MX30LF1GE8AB-XKI-TR - 1Gbit 3V SLC NAND Flash, 63-VFBGA | Macronix
N.º de pieza: MX30LF1GE8AB-XKI-TR ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $2.85 | $2,85 |
| 10 | $2.55 | $25,50 |
| 100 | $2.18 | $218,00 |
| 500 | $1.92 | $960,00 |
| 1.000 | $1.74 | $1.740,00 |
MX30LF1GE8AB-XKI-TR Descripción general
A NAND Flash memory is a non-volatile storage technology that retains data without power, using floating-gate transistors arranged in NAND string blocks and pages. It sits in the hierarchy between raw NOR (byte-addressable, fast read) and managed NAND/eMMC (controller-integrated). SLC (Single-Level Cell) NAND stores one bit per cell, giving it the highest endurance and reliability tier in the NAND family - typically 100K P/E cycles per block versus 3K-10K for MLC/TLC - making it preferred for industrial code storage, boot media, and high-write workloads where MLC/TLC would wear out quickly.
The MX30LF1GE8AB family features a 2,112-byte page (2,048 bytes data + 64 bytes spare for bad-block marks and ECC), 64 pages per block, and 1,024 blocks per plane. Program and erase times are 1 ms (typical) page-program and 2 ms block-erase, while page-read cycle time is on the order of 25 ns. ECC handling is left to the host controller, which is why this family is labelled ECC-Free.
Typical applications include industrial embedded systems, networking equipment, set-top boxes, printers, and automotive infotainment where 1 Gbit of non-volatile code or data storage is needed with parallel access. The wide -40C to +85C operating range covers industrial environments, and the small 9x11 mm VFBGA footprint suits space-constrained PCB designs.
When migrating a design to the MX30LF1GE8AB, ensure the host controller supports the longer Device ID and tR random read cycle compared with the legacy MX30LF1G08AA, per Macronix application note AN0366. Add external ECC in the controller firmware, since this part ships ECC-Free.
This page synthesizes distributor pricing, drop-in alternatives in the same 63-VFBGA footprint, and practical design notes not collected in the manufacturer datasheet.
Alternativas directas para MX30LF1GE8AB-XKI-TR — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MX30LF1GE8AB-XKI
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MX30LF2GE8AB-XKI
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MX30LF4GE8AB-XKI
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MX30LF1GE8AB-XKI-TR Valores máximos y características eléctricas
| Tipo de memoria | Non-Volatile NAND Flash (SLC) |
| Density | 1 Gbit (128M x 8) |
| Interfaz | Parallel (asynchronous) |
| Supply Voltage (Vcc) | 2.7 V to 3.6 V |
| Initial Access Time (tR) | 20 ns |
| Page Program Time (typical) | 1 ms |
| Block Erase Time (typical) | 2 ms |
| Page Size | 2,112 bytes (2,048 + 64 spare) |
| Block Size | 64 pages x 2,112 bytes |
| Active Read Current (typical) | 15 mA |
| ONFI Compliance | ONFI 1.0 |
| ECC Support | ECC-Free (host-managed) |
| Temperatura de funcionamiento | -40C to +85C |
| Encapsulado | 63-ball VFBGA (9x11 mm) |
| Tipo de montaje | Surface Mount |
| Data Retention | 10 years (typical, per JLCPCB listing) |
| Estado RoHS | Compliant |
Guía de configuración de pines de MX30LF1GE8AB-XKI-TR 63-ball vfbga (9x11 mm)
Configuración de pines para MX30LF1GE8AB-XKI-TR (encapsulado 63-ball vfbga (9x11 mm)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MX30LF1GE8AB-XKI-TR.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MX30LF1GE8AB-XKI-TR es adecuado para 6 aplicacións: Industrial Embedded Boot Storage, Set-Top Box Firmware Storage, Networking Equipment Data Logging, Automotive Infotainment Storage, Printer Firmware and Font Storage, IoT Edge Device Data Buffer.
Industrial Embedded Boot Storage
The MX30LF1GE8AB-XKI-TR stores boot code and OS images in industrial gateways and PLCs. Its 1 Gbit SLC density holds a full Linux kernel plus rootfs with margin, while 20 ns tR and ONFI 1.0 command set keep host-controller logic simple. The -40C to +85C industrial temperature grade tolerates factory-floor environments, and the 63-VFBGA (9x11 mm) footprint drops directly onto compact CPU modules. Per Macronix datasheet v1.3, the 64-byte spare area per page gives the host room for ECC parity and bad-block markers required for long-life industrial deployments.
Recomendado
Set-Top Box Firmware Storage
The MX30LF1GE8AB-XKI-TR provides 1 Gbit of SLC NAND for set-top box firmware, channel maps, and recording buffers. SLC endurance (100K P/E cycles per block per Macronix) survives daily channel-database rewrites that would wear out MLC/TLC in months. The parallel x8 interface streams at page-read speeds suitable for media playback. The 63-VFBGA package sits within the small footprint of a typical STB mainboard, and 2.7-3.6V supply directly matches the 3.3V system rail typical in consumer AV equipment.
Recomendado
Networking Equipment Data Logging
The MX30LF1GE8AB-XKI-TR serves as non-volatile event and log storage in routers, switches, and base-station controllers. Its 1 Gbit capacity is ample for syslog buffers, crash dumps, and configuration snapshots, while the parallel interface sustains high write throughput during burst logging. ONFI 1.0 compliance ensures broad controller compatibility across network-processor firmware. The wide operating temperature and ECC-Free architecture give OEM firmware teams full control of ECC strategy, important for tamper-resistant logging designs.
Recomendado
Automotive Infotainment Storage
The MX30LF1GE8AB-XKI-TR fits automotive infotainment head units and instrument clusters that need 1 Gbit of reliable code/data storage under -40C to +85C operation. SLC endurance handles frequent navigation-database updates, while parallel NAND bandwidth supports map tile streaming. The 63-VFBGA footprint survives the vibration profiles of in-cabin automotive PCBs. Designers typically pair it with a small SPI NOR for fast-boot rescue images and ECC is implemented in the head-unit SoC firmware.
Recomendado
Printer Firmware and Font Storage
The MX30LF1GE8AB-XKI-TR holds firmware, font tables, and job queues in laser printers and MFPs. The 1 Gbit SLC density accommodates PCL/PostScript interpreters and Asian font sets that drive printer engine code size into the hundreds of megabits. Parallel NAND fits the embedded ASIC controllers commonly used in printer SOCs, and the wide operating temperature handles the elevated ambient inside printer enclosures. Macronix reliability ratings are well matched to the 5-7 year printer service life.
Recomendado
IoT Edge Device Data Buffer
The MX30LF1GE8AB-XKI-TR buffers sensor data in IoT edge gateways before uplink to cloud. Its 1 Gbit SLC capacity holds hours of compressed telemetry, while the 2.7-3.6V supply runs directly from a single Li-ion cell or 3.3V LDO rail. The small 63-VFBGA package suits fanless edge appliances with tight enclosure dimensions. Industrial temperature rating lets the same BOM serve indoor and outdoor edge deployments, simplifying SKU management for IoT product lines.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MX30LF1GE8AB-XKI-TR — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MX30LF1GE8AB-XKI | MX30LF2GE8AB-XKI | MX30LF4GE8AB-XKI |
|---|---|---|---|---|
| Package | 63-VFBGA (9x11 mm) | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same | 63-VFBGA (9x11 mm) - same |
| Brand | Macronix | Macronix | Macronix | Macronix |
| Density | 1 Gbit (128M x 8) | 1 Gbit (128M x 8) | 2 Gbit (256M x 8) | 4 Gbit (512M x 8) |
| Interface | Parallel x8 | Parallel x8 | Parallel x8 | Parallel x8 |
| Supply Voltage | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V | 2.7V to 3.6V |
| ONFI Compliance | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 | ONFI 1.0 |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| ECC Support | ECC-Free (host-managed) | ECC-Free (host-managed) | ECC-Free (host-managed) | ECC-Free (host-managed) |
Diferenciadores clave
- Reel-packaged 63-VFBGA optimized for high-volume SMT lines (frente a MX30LF1GE8AB-XKI (tray version))
- Same 63-VFBGA footprint as higher-density siblings (frente a MX30LF2GE8AB-XKI (2 Gbit))
- Industrial -40C to +85C operating range (frente a MX30LF1GE8AB-XKI (tray))
Notas de diseño
The 63-VFBGA uses a 0.8 mm ball pitch; per Macronix datasheet v1.3, the PCB land pattern must use NSMD (non-solder mask defined) pads with a 0.4 mm solder-mask opening for reliable assembly. Use ENIG surface finish for best co-planarity. Keep all eight CE# / data / control traces length-matched within 50 mils to avoid bus-skew on the parallel interface.
Add 0.1 uF decoupling capacitors close to Vcc balls, plus a 4.7 uF bulk cap on each supply rail. Place a 10K pull-up on R/B# (ready/busy) and on CE# to keep the bus inactive during power-up, per Macronix reference design guidance. Decoupling prevents Vcc droop during page-program and block-erase operations, which can otherwise corrupt writes.
The MX30LF1GE8AB is ECC-Free; the host controller MUST implement software ECC over the 2,048-byte data area plus 64-byte spare area per page. Without ECC, raw NAND bit-error rates will accumulate and silently corrupt firmware. Per Macronix AN0366, also note the longer Device ID and tR vs the legacy MX30LF1G08AA - update boot-loader Device-ID tables accordingly.
Route the 8-bit parallel data bus on the same layer with continuous ground reference; avoid via stubs by using micro-vias in the BGA escape pattern. Keep ALE, CLE, RE#, WE# on the bus layer with matched impedance to the controller. Provide a guard ring tied to ground around the BGA perimeter to suppress noise coupling into the analog Vcc sense pin.
Información de cumplimiento
RoHS compliance per JLCPCB and Macronix product listings. Industrial -40C to +85C temperature grade; not AEC-Q100 qualified for under-hood automotive use.
