Embedded Military and Aerospace Computing, Telecom Edge and Access Equipment.
Enterprise Routing and Switching Line Cards
The MPC8535BVTANGA fits enterprise networking line cards because it integrates three Gigabit Ethernet MACs (2x SGMII/RGMII + 1x RGMII) capable of line-rate packet forwarding, plus a high-bandwidth DDR2/DDR3 controller with ECC for routing-table and ACL storage. Its 800 MHz e500 core delivers the control-plane processing needed for routing protocols (OSPF, BGP, MPLS) and management-plane software (SNMP, CLI). Placed on a line card, the device removes the need for an external PHY switch for triple-GE ports; in contrast to a pure ASIC solution, it retains Linux/VxWorks programmability for future feature updates.
Recommended
Industrial Control and Factory Gateways
The MPC8535BVTANGA suits industrial gateways because it combines a deterministic communications processor module with rich peripheral mix: USB 2.0 for local HMI panels, dual SATA for storage, SDHC for boot media, and PCIe for FPGA or coprocessor expansion. The 0 to 105 C operating range covers most industrial enclosure environments. Engineers typically use one of the three Gigabit Ethernet ports for uplink to the factory backbone, one for ring-redundant fieldbus (PROFINET/EtherNet IP), and the RGMII-only port for a service/debug link.
Recommended
Networked Multi-Function Peripherals and Printers
The MPC8535BVTANGA is well suited to high-end networked MFP controllers thanks to its integrated SATA for HDD storage of scan jobs, USB 2.0 host for direct-print walk-up ports, SDHC for firmware/asset cards, and three Gigabit Ethernet ports for redundant office network connections. The 800 MHz e500 core is sufficient for image-processing pipelines and rendering PCL/PostScript jobs without external accelerators. The DDR3 controller feeds burst image data to the print engine over PCIe.
Recommended
Secure Access Concentrators and VPN Gateways
For VPN concentrator designs, the MPC8535BVTANGA handles tunnel management, IKE key exchange orchestration, and packet classification at 800 MHz. While this non-E variant lacks the SEC 3.0 hardware accelerator, software-only IPsec can still sustain multi-hundred-Mbps tunnel throughput for small-to-medium deployments. Designers needing higher aggregate throughput should migrate to the drop-in MPC8535EBVTAKGA variant for hardware IPsec offload. The three Gigabit Ethernet ports support DMZ, WAN, and LAN segment separation without external switching.
Recommended
Embedded Military and Aerospace Computing
The MPC8535BVTANGA's 0 to 105 C commercial temperature grade and Power Architecture Book E core make it a candidate for non-flight-critical military and aerospace subsystems such as ground station routers, mission computer peripherals, and ruggedized data recorders. The integrated DDR2/DDR3 ECC memory controller provides soft-error tolerance for high-altitude deployment, and the multiple high-speed serial interfaces support avionics databus bridging. Conduction-cooled board designs can leverage the FCBGA package's thermal pad to a cold plate.
Recommended
Telecom Edge and Access Equipment
The MPC8535BVTANGA is well matched to DSLAM line cards, GPON/EPON optical line termination controllers, and IP-DSLAM aggregation nodes because it integrates both legacy (PCI for older framers) and modern (PCIe for next-generation PHY chips) expansion buses. Three Gigabit Ethernet ports can be partitioned as uplink to the access switch, downlink to subscriber ports, and OAM management, simplifying board layout. The DDR3 controller with ECC supports large subscriber-line databases for QoS scheduling.
Recommended
Recommended Products Summary
Engineering reference data for MPC8535BVTANGA — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MPC8535EBVTAKGA | MPC8535ECVTAKGA | MPC8536EAVTANGA | MPC8548EVTAUJB |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCBGA (29x29 mm) | 783-FCBGA - same | 783-FCBGA - same | 783-FCBGA - same | 783-FCBGA - same |
| Core Speed | 800 MHz | 800 MHz | 800 MHz (different bin) | 800 MHz | 1.0-1.5 GHz |
| Security Engine (SEC 3.0) | No | Yes | Yes | Yes (E variant) | Yes (E variant) |
| Operating Temperature | 0 to +105 C | -40 to +105 C (extended) | 0 to +105 C | 0 to +105 C | 0 to +105 C |
| Gigabit Ethernet Ports | 3 (2x SGMII/RGMII + 1x RGMII) | 3 | 3 | 3 (higher-speed SERDES) | 4 |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
Key Differentiators
- Integrated three-port Gigabit Ethernet with flexible PHY interfaces (vs MPC8535EBVTAKGA)
- Lower unit cost for non-security embedded networking designs (vs MPC8535EBVTAKGA)
- Drop-in compatible footprint with higher-speed MPC8536 family (vs MPC8536EAVTANGA)
Design Notes
The MPC8535BVTANGA requires multiple voltage rails (core VDD, DDR PLL, SERDES, I/O) that must be sequenced per the NXP reference design. According to NXP hardware design guidelines, all rails should ramp within 200 ms of each other to avoid latch-up; use a multi-rail PMIC such as NXP's PF0200 or a discrete sequencer to enforce monotonic startup.
Estimated: At maximum sustained load on the e500 core at 800 MHz with DDR3 traffic, total package dissipation can approach 5 to 7 W. The 783-FCBGA has a thermal pad that must be soldered to a sufficiently large ground plane with thermal vias (0.3 mm pitch, 0.5 oz copper plating) to keep junction temperature below 105 C in commercial environments.
The 783-FCBGA at 1 mm pitch requires an HDI PCB stack-up with microvias (laser-drilled, 0.1 mm capture pad) and matched-impedance routing for the SERDES (SGMII/SATA/PCIe) and DDR3 interfaces. According to NXP design guides, use 4 mil trace/space for breakout and 8 mil for DDR3 address/command; place decoupling capacitors on the bottom side directly under their respective balls with short vias.
Do not confuse the B (non-E, no SEC 3.0) variant with the E (SEC 3.0) variant when designing for security applications - the part-number prefix after MPC8535 indicates whether the crypto engine is present. Designers must also verify the speed-bin characters; ANGA in the suffix denotes the 800 MHz commercial variant. Boot-mode configuration pins must be pulled to valid logic levels via 4.7 kohm resistors on reset release.
Compliance Information
RoHS compliant per NXP product page. PowerQUICC III devices are designed for industrial and commercial applications; AEC-Q100 automotive qualification is not applicable.
